JP2002363253A5 - - Google Patents

Download PDF

Info

Publication number
JP2002363253A5
JP2002363253A5 JP2001176873A JP2001176873A JP2002363253A5 JP 2002363253 A5 JP2002363253 A5 JP 2002363253A5 JP 2001176873 A JP2001176873 A JP 2001176873A JP 2001176873 A JP2001176873 A JP 2001176873A JP 2002363253 A5 JP2002363253 A5 JP 2002363253A5
Authority
JP
Japan
Prior art keywords
weight
water absorption
epoxy resin
low water
aromatic diamine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001176873A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002363253A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001176873A priority Critical patent/JP2002363253A/ja
Priority claimed from JP2001176873A external-priority patent/JP2002363253A/ja
Publication of JP2002363253A publication Critical patent/JP2002363253A/ja
Publication of JP2002363253A5 publication Critical patent/JP2002363253A5/ja
Pending legal-status Critical Current

Links

JP2001176873A 2001-06-12 2001-06-12 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料 Pending JP2002363253A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001176873A JP2002363253A (ja) 2001-06-12 2001-06-12 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001176873A JP2002363253A (ja) 2001-06-12 2001-06-12 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

Publications (2)

Publication Number Publication Date
JP2002363253A JP2002363253A (ja) 2002-12-18
JP2002363253A5 true JP2002363253A5 (enExample) 2008-07-24

Family

ID=19017802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001176873A Pending JP2002363253A (ja) 2001-06-12 2001-06-12 エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料

Country Status (1)

Country Link
JP (1) JP2002363253A (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003026768A (ja) * 2001-07-13 2003-01-29 Toray Ind Inc エポキシ樹脂組成物、プリプレグおよび繊維強化複合材料
KR100696880B1 (ko) 2005-12-30 2007-03-20 제일모직주식회사 반도체 소자 밀봉용 에폭시 수지 조성물
JP5042078B2 (ja) * 2008-03-13 2012-10-03 日本化薬株式会社 エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2009280669A (ja) * 2008-05-21 2009-12-03 Toray Ind Inc Rtm成形繊維強化複合材料、およびその製造方法
EP2551288B1 (en) 2010-03-23 2016-06-01 Toray Industries, Inc. Epoxy resin composition for use in a carbon-fiber-reinforced composite material, prepreg, and carbon-fiber-reinforced composite material
CN103380161B (zh) 2011-02-16 2016-04-20 三菱丽阳株式会社 获得纤维强化复合材料的制造方法及其所使用的环氧树脂组合物
WO2014017340A1 (ja) 2012-07-25 2014-01-30 東レ株式会社 プリプレグおよび炭素繊維強化複合材料
KR102081662B1 (ko) 2013-01-15 2020-02-27 도레이 카부시키가이샤 에폭시 수지 조성물, 프리프레그 및 탄소 섬유 강화 복합 재료
KR20160030208A (ko) 2013-07-11 2016-03-16 도레이 카부시키가이샤 에폭시 수지 조성물, 프리프레그 및 탄소 섬유 강화 복합 재료
JP6523859B2 (ja) 2014-08-28 2019-06-05 帝人株式会社 切断体の製造方法、及び繊維強化樹脂の切断方法
EP3272781B1 (en) 2015-03-17 2019-08-21 Toray Industries, Inc. Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material
WO2017038880A1 (ja) 2015-09-03 2017-03-09 東レ株式会社 エポキシ樹脂組成物、プリプレグおよび炭素繊維強化複合材料
EP3613788B1 (en) 2017-03-22 2022-03-30 Toray Industries, Inc. Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material
JP2023056441A (ja) * 2021-10-07 2023-04-19 帝人株式会社 エポキシ樹脂組成物、プリプレグ、繊維強化複合材料及びその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS606722A (ja) * 1984-04-11 1985-01-14 Toray Ind Inc 炭素繊維プリプレグ用エポキシ樹脂組成物
JPH0778138B2 (ja) * 1985-12-16 1995-08-23 東レ株式会社 繊維強化プリプレグ用樹脂組成物
JPS6377926A (ja) * 1986-09-20 1988-04-08 Toho Rayon Co Ltd エポキシ樹脂組成物
WO1997024398A1 (en) * 1995-12-27 1997-07-10 Hexcel Corporation Epoxy resin(s) with curing agent and toughener
JP2001072783A (ja) * 1999-09-08 2001-03-21 Toray Ind Inc プリプレグの製造方法

Similar Documents

Publication Publication Date Title
JP2002363253A5 (enExample)
ATE352576T1 (de) Epoxidharz klebstoffzusammensetzung
WO2003076528A3 (en) Photocurable resin composition and optical component
ATE404636T1 (de) Wärmeleitfähige silikonkautschukzusammensetzung
DE60127660D1 (de) Epoxyharzzusammensetzung und prepreg hergestellt aus dieser zusammensetzung
JP2006526563A5 (enExample)
JP2007528923A5 (enExample)
RU2000111946A (ru) Адгезивный состав
DE60214093D1 (de) Epoxidharzzusammensetzung, daraus hergestellter gehärteter Gegenstand, neues Epoxidharz, neue Phenolverbindung, und Verfahren zu deren Herstellung
ATE505498T1 (de) Verfahren zur herstellung von epoxid- härtungsmitteln auf wasserbasis
EA200700657A1 (ru) Композиция покрытия на основе отверждения тиол-nco
JP2005533886A5 (enExample)
DE602006019260D1 (de) M polyurethan
DE602007006345D1 (de) Härtbare silikonzusammensetzung und elektronikbauteil
JP2003026768A5 (enExample)
ATE362748T1 (de) Dentalmasse
DE60321916D1 (de) Komprimierte harz-moderierte kaugummi
MY143212A (en) Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resin
TW200613356A (en) Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same
ATE409712T1 (de) Epoxidharz zusammensetzung
TWI369368B (en) Epoxy resin, epoxy resin composition and cured object thereof
EP1698651A4 (en) POLYAMINIC ACID RESIN WITH AN UNSATURATED GROUP, LIGHT-SENSITIVE RESIN COMPOSITION THEREBY AND CURED PRODUCT THEREOF
TW200500412A (en) Resin composition for encapsulating semiconductor chip and semiconductor device therewith
TW200519135A (en) Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
TW200732366A (en) Thermosetting resin composition