JP2008277421A5 - - Google Patents

Download PDF

Info

Publication number
JP2008277421A5
JP2008277421A5 JP2007117126A JP2007117126A JP2008277421A5 JP 2008277421 A5 JP2008277421 A5 JP 2008277421A5 JP 2007117126 A JP2007117126 A JP 2007117126A JP 2007117126 A JP2007117126 A JP 2007117126A JP 2008277421 A5 JP2008277421 A5 JP 2008277421A5
Authority
JP
Japan
Prior art keywords
molecular weight
parts
weight
organopolysiloxane
sea
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2007117126A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008277421A (ja
JP4975514B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007117126A priority Critical patent/JP4975514B2/ja
Priority claimed from JP2007117126A external-priority patent/JP4975514B2/ja
Priority to US12/081,992 priority patent/US7901992B2/en
Publication of JP2008277421A publication Critical patent/JP2008277421A/ja
Publication of JP2008277421A5 publication Critical patent/JP2008277421A5/ja
Application granted granted Critical
Publication of JP4975514B2 publication Critical patent/JP4975514B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2007117126A 2007-04-26 2007-04-26 ダイボンド剤及びこれを用いてなる半導体装置 Active JP4975514B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007117126A JP4975514B2 (ja) 2007-04-26 2007-04-26 ダイボンド剤及びこれを用いてなる半導体装置
US12/081,992 US7901992B2 (en) 2007-04-26 2008-04-24 Die bonding agent and a semiconductor device made by using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007117126A JP4975514B2 (ja) 2007-04-26 2007-04-26 ダイボンド剤及びこれを用いてなる半導体装置

Publications (3)

Publication Number Publication Date
JP2008277421A JP2008277421A (ja) 2008-11-13
JP2008277421A5 true JP2008277421A5 (enExample) 2009-02-19
JP4975514B2 JP4975514B2 (ja) 2012-07-11

Family

ID=39885967

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007117126A Active JP4975514B2 (ja) 2007-04-26 2007-04-26 ダイボンド剤及びこれを用いてなる半導体装置

Country Status (2)

Country Link
US (1) US7901992B2 (enExample)
JP (1) JP4975514B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012060020A (ja) * 2010-09-10 2012-03-22 Sekisui Chem Co Ltd 半導体チップ実装体の製造方法及び半導体装置
JP2016219619A (ja) * 2015-05-21 2016-12-22 日東電工株式会社 接着シート、ダイシングテープ一体型接着シート、フィルム、半導体装置の製造方法および半導体装置
DE102016114463B4 (de) 2016-08-04 2019-10-17 Infineon Technologies Ag Die-befestigungsverfahren und halbleiterbauelemente, die auf der grundlage solcher verfahren hergestellt werden
US10957672B2 (en) * 2017-11-13 2021-03-23 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of manufacturing the same
TW202513639A (zh) * 2023-09-26 2025-04-01 日商納美仕股份有限公司 樹脂組成物、硬化物及光纖陣列

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU3975793A (en) * 1992-04-03 1993-11-08 Thermoset Plastics, Inc. Conductor-filled thermosetting resin
US5889332A (en) * 1997-02-21 1999-03-30 Hewlett-Packard Company Area matched package
MY124687A (en) 1998-05-20 2006-06-30 Hitachi Chemical Co Ltd Insulating adhesive for electronic parts, and lead frame and semiconductor device using the same
JP3844936B2 (ja) * 1999-03-26 2006-11-15 富士通株式会社 半導体装置
JP2002284889A (ja) * 2001-03-28 2002-10-03 Sumitomo Bakelite Co Ltd 半導体用樹脂ペーストの製造方法、半導体用樹脂ペースト及び半導体装置
JP2004099636A (ja) * 2002-09-04 2004-04-02 Kyocera Chemical Corp 絶縁ペースト
MY138566A (en) 2004-03-15 2009-06-30 Hitachi Chemical Co Ltd Dicing/die bonding sheet
JP4934284B2 (ja) 2004-03-15 2012-05-16 日立化成工業株式会社 ダイシングダイボンドシート
JP2006005159A (ja) 2004-06-17 2006-01-05 Shin Etsu Chem Co Ltd ダイシング・ダイボンド用接着テープ
CN101323769B (zh) * 2004-06-18 2011-04-13 日立化成工业株式会社 晶片接合用树脂胶
JP4816876B2 (ja) * 2004-06-18 2011-11-16 日立化成工業株式会社 ダイボンディング用樹脂ペーストおよび半導体装置の製造方法

Similar Documents

Publication Publication Date Title
JP2006525412A5 (enExample)
WO2007016617A3 (en) Silicone compositions, methods of manufacture, and articles formed therefrom
JP2008277421A5 (enExample)
MY148272A (en) Curable silicone composition
CA2798661A1 (en) Improvements in or relating to structural adhesives
RU2013119741A (ru) Композиция эпоксидной смолы, препрег и армированные волокнами композитные материалы
TW200624530A (en) Amphiphilic block copolymer-modified epoxy resins and adhesives made therefrom
JP2010163566A5 (enExample)
EP2033985A3 (en) Heat-curable polyimide silicone resin composition
JP2005533886A5 (enExample)
JP2010501670A5 (enExample)
JP2005529870A5 (enExample)
TW200624500A (en) Amphiphilic block copolymer-toughened epoxy resins and electrical laminates made therefrom
MY154552A (en) Resin composition, prepreg, laminate, and wiring board
JP2010100834A5 (enExample)
JP2009161588A5 (enExample)
JP2009545009A5 (enExample)
JP2011512271A5 (enExample)
JP2011506689A5 (enExample)
JP2010285602A5 (enExample)
ATE497516T1 (de) Nanoporöse polymerschaumstoffe aus polykondensations-reaktivharzen
JP2005306967A5 (enExample)
JP2007121346A5 (enExample)
JP2007291236A5 (enExample)
JP2008007590A5 (enExample)