JP2015521800A5 - - Google Patents

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Publication number
JP2015521800A5
JP2015521800A5 JP2015518590A JP2015518590A JP2015521800A5 JP 2015521800 A5 JP2015521800 A5 JP 2015521800A5 JP 2015518590 A JP2015518590 A JP 2015518590A JP 2015518590 A JP2015518590 A JP 2015518590A JP 2015521800 A5 JP2015521800 A5 JP 2015521800A5
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JP
Japan
Prior art keywords
mol
metal layer
imaged metal
circuit board
coverlay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015518590A
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English (en)
Japanese (ja)
Other versions
JP6258931B2 (ja
JP2015521800A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/046941 external-priority patent/WO2013192474A1/en
Publication of JP2015521800A publication Critical patent/JP2015521800A/ja
Publication of JP2015521800A5 publication Critical patent/JP2015521800A5/ja
Application granted granted Critical
Publication of JP6258931B2 publication Critical patent/JP6258931B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015518590A 2012-06-22 2013-06-21 回路基板 Expired - Fee Related JP6258931B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US201261663280P 2012-06-22 2012-06-22
US201261663258P 2012-06-22 2012-06-22
US201261663291P 2012-06-22 2012-06-22
US201261663254P 2012-06-22 2012-06-22
US201261663270P 2012-06-22 2012-06-22
US61/663,270 2012-06-22
US61/663,280 2012-06-22
US61/663,258 2012-06-22
US61/663,254 2012-06-22
US61/663,291 2012-06-22
PCT/US2013/046941 WO2013192474A1 (en) 2012-06-22 2013-06-21 Circuit board

Publications (3)

Publication Number Publication Date
JP2015521800A JP2015521800A (ja) 2015-07-30
JP2015521800A5 true JP2015521800A5 (https=) 2016-06-16
JP6258931B2 JP6258931B2 (ja) 2018-01-10

Family

ID=48746133

Family Applications (8)

Application Number Title Priority Date Filing Date
JP2015518584A Pending JP2015528204A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518588A Expired - Fee Related JP6100892B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518587A Pending JP2015523730A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518586A Expired - Fee Related JP6105724B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518589A Expired - Fee Related JP6258930B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518585A Expired - Fee Related JP6139676B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518592A Expired - Fee Related JP6114387B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518590A Expired - Fee Related JP6258931B2 (ja) 2012-06-22 2013-06-21 回路基板

Family Applications Before (7)

Application Number Title Priority Date Filing Date
JP2015518584A Pending JP2015528204A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518588A Expired - Fee Related JP6100892B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518587A Pending JP2015523730A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518586A Expired - Fee Related JP6105724B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518589A Expired - Fee Related JP6258930B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518585A Expired - Fee Related JP6139676B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518592A Expired - Fee Related JP6114387B2 (ja) 2012-06-22 2013-06-21 回路基板

Country Status (5)

Country Link
US (8) US20150147567A1 (https=)
EP (8) EP2865249A1 (https=)
JP (8) JP2015528204A (https=)
CN (8) CN104584696B (https=)
WO (6) WO2013192467A1 (https=)

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CN115427229A (zh) * 2020-05-29 2022-12-02 东洋纺株式会社 含透明高耐热膜的层叠体
JP7837183B2 (ja) * 2021-03-31 2026-03-30 日鉄ケミカル＆マテリアル株式会社 ボンドプライ、これを用いる回路基板及びストリップライン
US12441084B2 (en) 2021-10-20 2025-10-14 Unison Industries, Llc Thermal insulation system
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