JP6809220B2 - 接着組成物シートおよびその製造方法ならびに半導体装置 - Google Patents
接着組成物シートおよびその製造方法ならびに半導体装置 Download PDFInfo
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- JP6809220B2 JP6809220B2 JP2016514768A JP2016514768A JP6809220B2 JP 6809220 B2 JP6809220 B2 JP 6809220B2 JP 2016514768 A JP2016514768 A JP 2016514768A JP 2016514768 A JP2016514768 A JP 2016514768A JP 6809220 B2 JP6809220 B2 JP 6809220B2
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- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 11
- 229910052582 BN Inorganic materials 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 9
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- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 9
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- MQAHXEQUBNDFGI-UHFFFAOYSA-N 5-[4-[2-[4-[(1,3-dioxo-2-benzofuran-5-yl)oxy]phenyl]propan-2-yl]phenoxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC2=CC=C(C=C2)C(C)(C=2C=CC(OC=3C=C4C(=O)OC(=O)C4=CC=3)=CC=2)C)=C1 MQAHXEQUBNDFGI-UHFFFAOYSA-N 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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Description
各実施例、比較例で得られた樹脂組成物シートの硬化物を1cm×1cmに切り出したものを試験片として、厚み方向の熱拡散率(m2/s)をレーザーフラッシュ法熱拡散率測定装置“LFA447”(商品名、ネッチ社製)を用いて測定した。
各実施例、比較例で得られた樹脂組成物シートの硬化物の耐電圧を、耐電圧測定装置“TOS5101”(商品名、菊水電子工業(株)製)を用いて評価した。温度23℃、湿度50%RHにおいて、シートの膜厚方向に0.5kV/秒の昇圧速度で直流電圧を印加して、0.2mA以上の電流が流れたときの電圧を耐電圧とした。5kVまで昇圧しても電流値が0.2mA未満で保たれた場合、耐電圧を5kVとした。
ポリイミドA
乾燥窒素気流下、1,3−ビス(3−アミノフェノキシ)ベンゼン(以下、APB−Nとする)4.82g(0.0165モル)、3,3’−ジアミノ−4,4’−ジヒドロキシジフェニルスルホン(以下、ABPSとする)3.08g(0.011モル)、1,3−ビス(3−アミノプロピル)テトラメチルジシロキサン(以下、SiDAとする)4.97g(0.02モル)、および、末端封止剤としてアニリン0.47g(0.005モル)をN−メチル−2−ピロリドン(以下、NMPとする)130gに溶解させた。ここに2,2−ビス{4−(3,4−ジカルボキシフェノキシ)フェニル}プロパン二無水物(以下、BSAAとする)26.02g(0.05モル)をNMP20gとともに加えて、25℃で1時間反応させ、次いで50℃で4時間撹拌した。その後、180℃でさらに5時間撹拌した。撹拌終了後、溶液を水3Lに投入し、ろ過して沈殿物を回収した。沈殿物を、水で3回洗浄した後、真空乾燥機を用いて80℃で20時間乾燥した。得られたポリマー固体の赤外分光測定をしたところ、1780cm−1付近、1377cm−1付近にポリイミドに起因するイミド構造の吸収ピークが検出された。このようにしてエポキシ基と反応可能な官能基を有し、ポリイミドAを得た。4gのポリイミドAにテトラヒドロフラン6gを加え、23℃で撹拌したところ溶解した。
エピクロン(登録商標)HP−4700(商品名、基本骨格:ナフタレン、DIC(株)製)
jER(登録商標)YL980(商品名、基本骨格:ビスフェノールA、三菱化学(株)製)。
キュアゾール(登録商標)2MAOK(イミダゾール、商品名、四国化成工業(株)製)
キュアゾール(登録商標)2P4MHZ(イミダゾール、商品名、四国化成工業(株)製)
サンエイド(登録商標)SI−200(スルホニウム塩、商品名、三新化学工業(株)製)。
AlNウイスカーA
アルミニウム粉末“TFG−A30P”(東洋アルミニウム(株)製)をプレス成形により厚さ0.5mmの板状の成形体に加工した。次いで、この成形体を150Paの真空雰囲気下で600℃まで昇温し、続いて高純度窒素ガスを用いて0.5MPaの窒素雰囲気下で30分間保持し、反応させた。得られた生成物はウイスカー状であり、X線回折分析装置“D8 ADVANCE”(商品名、ブルカー社製)を用いた測定により、AlNの結晶構造を有することを確認した。AlNウイスカーの長さ方向に垂直な断面における寸法に対する長さ方向の寸法(以下、寸法比とよぶ)は、100倍であった。また、最大粒子径は50μmであった。
