JP2008007590A - 熱伝導性樹脂組成物およびその用途 - Google Patents

熱伝導性樹脂組成物およびその用途 Download PDF

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Publication number
JP2008007590A
JP2008007590A JP2006177937A JP2006177937A JP2008007590A JP 2008007590 A JP2008007590 A JP 2008007590A JP 2006177937 A JP2006177937 A JP 2006177937A JP 2006177937 A JP2006177937 A JP 2006177937A JP 2008007590 A JP2008007590 A JP 2008007590A
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Japan
Prior art keywords
resin
aluminum nitride
sheet
nitride powder
particle size
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JP2006177937A
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English (en)
Japanese (ja)
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JP2008007590A5 (enExample
Inventor
Kenichi Goto
謙一 後藤
Jun Kamata
潤 鎌田
Takeyuki Mitsuishi
健之 光石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Inc
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Mitsui Chemicals Inc
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Filing date
Publication date
Application filed by Mitsui Chemicals Inc filed Critical Mitsui Chemicals Inc
Priority to JP2006177937A priority Critical patent/JP2008007590A/ja
Publication of JP2008007590A publication Critical patent/JP2008007590A/ja
Publication of JP2008007590A5 publication Critical patent/JP2008007590A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2006177937A 2006-06-28 2006-06-28 熱伝導性樹脂組成物およびその用途 Pending JP2008007590A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2006177937A JP2008007590A (ja) 2006-06-28 2006-06-28 熱伝導性樹脂組成物およびその用途

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006177937A JP2008007590A (ja) 2006-06-28 2006-06-28 熱伝導性樹脂組成物およびその用途

Publications (2)

Publication Number Publication Date
JP2008007590A true JP2008007590A (ja) 2008-01-17
JP2008007590A5 JP2008007590A5 (enExample) 2008-08-21

Family

ID=39066085

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JP2006177937A Pending JP2008007590A (ja) 2006-06-28 2006-06-28 熱伝導性樹脂組成物およびその用途

Country Status (1)

Country Link
JP (1) JP2008007590A (enExample)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009249410A (ja) * 2008-04-02 2009-10-29 Toray Ind Inc ペースト組成物およびそれを用いた高熱伝導率樹脂組成物
JP2010094887A (ja) * 2008-10-16 2010-04-30 Nitto Shinko Kk 絶縁シートの製造方法
JP2013089670A (ja) * 2011-10-14 2013-05-13 Nitto Shinko Kk 放熱用部材、及び半導体モジュールの製造方法
JP2016074935A (ja) * 2014-10-03 2016-05-12 富士電機株式会社 溶射用複合粉体材料及び溶射絶縁基板
KR20170131475A (ko) 2015-03-27 2017-11-29 도레이 카부시키가이샤 접착 조성물 시트 및 그의 제조 방법, 및 반도체 장치
JP2021054876A (ja) * 2019-09-26 2021-04-08 日本ゼオン株式会社 熱伝導シート
US11124646B2 (en) 2016-08-05 2021-09-21 3M Innovative Properties Company Heat-dissipating resin composition, cured product thereof, and method of using same
CN113960108A (zh) * 2021-09-24 2022-01-21 株洲国创轨道科技有限公司 一种碳纤维复合材料导热系数和比热容同时测量方法及测量系统
WO2024053347A1 (ja) * 2022-09-06 2024-03-14 東レ株式会社 芳香族ポリアミドおよび／または芳香族ポリアミドイミドを含む組成物、溶液、成形体、フィルム、回折光学素子、画像表示装置、回路基板、磁気記録媒体、製造方法
WO2024143449A1 (ja) * 2022-12-28 2024-07-04 株式会社クラレ 樹脂組成物及び放熱性回路基板用シート
WO2025192517A1 (ja) * 2024-03-12 2025-09-18 タツタ電線株式会社 熱伝導性フィルム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251470A (ja) * 1987-04-06 1988-10-18 Catalysts & Chem Ind Co Ltd 異方導電性膜及びその製造方法
JP2002363410A (ja) * 2001-06-08 2002-12-18 Ge Toshiba Silicones Co Ltd エネルギー高伝導性シリコーンゴム組成物
JP2004075760A (ja) * 2002-08-13 2004-03-11 Denki Kagaku Kogyo Kk 熱伝導性樹脂組成物及びフェーズチェンジ型放熱部材

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251470A (ja) * 1987-04-06 1988-10-18 Catalysts & Chem Ind Co Ltd 異方導電性膜及びその製造方法
JP2002363410A (ja) * 2001-06-08 2002-12-18 Ge Toshiba Silicones Co Ltd エネルギー高伝導性シリコーンゴム組成物
JP2004075760A (ja) * 2002-08-13 2004-03-11 Denki Kagaku Kogyo Kk 熱伝導性樹脂組成物及びフェーズチェンジ型放熱部材

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009249410A (ja) * 2008-04-02 2009-10-29 Toray Ind Inc ペースト組成物およびそれを用いた高熱伝導率樹脂組成物
JP2010094887A (ja) * 2008-10-16 2010-04-30 Nitto Shinko Kk 絶縁シートの製造方法
JP2013089670A (ja) * 2011-10-14 2013-05-13 Nitto Shinko Kk 放熱用部材、及び半導体モジュールの製造方法
JP2016074935A (ja) * 2014-10-03 2016-05-12 富士電機株式会社 溶射用複合粉体材料及び溶射絶縁基板
KR20170131475A (ko) 2015-03-27 2017-11-29 도레이 카부시키가이샤 접착 조성물 시트 및 그의 제조 방법, 및 반도체 장치
US10563095B2 (en) 2015-03-27 2020-02-18 Toray Industries, Inc. Adhesive composition sheet, method of producing same, and semiconductor device
US11124646B2 (en) 2016-08-05 2021-09-21 3M Innovative Properties Company Heat-dissipating resin composition, cured product thereof, and method of using same
JP7509293B2 (ja) 2019-09-26 2024-07-02 日本ゼオン株式会社 熱伝導シート
JP2021054876A (ja) * 2019-09-26 2021-04-08 日本ゼオン株式会社 熱伝導シート
JP7358883B2 (ja) 2019-09-26 2023-10-11 日本ゼオン株式会社 熱伝導シート
JP2023171393A (ja) * 2019-09-26 2023-12-01 日本ゼオン株式会社 熱伝導シート
CN113960108A (zh) * 2021-09-24 2022-01-21 株洲国创轨道科技有限公司 一种碳纤维复合材料导热系数和比热容同时测量方法及测量系统
CN113960108B (zh) * 2021-09-24 2024-05-28 株洲国创轨道科技有限公司 一种碳纤维复合材料导热系数和比热容同时测量方法及测量系统
WO2024053347A1 (ja) * 2022-09-06 2024-03-14 東レ株式会社 芳香族ポリアミドおよび／または芳香族ポリアミドイミドを含む組成物、溶液、成形体、フィルム、回折光学素子、画像表示装置、回路基板、磁気記録媒体、製造方法
WO2024143449A1 (ja) * 2022-12-28 2024-07-04 株式会社クラレ 樹脂組成物及び放熱性回路基板用シート
WO2025192517A1 (ja) * 2024-03-12 2025-09-18 タツタ電線株式会社 熱伝導性フィルム

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