SG11201707365YA - Adhesive composition sheet, process for producing same, and semiconductor device - Google Patents

Adhesive composition sheet, process for producing same, and semiconductor device

Info

Publication number
SG11201707365YA
SG11201707365YA SG11201707365YA SG11201707365YA SG11201707365YA SG 11201707365Y A SG11201707365Y A SG 11201707365YA SG 11201707365Y A SG11201707365Y A SG 11201707365YA SG 11201707365Y A SG11201707365Y A SG 11201707365YA SG 11201707365Y A SG11201707365Y A SG 11201707365YA
Authority
SG
Singapore
Prior art keywords
semiconductor device
adhesive composition
producing same
composition sheet
sheet
Prior art date
Application number
SG11201707365YA
Inventor
Yoichi Shinba
Original Assignee
Toray Industries
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toray Industries filed Critical Toray Industries
Publication of SG11201707365YA publication Critical patent/SG11201707365YA/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2479/00—Presence of polyamine or polyimide
    • C09J2479/08—Presence of polyamine or polyimide polyimide

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
SG11201707365YA 2015-03-27 2016-03-09 Adhesive composition sheet, process for producing same, and semiconductor device SG11201707365YA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015066030 2015-03-27
PCT/JP2016/057400 WO2016158268A1 (en) 2015-03-27 2016-03-09 Adhesive composition sheet, process for producing same, and semiconductor device

Publications (1)

Publication Number Publication Date
SG11201707365YA true SG11201707365YA (en) 2017-10-30

Family

ID=57006693

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201707365YA SG11201707365YA (en) 2015-03-27 2016-03-09 Adhesive composition sheet, process for producing same, and semiconductor device

Country Status (8)

Country Link
US (1) US10563095B2 (en)
EP (1) EP3275956B1 (en)
JP (1) JP6809220B2 (en)
KR (1) KR102454630B1 (en)
CN (1) CN107406728B (en)
SG (1) SG11201707365YA (en)
TW (1) TWI683880B (en)
WO (1) WO2016158268A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110366771B (en) * 2018-02-02 2023-01-03 新电元工业株式会社 Semiconductor dopant liquid source, method for manufacturing semiconductor dopant liquid source, and method for manufacturing semiconductor device
JP7221487B2 (en) * 2018-02-14 2023-02-14 積水ポリマテック株式会社 thermally conductive sheet
JP7135364B2 (en) * 2018-03-23 2022-09-13 三菱マテリアル株式会社 INSULATED CIRCUIT BOARD AND METHOD FOR MANUFACTURING INSULATED CIRCUIT BOARD
JP2019172936A (en) * 2018-03-29 2019-10-10 Jnc株式会社 Composition for heat radiation member, heat radiation member, and electronic device
CN115397103A (en) * 2021-05-24 2022-11-25 庆鼎精密电子（淮安）有限公司 Preparation method of circuit board with heat dissipation function
TW202336201A (en) * 2022-01-12 2023-09-16 日商力森諾科股份有限公司 Adhesive composition, adhesive film for circuit connection, and method for manufacturing connection structure

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001315244A (en) * 2000-05-01 2001-11-13 Jsr Corp Heat conductive sheet, method for manufacturing same and radiation structure using heat conductive sheet
US6517744B1 (en) 1999-11-16 2003-02-11 Jsr Corporation Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure
JP4890063B2 (en) 2006-03-20 2012-03-07 新日鐵化学株式会社 Resin composition, varnish obtained using this resin composition, film adhesive and copper foil with film adhesive
JP2008007590A (en) 2006-06-28 2008-01-17 Mitsui Chemicals Inc Heat-conductive resin composition and its application
JP4922220B2 (en) * 2007-12-14 2012-04-25 積水化学工業株式会社 Insulating sheet and laminated structure
CN101796106B (en) * 2007-09-05 2012-10-10 积水化学工业株式会社 Insulating sheet and multilayer structure
JP5353379B2 (en) 2009-03-31 2013-11-27 三菱化学株式会社 Thermosetting resin composition containing anisotropically shaped aluminum nitride filler
JP2011054611A (en) 2009-08-31 2011-03-17 Dainippon Printing Co Ltd Thermally conductive sheet and method of manufacturing the same
JP2011070930A (en) 2009-09-25 2011-04-07 Sekisui Chem Co Ltd Multi-layer insulating sheet, and laminated structure
TW201131716A (en) * 2010-01-29 2011-09-16 Nitto Denko Corp Thermal conductive sheet, light-emitting diode mounting substrate, and thermal conductive adhesive sheet
JP5651344B2 (en) * 2010-02-04 2015-01-14 日東電工株式会社 Thermally conductive double-sided adhesive sheet
JP5516034B2 (en) * 2010-04-30 2014-06-11 日立化成株式会社 Highly insulating heat conductive sheet and heat dissipation device using the same
JP2011241355A (en) * 2010-05-21 2011-12-01 Nitto Denko Corp Adhesive tape
JP5367656B2 (en) * 2010-07-29 2013-12-11 日東電工株式会社 Flip chip type film for semiconductor back surface and use thereof
KR101957532B1 (en) * 2010-12-01 2019-03-12 도레이 카부시키가이샤 Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet
US20130302602A1 (en) * 2011-02-18 2013-11-14 Nitto Denko Corporation Adhesive sheet
JP2012213899A (en) 2011-03-31 2012-11-08 Nippon Steel Chem Co Ltd Heat conductive polyimide-metal substrate
JP2013119595A (en) 2011-12-07 2013-06-17 Nippon Rika Seishi Kk Thermally conductive self-adhesive sheet
JP5837839B2 (en) * 2012-02-08 2015-12-24 積水化学工業株式会社 Laminated structure
KR20140126692A (en) * 2012-02-14 2014-10-31 닛토덴코 가부시키가이샤 Thermoconductive adhesive sheet
KR102030180B1 (en) * 2012-10-04 2019-10-08 도레이첨단소재 주식회사 High efficiency heat transfer adhesive materials and manufacturing thereof
WO2014157520A1 (en) * 2013-03-28 2014-10-02 リンテック株式会社 Protective film formation composite sheet, protective film-equipped chip, and method for fabricating protective film-equipped chip
CN104212368B (en) * 2013-05-31 2019-08-16 日东电工株式会社 Thermal conductivity bonding sheet

Also Published As

Publication number Publication date
EP3275956B1 (en) 2019-07-24
TWI683880B (en) 2020-02-01
EP3275956A4 (en) 2018-08-22
US20180016470A1 (en) 2018-01-18
CN107406728B (en) 2020-12-01
TW201704396A (en) 2017-02-01
JP6809220B2 (en) 2021-01-06
KR20170131475A (en) 2017-11-29
EP3275956A1 (en) 2018-01-31
US10563095B2 (en) 2020-02-18
KR102454630B1 (en) 2022-10-17
WO2016158268A1 (en) 2016-10-06
CN107406728A (en) 2017-11-28
JPWO2016158268A1 (en) 2018-01-18

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