カーボンナノチューブA(本荘ケミカル(株)製、CNT−Aと略す、寸法比:400倍、最大粒子径:10μm)
MBN−010T(商品名、鱗片状窒化硼素粒子、三井化学(株)製、寸法比:5倍、最大粒子径:1μm)
XGP(商品名、鱗片状窒化硼素粒子、電気化学工業(株)製、寸法比:10倍、最大粒子径:40μm)
FAN−f05(商品名、球状窒化アルミニウム粒子、古河電子(株)製、寸法比:1倍、最大粒子径:10μm)
FAN−f30(商品名、球状窒化アルミニウム粒子、古河電子(株)製、寸法比:1倍、最大粒子径:40μm)
AE9104−SXE(商品名、球状酸化アルミニウム粒子(株)アドマテックス製、寸法比:1倍、最大粒子径:20μm)
DAW−03DC(商品名、球状酸化アルミニウム粒子、電気化学工業(株)製、寸法比:1倍、最大粒子径:30μm)
スミコランダム(登録商標)AA−1.5(商品名、球状酸化アルミニウム粒子、住友化学(株)製)、寸法比:1倍、最大粒子径:2μm)。
シクロヘキサノン(和光純薬工業(株)製、CHNと略す)。
上記(a)〜(e)各成分を表1のA−1に示す組成比になるように調合し、ボールミルを用いて材料が均一に混合するよう10時間の処理を行った。ボールミルでは直径が5mmのジルコニアボール“YTZボール”(商品名、(株)ニッカトー製)を使用した。ボールミル処理後、篩でジルコニアボールを除去し、層形成用ペーストA−1を得た。同様に表1〜5のA−2〜A−15、B−1〜21に示す組成比で上記作業を行い、層形成用ペーストA−2〜A−15、B−1〜21を作製した。
層形成用ペーストA−1、B−1それぞれを、バーコーターを用いて、剥離性基材である厚さ75μmの離型フィルム“SR−1”(商品名、大槻工業(株)製)上に塗布し、乾燥オーブンで100℃で10分間乾燥を行って、層形成用シートA−1および層形成用シートB−1をそれぞれ作製した。ここで、乾燥後の接着組成物シートの厚みが、表6に示すとおり、層形成用シートA−1は30μm、層形成用シートB−1は80μmとなるように塗布厚みを調節した。
層形成用ペーストの種類、層形成用シートの膜厚を表6〜14に示すとおりにした以外は実施例1と同様にして評価を行った。結果を表6〜14に示す。
実施例1と同様にして、層形成用シートA−1と層形成用シートB−1を作製した。乾燥後の厚みが、層形成用シートA−1は15μm、層形成用シートB−1は80μmとなるように塗布厚みを調節した。層形成用シートA−1は2枚作製した。
層形成用ペーストB−17を、バーコーターを用いて、剥離性基材である厚さ75μmの離型フィルム“SR−1”(商品名、大槻工業(株)製)上に塗布し、乾燥オーブンで100℃で10分間乾燥を行って層形成用シートB−17を作製した。ここで、乾燥後の接着組成物シートの厚みが、表14に示すとおり、層形成用シートB−17が100μmとなるように塗布厚みを調節した。これにより単層構造の接着組成物シートを作製した。
層形成用ペーストの種類、層形成用シートの膜厚を表14に示すとおりにした以外は比較例5と同様にして、評価を行った。結果を表14に示す。
Claims (9)
- 有機化合物および無機粒子を含有する接着組成物シートであって、該接着組成物シートは、少なくとも有機化合物を含有するA層と有機化合物および無機粒子を含有するB層とが積層された構造を含み、A層の有機化合物の含有率がB層の有機化合物の含有率よりも大きく、かつ、前記A層が異方性形状の熱伝導性無機粒子を含有し、該異方性形状の熱伝導性無機粒子がカーボンナノチューブ、窒化硼素ナノチューブ、鱗片状窒化硼素、窒化アルミニウムウイスカー、炭化珪素ウイスカーおよび酸化アルミニウムウイスカーから選ばれる少なくとも1種の無機粒子である半導体装置用接着組成物シート。
- 異方性形状の熱伝導性無機粒子の長さ方向の寸法が、長さ方向に垂直な断面における寸法に対して、4倍以上500倍以下である請求項1に記載の接着組成物シート。
- 前記A層の有機化合物の含有率が60体積%以上99.8体積%以下、前記B層の有機化合物の含有率が1体積%以上40体積%以下である請求項1または2に記載の接着組成物シート。
- 前記A層の無機粒子の含有率が0.2体積%以上40体積%以下である請求項3に記載の接着組成物シート。
- 前記B層が球状の熱伝導性無機粒子を含有する請求項1〜4のいずれかに記載の接着組成物シート。
- 前記B層が球状の熱伝導性無機粒子を含有し、無機粒子の含有率が60体積%以上99体積%以下、有機化合物の含有率が1体積%以上40体積%以下である請求項5に記載の接着組成物シート。
- 前記A層および前記B層が交互に積層された三層以上の層構成を有する請求項1〜6のいずれかに記載の接着組成物シート。
- 請求項1〜7のいずれかに記載の接着組成物シートの硬化物を含む半導体装置。
- 電子部品と放熱体、もしくは、電子部品同士を、接着組成物シートを介して貼り合せる工程、および、前記接着組成物シートを硬化させる工程を含む半導体装置の製造方法であって、該接着組成物シートが、少なくとも有機化合物を含有するA層と有機化合物および無機粒子を含有するB層とを含み、A層の有機化合物の含有率がB層の有機化合物の含有率よりも大きく、かつ、前記A層が異方性形状の熱伝導性無機粒子を含有し、該異方性形状の熱伝導性無機粒子がカーボンナノチューブ、窒化硼素ナノチューブ、鱗片状窒化硼素、窒化アルミニウムウイスカー、炭化珪素ウイスカーおよび酸化アルミニウムウイスカーから選ばれる少なくとも1種の無機粒子である半導体装置の製造方法。
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