JP2008007590A5 - - Google Patents
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- Publication number
- JP2008007590A5 JP2008007590A5 JP2006177937A JP2006177937A JP2008007590A5 JP 2008007590 A5 JP2008007590 A5 JP 2008007590A5 JP 2006177937 A JP2006177937 A JP 2006177937A JP 2006177937 A JP2006177937 A JP 2006177937A JP 2008007590 A5 JP2008007590 A5 JP 2008007590A5
- Authority
- JP
- Japan
- Prior art keywords
- hardening
- curing agent
- range
- sufficiently
- desirable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006177937A JP2008007590A (ja) | 2006-06-28 | 2006-06-28 | 熱伝導性樹脂組成物およびその用途 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006177937A JP2008007590A (ja) | 2006-06-28 | 2006-06-28 | 熱伝導性樹脂組成物およびその用途 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008007590A JP2008007590A (ja) | 2008-01-17 |
| JP2008007590A5 true JP2008007590A5 (enExample) | 2008-08-21 |
Family
ID=39066085
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006177937A Pending JP2008007590A (ja) | 2006-06-28 | 2006-06-28 | 熱伝導性樹脂組成物およびその用途 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008007590A (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5407163B2 (ja) * | 2008-04-02 | 2014-02-05 | 東レ株式会社 | ペースト組成物およびそれを用いた高熱伝導率樹脂組成物 |
| JP5688204B2 (ja) * | 2008-10-16 | 2015-03-25 | 日東シンコー株式会社 | 絶縁シートの製造方法 |
| JP6088731B2 (ja) * | 2011-10-14 | 2017-03-01 | 日東シンコー株式会社 | 放熱用部材、及び半導体モジュールの製造方法 |
| JP6428121B2 (ja) * | 2014-10-03 | 2018-11-28 | 富士電機株式会社 | 溶射用複合粉体材料及び溶射絶縁基板 |
| EP3275956B1 (en) | 2015-03-27 | 2019-07-24 | Toray Industries, Inc. | Adhesive composition sheet, process for producing same, and semiconductor device |
| JP6879690B2 (ja) | 2016-08-05 | 2021-06-02 | スリーエム イノベイティブ プロパティズ カンパニー | 放熱用樹脂組成物、その硬化物、及びこれらの使用方法 |
| JP7358883B2 (ja) * | 2019-09-26 | 2023-10-11 | 日本ゼオン株式会社 | 熱伝導シート |
| CN113960108B (zh) * | 2021-09-24 | 2024-05-28 | 株洲国创轨道科技有限公司 | 一种碳纤维复合材料导热系数和比热容同时测量方法及测量系统 |
| JPWO2024053347A1 (enExample) * | 2022-09-06 | 2024-03-14 | ||
| WO2024143449A1 (ja) * | 2022-12-28 | 2024-07-04 | 株式会社クラレ | 樹脂組成物及び放熱性回路基板用シート |
| TW202535656A (zh) * | 2024-03-12 | 2025-09-16 | 日商拓自達電線股份有限公司 | 熱傳導性膜 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0726032B2 (ja) * | 1987-04-06 | 1995-03-22 | 触媒化成工業株式会社 | 異方導電性膜及びその製造方法 |
| JP2002363410A (ja) * | 2001-06-08 | 2002-12-18 | Ge Toshiba Silicones Co Ltd | エネルギー高伝導性シリコーンゴム組成物 |
| JP3794996B2 (ja) * | 2002-08-13 | 2006-07-12 | 電気化学工業株式会社 | 熱伝導性樹脂組成物及びフェーズチェンジ型放熱部材 |
-
2006
- 2006-06-28 JP JP2006177937A patent/JP2008007590A/ja active Pending
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