JP2015043432A - 加圧装置および制御方法 - Google Patents
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Abstract
【解決手段】加圧モジュールは、被加圧体が載置される載置面を有するステージと、載置面の面内の圧力分布を可変にする圧力可変部と、圧力可変部の圧力を検出する複数の圧力検出部とを備える。圧力可変部は、複数の圧力検出部で検出された圧力に基づいて、載置面の面内の圧力分布を変更する制御部をさらに備えてもよい。
【選択図】図5
Description
[先行技術文献]
[特許文献]
[特許文献1]特開2009−49066号公報
Claims (32)
- 被加圧体が載置される載置面を有するステージと、
前記載置面の面内の圧力分布を可変にする圧力可変部と、
前記圧力可変部の圧力を検出する複数の圧力検出部と
を備える加圧モジュール。 - 前記圧力可変部は、前記複数の圧力検出部で検出された圧力に基づいて、前記載置面の面内の圧力分布を変更する制御部をさらに備える請求項1に記載の加圧モジュール。
- 前記圧力可変部は、外部からの流体の出入により内圧が調整される袋状の中空加圧部を有する請求項1に記載の加圧モジュール。
- 前記複数の圧力検出部は、第1の圧力検出部および第2の圧力検出部を有し、
前記第1の圧力検出部は、前記中空加圧部上に配され、
前記第2の圧力検出部は、前記中空加圧部の外周に配された外周部上に互いに配され、
前記圧力可変部は、前記第1の圧力検出部により検出される圧力と前記第2の圧力検出部により検出される圧力との差に基づいて、前記中空加圧部に出入させる前記流体を制御する制御部を有する請求項3に記載の加圧モジュール。 - 前記ステージを押圧する第1の支柱部および第2の支柱部をさらに備え、
前記第1の圧力検出部および前記第1の支柱部は、前記中空加圧部上に互いに直列的に配され、
前記第2の圧力検出部および前記第2の支柱部は、前記外周部上に互いに直列的に配される請求項4に記載の加圧モジュール。 - 前記複数の圧力検出部は前記中空加圧部上に配され、
前記圧力可変部は、一の前記圧力検出部により検出される圧力と他の前記圧力検出部により検出される圧力との差に基づいて、前記中空加圧部に出入させる前記流体を制御する制御部を有する請求項3に記載の加圧モジュール。 - 前記制御部は、前記第1の圧力検出部により検出される圧力と前記第2の圧力検出部により検出される圧力との差が、予め定められた値以下となるように前記中空加圧部に出入させる流体を制御する請求項4に記載の加圧モジュール。
- 前記制御部は、前記第1の圧力検出部により検出される圧力と前記第2の圧力検出部により検出される圧力との差が、零となるように前記中空加圧部に出入させる流体を制御する請求項7に記載の加圧モジュール。
- 前記制御部は、前記ステージにおける中央部分を周辺部分よりも突出させる場合に、前記第1の圧力検出部により検出される圧力が前記第2の圧力検出部により検出される圧力よりも大きくなるように前記中空加圧部に出入させる流体を制御する請求項4に記載の加圧モジュール。
- 前記制御部は、前記ステージにおける中央部分を周辺部分よりも凹ませる場合に、前記第2の圧力検出部により検出される圧力が前記第1の圧力検出部により検出される圧力よりも大きくなるように前記中空加圧部に出入させる流体を制御する請求項4に記載の加圧モジュール。
- 前記圧力可変部は、圧電素子を有する請求項1に記載の加圧モジュール。
- 前記載置面とは反対の面に一端が設置された支柱部を備え、
前記圧力可変部は、前記支柱部の他端に設置され、前記ステージに加えられる押圧力を前記支柱部を介して前記圧電素子により検出すると共に、前記圧電素子に電力を供給することにより、前記ステージに押圧力を加えるように前記支柱部を押すロードセルを有する請求項11に記載の加圧モジュール。 - ひとつの前記ステージに対して複数の前記支柱部と前記ロードセルを備える請求項12に記載の加圧モジュール。
- 前記ステージに載置された被加圧体が均等に押圧されるように複数の前記ロードセルが制御される請求項13に記載の加圧モジュール。
- 昇降機の上方に前記ロードセルが載置される請求項12に記載の加圧モジュール。
- 前記ステージと前記支柱部の間に設けられる加熱モジュールと、
前記支柱部が貫通するように設けられる熱反射板と
