JP2010163566A5 - - Google Patents
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- Publication number
- JP2010163566A5 JP2010163566A5 JP2009008198A JP2009008198A JP2010163566A5 JP 2010163566 A5 JP2010163566 A5 JP 2010163566A5 JP 2009008198 A JP2009008198 A JP 2009008198A JP 2009008198 A JP2009008198 A JP 2009008198A JP 2010163566 A5 JP2010163566 A5 JP 2010163566A5
- Authority
- JP
- Japan
- Prior art keywords
- compound
- resin composition
- epoxy
- epoxy resin
- polyvalent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 150000001875 compounds Chemical class 0.000 claims 7
- 239000004593 Epoxy Substances 0.000 claims 5
- 239000003822 epoxy resin Substances 0.000 claims 5
- 239000000203 mixture Substances 0.000 claims 5
- 229920000647 polyepoxide Polymers 0.000 claims 5
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- -1 oxetane compound Chemical class 0.000 claims 1
- 229920005862 polyol Polymers 0.000 claims 1
- 150000003077 polyols Chemical class 0.000 claims 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009008198A JP2010163566A (ja) | 2009-01-16 | 2009-01-16 | エポキシ樹脂組成物 |
| PCT/US2010/020864 WO2010083192A2 (en) | 2009-01-16 | 2010-01-13 | Epoxy resin composition |
| CN2010800047262A CN102282210A (zh) | 2009-01-16 | 2010-01-13 | 环氧树脂组合物 |
| US13/144,368 US20110282010A1 (en) | 2009-01-16 | 2010-01-13 | Epoxy resin composition |
| EP10732021A EP2387596A2 (en) | 2009-01-16 | 2010-01-13 | Epoxy resin composition |
| KR1020117018680A KR20110114645A (ko) | 2009-01-16 | 2010-01-13 | 에폭시 수지 조성물 |
| TW099101134A TW201031706A (en) | 2009-01-16 | 2010-01-15 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009008198A JP2010163566A (ja) | 2009-01-16 | 2009-01-16 | エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2010163566A JP2010163566A (ja) | 2010-07-29 |
| JP2010163566A5 true JP2010163566A5 (enExample) | 2012-03-01 |
Family
ID=42340275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009008198A Pending JP2010163566A (ja) | 2009-01-16 | 2009-01-16 | エポキシ樹脂組成物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20110282010A1 (enExample) |
| EP (1) | EP2387596A2 (enExample) |
| JP (1) | JP2010163566A (enExample) |
| KR (1) | KR20110114645A (enExample) |
| CN (1) | CN102282210A (enExample) |
| TW (1) | TW201031706A (enExample) |
| WO (1) | WO2010083192A2 (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8530578B2 (en) | 2009-11-19 | 2013-09-10 | 3M Innovative Properties Company | Pressure sensitive adhesive comprising blend of synthetic rubber and functionalized synthetic rubber bonded to an acrylic polymer |
| US8992720B2 (en) | 2009-11-19 | 2015-03-31 | 3M Innovative Properties Company | Pressure sensitive adhesive comprising functionalized polyisobutylene hydrogen bonded to acylic polymer |
