JP2015211164A - ウエハマッピング装置およびそれを備えたロードポート - Google Patents
ウエハマッピング装置およびそれを備えたロードポート Download PDFInfo
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- JP2015211164A JP2015211164A JP2014092924A JP2014092924A JP2015211164A JP 2015211164 A JP2015211164 A JP 2015211164A JP 2014092924 A JP2014092924 A JP 2014092924A JP 2014092924 A JP2014092924 A JP 2014092924A JP 2015211164 A JP2015211164 A JP 2015211164A
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- 238000013507 mapping Methods 0.000 title claims abstract description 138
- 235000012431 wafers Nutrition 0.000 claims abstract description 133
- 238000001514 detection method Methods 0.000 claims description 15
- 238000000926 separation method Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 abstract description 32
- 238000000034 method Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 4
- 230000009191 jumping Effects 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000000843 powder Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000004308 accommodation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67775—Docking arrangements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/002—Measuring arrangements characterised by the use of optical techniques for measuring two or more coordinates
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/14—Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/22—Measuring arrangements characterised by the use of optical techniques for measuring depth
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
- G01N35/1009—Characterised by arrangements for controlling the aspiration or dispense of liquids
- G01N2035/1025—Fluid level sensing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
- G01N35/10—Devices for transferring samples or any liquids to, in, or from, the analysis apparatus, e.g. suction devices, injection devices
- G01N35/1009—Characterised by arrangements for controlling the aspiration or dispense of liquids
- G01N35/1016—Control of the volume dispensed or introduced
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- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
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- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
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- Biochemistry (AREA)
- Analytical Chemistry (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】光軸L1を左右の水平方向へ向けたマッピングセンサ5の投光部5aと受光部5b間の左右のスパンを、ロードポートに搬送される異なる寸法の容器のうちの小さい寸法のオープンカセット12の前面開口のスパンよりも狭く形成してマッピングデバイス4に取り付け、光軸L2を左右の水平方向へ向けた第1の飛び出しセンサ6を、マッピングセンサ5の移動方向前方へ離間させてマッピングデバイス4に取り付けるとともに、光軸をマッピングセンサ5の上下の移動方向へ向けた第2の飛び出しセンサ7を設けることにより、異なるサイズのウエハW1、W2を処理するロードポートでも、ウエハマッピング装置1を共用できるようにした。
【選択図】図4
Description
1 ウエハマッピング装置
2 ボールねじ
3 エアシリンダ
4 マッピングデバイス
5 マッピングセンサ
6 第1の飛び出しセンサ
5a、6a 投光部
5b、6b 受光部
7 第2の飛び出しセンサ
11 FOUP
12 オープンカセット
12a 棚
21 処理室
22 遮蔽壁
23 入口
24 テーブル
Claims (4)
- ロードポートに搬送される異なる寸法の容器に収納された異なるサイズのウエハを共通にマッピングするウエハマッピング装置であって、
検出波の照射軸が左右の水平方向へ向けられ、左右のスパンが前記異なる寸法のうちの最も小さい寸法の容器の前面開口のスパンよりも狭く形成されて、前記容器の前面開口に挿入され、前記容器内で上下方向に移動して、前記容器に収納されたウエハを検出するマッピングセンサと、
前記マッピングセンサが取り付けられ、上下方向に移動するマッピングデバイスと、
検出波の照射軸が左右の水平方向へ向けられ、前記マッピングセンサの移動方向前方へ離間させて前記マッピングデバイスに取り付けられ、前記容器に収納されたウエハの飛び出しを検出する第1の飛び出しセンサと、
検出波の照射軸が前記マッピングセンサの上下の移動方向へ向けられ、前記容器に収納されたウエハの飛び出しを検出する第2の飛び出しセンサとを備えたウエハマッピング装置。 - 前記第1の飛び出しセンサの前記マッピングセンサからの前記移動方向前方への離間距離を、前記マッピングデバイスの上下方向移動の制動距離以上とした請求項1に記載のウエハマッピング装置。
- 前記第2の飛び出しセンサの照射軸を、前記容器の前面開口スパンの左右中央部で、前記第1の飛び出しセンサの照射軸よりも前記容器から後退した位置に設定した請求項1または2に記載のウエハマッピング装置。
