JP2015529966A5 - - Google Patents

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Publication number
JP2015529966A5
JP2015529966A5 JP2015518585A JP2015518585A JP2015529966A5 JP 2015529966 A5 JP2015529966 A5 JP 2015529966A5 JP 2015518585 A JP2015518585 A JP 2015518585A JP 2015518585 A JP2015518585 A JP 2015518585A JP 2015529966 A5 JP2015529966 A5 JP 2015529966A5
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JP
Japan
Prior art keywords
metal layer
mol
imaged metal
circuit board
insulating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015518585A
Other languages
English (en)
Japanese (ja)
Other versions
JP2015529966A (ja
JP6139676B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/046934 external-priority patent/WO2013192468A1/en
Publication of JP2015529966A publication Critical patent/JP2015529966A/ja
Publication of JP2015529966A5 publication Critical patent/JP2015529966A5/ja
Application granted granted Critical
Publication of JP6139676B2 publication Critical patent/JP6139676B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2015518585A 2012-06-22 2013-06-21 回路基板 Expired - Fee Related JP6139676B2 (ja)

Applications Claiming Priority (11)

Application Number Priority Date Filing Date Title
US201261663280P 2012-06-22 2012-06-22
US201261663258P 2012-06-22 2012-06-22
US201261663291P 2012-06-22 2012-06-22
US201261663254P 2012-06-22 2012-06-22
US201261663270P 2012-06-22 2012-06-22
US61/663,270 2012-06-22
US61/663,280 2012-06-22
US61/663,258 2012-06-22
US61/663,254 2012-06-22
US61/663,291 2012-06-22
PCT/US2013/046934 WO2013192468A1 (en) 2012-06-22 2013-06-21 Circuit board

Publications (3)

Publication Number Publication Date
JP2015529966A JP2015529966A (ja) 2015-10-08
JP2015529966A5 true JP2015529966A5 (https=) 2016-07-14
JP6139676B2 JP6139676B2 (ja) 2017-05-31

Family

ID=48746133

Family Applications (8)

Application Number Title Priority Date Filing Date
JP2015518584A Pending JP2015528204A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518588A Expired - Fee Related JP6100892B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518587A Pending JP2015523730A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518586A Expired - Fee Related JP6105724B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518589A Expired - Fee Related JP6258930B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518585A Expired - Fee Related JP6139676B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518592A Expired - Fee Related JP6114387B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518590A Expired - Fee Related JP6258931B2 (ja) 2012-06-22 2013-06-21 回路基板

Family Applications Before (5)

Application Number Title Priority Date Filing Date
JP2015518584A Pending JP2015528204A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518588A Expired - Fee Related JP6100892B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518587A Pending JP2015523730A (ja) 2012-06-22 2013-06-21 回路基板
JP2015518586A Expired - Fee Related JP6105724B2 (ja) 2012-06-22 2013-06-21 ポリイミド金属張積層体
JP2015518589A Expired - Fee Related JP6258930B2 (ja) 2012-06-22 2013-06-21 回路基板

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2015518592A Expired - Fee Related JP6114387B2 (ja) 2012-06-22 2013-06-21 回路基板
JP2015518590A Expired - Fee Related JP6258931B2 (ja) 2012-06-22 2013-06-21 回路基板

Country Status (5)

Country Link
US (8) US20150147567A1 (https=)
EP (8) EP2865249A1 (https=)
JP (8) JP2015528204A (https=)
CN (8) CN104584696B (https=)
WO (6) WO2013192467A1 (https=)

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JP7520338B2 (ja) * 2018-10-19 2024-07-23 ユニチカ株式会社 積層フィルム
CN115427229A (zh) * 2020-05-29 2022-12-02 东洋纺株式会社 含透明高耐热膜的层叠体
JP7837183B2 (ja) * 2021-03-31 2026-03-30 日鉄ケミカル＆マテリアル株式会社 ボンドプライ、これを用いる回路基板及びストリップライン
US12441084B2 (en) 2021-10-20 2025-10-14 Unison Industries, Llc Thermal insulation system
JP2025530465A (ja) * 2022-09-29 2025-09-11 デリム カンパニー リミテッド 耐熱性及び酸化安定性に優れたポリイミド樹脂及びその製造方法

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