| JP5479248B2 (ja) * | 2010-07-06 | 2014-04-23 | 積水化学工業株式会社 | 光学デバイス用封止剤 |
| KR101909760B1 (ko) | 2010-11-16 | 2018-10-18 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | Ｕｖ 경화성 무수물-개질 폴리(아이소부틸렌) |
| US8663407B2 (en) | 2010-11-17 | 2014-03-04 | 3M Innovative Properties Company | Isobutylene (Co)polymeric adhesive composition |
| US8629209B2 (en) | 2010-12-02 | 2014-01-14 | 3M Innovative Properties Company | Moisture curable isobutylene adhesive copolymers |
| JP5354753B2 (ja) * | 2011-01-13 | 2013-11-27 | 信越化学工業株式会社 | アンダーフィル材及び半導体装置 |
| JP2013021119A (ja) * | 2011-07-11 | 2013-01-31 | Shin Etsu Chem Co Ltd | ウエハーレベルアンダーフィル剤組成物、これを用いた半導体装置及びその製造方法 |
| JP5919574B2 (ja) * | 2011-10-24 | 2016-05-18 | パナソニックＩｐマネジメント株式会社 | Ｕｖ硬化性樹脂組成物、光学部品用接着剤及び有機ｅｌ素子用封止材 |
| WO2013147989A1 (en) | 2012-03-29 | 2013-10-03 | 3M Innovative Properties Company | Adhesives comprising poly(isobutylene) copolymers comprising pendent free-radically polymerizable quaternary ammonium substituent |
| US9422464B2 (en) | 2012-05-11 | 2016-08-23 | 3M Innovative Properties Company | Adhesives comprising reaction product of halogenated poly(isobutylene) copolymers and polyamines |
| JP5939388B2 (ja) * | 2012-05-18 | 2016-06-22 | 株式会社スリーボンド | 硬化性樹脂組成物およびプライマー組成物 |
| JPWO2014017524A1 (ja) * | 2012-07-26 | 2016-07-11 | デンカ株式会社 | 樹脂組成物 |
| WO2014028356A1 (en) | 2012-08-14 | 2014-02-20 | 3M Innovative Properties Company | Adhesives comprising grafted isobutylene copolymer |
| KR20140075979A (ko) * | 2012-12-11 | 2014-06-20 | 삼성디스플레이 주식회사 | 액정 표시 장치 |
| US9685597B2 (en) | 2013-05-28 | 2017-06-20 | Daicel Corporation | Curable composition for sealing optical semiconductor |
| JP6418673B2 (ja) * | 2014-03-31 | 2018-11-07 | 日東電工株式会社 | 光学部品用樹脂組成物およびそれを用いた光学部品 |
| JP6418672B2 (ja) * | 2014-03-31 | 2018-11-07 | 日東電工株式会社 | 光学部品用樹脂組成物およびそれを用いた光学部品 |
| JP6448083B2 (ja) * | 2014-11-28 | 2019-01-09 | 協立化学産業株式会社 | 光硬化性樹脂組成物及び高屈折性樹脂硬化体 |
| JP6080064B2 (ja) * | 2016-03-03 | 2017-02-15 | パナソニックＩｐマネジメント株式会社 | Ｕｖ硬化性樹脂組成物、光学部品用接着剤および封止材 |
| US11111417B2 (en) | 2016-05-19 | 2021-09-07 | Sicpa Holding Sa | Adhesives for assembling components of inert material |
| JP2018095679A (ja) * | 2016-12-08 | 2018-06-21 | 三井化学株式会社 | シート状シール材、表示素子シール材、有機ｅｌ素子用面封止材、有機ｅｌデバイス、および有機ｅｌデバイスの製造方法 |
| JP7146282B2 (ja) * | 2016-12-09 | 2022-10-04 | エルジー・ケム・リミテッド | 密封材組成物 |
| JP6953709B2 (ja) * | 2016-12-14 | 2021-10-27 | 味の素株式会社 | 樹脂組成物 |
| JP2019065175A (ja) * | 2017-09-29 | 2019-04-25 | 東京応化工業株式会社 | 硬化性組成物、硬化膜、及び硬化物の製造方法 |
| JP7170246B2 (ja) * | 2018-12-27 | 2022-11-14 | パナソニックＩｐマネジメント株式会社 | 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置 |