- 請求項1乃至3のいずれかに記載のウエハマッピング装置を備えたロードポート。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014092924A JP6248788B2 (ja) | 2014-04-28 | 2014-04-28 | ウエハマッピング装置およびそれを備えたロードポート |
TW104109559A TWI661496B (zh) | 2014-04-28 | 2015-03-25 | 晶圓映射裝置及具備此裝置之裝載埠 |
US14/689,551 US9239228B2 (en) | 2014-04-28 | 2015-04-17 | Wafer mapping apparatus and load port including same |
EP15163965.5A EP2940721B1 (en) | 2014-04-28 | 2015-04-17 | Wafer mapping apparatus and load port including same |
KR1020150057725A KR102388219B1 (ko) | 2014-04-28 | 2015-04-24 | 웨이퍼 맵핑 장치 및 그것을 구비한 로드 포트 |
KR1020220046234A KR20220050868A (ko) | 2014-04-28 | 2022-04-14 | 웨이퍼 맵핑 장치 및 그것을 구비한 로드 포트 |
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JP2014092924A JP6248788B2 (ja) | 2014-04-28 | 2014-04-28 | ウエハマッピング装置およびそれを備えたロードポート |
Related Child Applications (1)
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JP2017223295A Division JP6447893B2 (ja) | 2017-11-21 | 2017-11-21 | ロードポート及びウエハマッピング装置 |
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JP2015211164A true JP2015211164A (ja) | 2015-11-24 |
JP6248788B2 JP6248788B2 (ja) | 2017-12-20 |
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JP2014092924A Active JP6248788B2 (ja) | 2014-04-28 | 2014-04-28 | ウエハマッピング装置およびそれを備えたロードポート |
Country Status (5)
Country | Link |
---|---|
US (1) | US9239228B2 (ja) |
EP (1) | EP2940721B1 (ja) |
JP (1) | JP6248788B2 (ja) |
KR (2) | KR102388219B1 (ja) |
TW (1) | TWI661496B (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019033170A (ja) * | 2017-08-08 | 2019-02-28 | 株式会社Screenホールディングス | 基板処理装置、位置合わせ装置および位置合わせ方法 |
JP7389182B1 (ja) | 2022-07-27 | 2023-11-29 | 上銀科技股▲分▼有限公司 | ロードポート及びそのマッピング装置 |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9545724B2 (en) * | 2013-03-14 | 2017-01-17 | Brooks Automation, Inc. | Tray engine with slide attached to an end effector base |
KR20180087260A (ko) * | 2015-11-30 | 2018-08-01 | 신포니아 테크놀로지 가부시끼가이샤 | 로드 포트 |
JP6689539B2 (ja) * | 2016-08-12 | 2020-04-28 | 株式会社ディスコ | 判定装置 |
KR102039308B1 (ko) * | 2017-07-14 | 2019-11-26 | 블루테크코리아 주식회사 | 웨이퍼 감지 장치, 이를 포함하는 웨이퍼 캐리어 로드 포트 및 이를 포함하는 반도체 공정 장치 |
JP7082274B2 (ja) * | 2017-11-06 | 2022-06-08 | シンフォニアテクノロジー株式会社 | ロードポート、及びロードポートにおけるマッピング処理方法 |
CN114025925A (zh) * | 2019-06-27 | 2022-02-08 | 川崎重工业株式会社 | 基板扫描映射装置、其扫描映射方法及扫描映射示教方法 |
KR102134033B1 (ko) * | 2019-09-17 | 2020-07-14 | 블루테크코리아 주식회사 | 웨이퍼 감지 장치, 이를 포함하는 웨이퍼 캐리어 로드 포트 및 이를 포함하는 반도체 공정 장치 |
JP2023023465A (ja) * | 2021-08-05 | 2023-02-16 | シンフォニアテクノロジー株式会社 | ロードポート |
DE102022206765A1 (de) | 2022-07-01 | 2024-01-04 | Hiwin Technologies Corp. | Abbildungsvorrichtung und ladetor mit derselben |
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- 2015-03-25 TW TW104109559A patent/TWI661496B/zh active
- 2015-04-17 US US14/689,551 patent/US9239228B2/en active Active
- 2015-04-17 EP EP15163965.5A patent/EP2940721B1/en active Active
- 2015-04-24 KR KR1020150057725A patent/KR102388219B1/ko active IP Right Grant
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JP2019033170A (ja) * | 2017-08-08 | 2019-02-28 | 株式会社Screenホールディングス | 基板処理装置、位置合わせ装置および位置合わせ方法 |
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JP6248788B2 (ja) | 2017-12-20 |
TWI661496B (zh) | 2019-06-01 |
EP2940721B1 (en) | 2017-04-05 |
KR20220050868A (ko) | 2022-04-25 |
KR102388219B1 (ko) | 2022-04-20 |
TW201543601A (zh) | 2015-11-16 |
US9239228B2 (en) | 2016-01-19 |
KR20150124399A (ko) | 2015-11-05 |
EP2940721A1 (en) | 2015-11-04 |
US20150308812A1 (en) | 2015-10-29 |
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