| KR102772994B1 (ko) | 2019-01-17 | 2025-02-27 | 덴카 주식회사 | 봉지제, 경화체, 유기 일렉트로 루미네센스 표시 장치 및 장치의 제조 방법 |
| JP7554992B2 (ja) * | 2019-06-10 | 2024-09-24 | パナソニックＩｐマネジメント株式会社 | 紫外線硬化性樹脂組成物、発光装置の製造方法及び発光装置 |
| DE102020203286A1 (de) | 2020-03-13 | 2021-09-16 | 3D Global Holding Gmbh | Lentikularlinsen-Baugruppe zum Anbringen an einer Anzeigefläche |
| JP7724207B2 (ja) | 2020-04-01 | 2025-08-15 | デンカ株式会社 | 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法 |
| JP7547882B2 (ja) * | 2020-09-11 | 2024-09-10 | 味の素株式会社 | 樹脂組成物 |
| TW202334370A (zh) * | 2021-10-19 | 2023-09-01 | 日商積水化學工業股份有限公司 | 密封用樹脂組成物 |
| KR20230102199A (ko) * | 2021-12-30 | 2023-07-07 | 솔루스첨단소재 주식회사 | 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재 |
| KR20230102200A (ko) * | 2021-12-30 | 2023-07-07 | 솔루스첨단소재 주식회사 | 고굴절 고접착성 에폭시 수지 조성물 및 이를 포함하는 봉지재 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993720A (ja) * | 1982-11-22 | 1984-05-30 | Showa Denko Kk | 重合性組成物 |
| JPH06100643A (ja) * | 1992-09-22 | 1994-04-12 | Daiso Co Ltd | 重合性組成物およびそれより得られる高屈折率プラスチックレンズ |
| US6297332B1 (en) * | 1998-04-28 | 2001-10-02 | Mitsui Chemicals, Inc. | Epoxy-resin composition and use thereof |
| JP2002363254A (ja) * | 2001-06-06 | 2002-12-18 | Nippon Kayaku Co Ltd | エポキシ化合物、エポキシ樹脂組成物及びその硬化物 |
| JP5207501B2 (ja) * | 2001-08-10 | 2013-06-12 | 日本化薬株式会社 | 光学材料用エポキシ樹脂組成物及びその硬化物 |
| US6800373B2 (en) * | 2002-10-07 | 2004-10-05 | General Electric Company | Epoxy resin compositions, solid state devices encapsulated therewith and method |
| CN100462385C (zh) * | 2004-03-04 | 2009-02-18 | 东亚合成株式会社 | 紫外线固化型组合物 |
| JP2006083314A (ja) * | 2004-09-17 | 2006-03-30 | Toyo Ink Mfg Co Ltd | 硬化性高屈折率材料及び該硬化性高屈折率材料を用いてなる積層体 |
| JPWO2006077862A1 (ja) * | 2005-01-24 | 2008-06-19 | 出光興産株式会社 | エポキシ樹脂組成物及びそれを用いた光学材料 |
| KR100834351B1 (ko) * | 2006-11-24 | 2008-06-02 | 제일모직주식회사 | 멀티칩 패키지 밀봉용 에폭시 수지 조성물 및 이를이용한 멀티칩 패키지 |
| EP2236539B1 (en) * | 2008-01-25 | 2014-12-03 | Mitsui Chemicals, Inc. | Polymerizable epoxy composition, and sealing material composition comprising the same |
| JP5102671B2 (ja) * | 2008-03-25 | 2012-12-19 | 株式会社日本触媒 | 硬化性樹脂組成物、その硬化物、光学部材及び光学ユニット |
| WO2009119598A1 (ja) * | 2008-03-25 | 2009-10-01 | 住友ベークライト株式会社 | エポキシ樹脂組成物、樹脂シート、プリプレグ、多層プリント配線板および半導体装置 |
-
2009
- 2009-01-16 JP JP2009008198A patent/JP2010163566A/ja active Pending
-
2010
- 2010-01-13 US US13/144,368 patent/US20110282010A1/en not_active Abandoned
- 2010-01-13 EP EP10732021A patent/EP2387596A2/en not_active Withdrawn
- 2010-01-13 WO PCT/US2010/020864 patent/WO2010083192A2/en not_active Ceased
- 2010-01-13 CN CN2010800047262A patent/CN102282210A/zh active Pending
- 2010-01-13 KR KR1020117018680A patent/KR20110114645A/ko not_active Withdrawn
- 2010-01-15 TW TW099101134A patent/TW201031706A/zh unknown