を更に備える請求項12に記載の加圧モジュール。 - 前記複数の圧力検出部のそれぞれに設置された複数の支柱部を更に備え、
前記圧力可変部の内圧が調整されることにより、前記複数の支柱部を介して前記ステージが押圧される請求項1に記載の加圧モジュール。 - 前記圧力可変部は、外部から出入させる流体を制御することにより内圧を調整できる袋状の中空加圧部を有する請求項17に記載の加圧モジュール。
- 前記ステージと前記複数の支柱部との間に、前記ステージを加熱するための加熱部を備える請求項17に記載の加圧モジュール。
- 前記加熱部は複数の加熱ブロックにより構成される請求項19に記載の加圧モジュール。
- 前記複数の加熱ブロックを支持するフレームを更に備え、
前記複数の支柱部のそれぞれは、前記フレームに連結されている請求項20に記載の加圧モジュール。 - 前記ステージは円形であり、前記フレームは前記円形の中心から放射状に形成されている請求項21に記載の加圧モジュール。
- 前記圧力可変部と前記加熱部との間に熱反射板を備える請求項19に記載の加圧モジュール。
- 前記熱反射板は前記複数の支柱部を貫通させて設置される請求項23に記載の加圧モジュール。
- 前記熱反射板は、前記複数の支柱部の軸方向に互いに離間して複数設置される請求項24に記載の加圧モジュール。
- 更に前記軸方向に平行に熱反射板を備える請求項25に記載の加圧モジュール。
- 前記熱反射板は、金属板である請求項23に記載の加圧モジュール。
- 前記熱反射板の表面には、多層膜が形成されている請求項23に記載の加圧モジュール。
- 前記多層膜は、前記ステージの目標加熱温度近傍の輻射線の波長を反射する請求項28に記載の加圧モジュール。
- 前記複数の圧力検出部の少なくとも1つが異常圧力を検出した場合には、加圧を停止する請求項1に記載の加圧モジュール。
- 請求項1から30のいずれか1項に記載の加圧モジュールを対向させて配置した加圧装置。
- 請求項1から請求項30のいずれかに記載の加圧モジュールと、
前記加圧モジュールの前記ステージに対向して配された他のステージと
を備え、
前記ステージおよび前記他のステージの間に載置された複数の基板を貼り合わせる基板貼り合せ装置。
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JP2014185113A JP6070662B2 (ja) | 2009-09-28 | 2014-09-11 | 駆動装置、積層装置、および駆動方法 |
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JP2009233885 | 2009-10-07 | ||
JP2009233882 | 2009-10-07 | ||
JP2014185113A JP6070662B2 (ja) | 2009-09-28 | 2014-09-11 | 駆動装置、積層装置、および駆動方法 |
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JP2011532916A Pending JPWO2011036900A1 (ja) | 2009-09-28 | 2010-09-28 | 加圧モジュール、加圧装置、基板貼り合せ装置、基板貼り合せ方法および貼り合せ基板 |
JP2014185113A Expired - Fee Related JP6070662B2 (ja) | 2009-09-28 | 2014-09-11 | 駆動装置、積層装置、および駆動方法 |
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US (2) | US20120251789A1 (ja) |
EP (2) | EP2879163A1 (ja) |
JP (2) | JPWO2011036900A1 (ja) |
KR (1) | KR101809760B1 (ja) |
CN (2) | CN102630334A (ja) |
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WO2023032166A1 (ja) * | 2021-09-03 | 2023-03-09 | ヤマハロボティクスホールディングス株式会社 | 部材間接合装置及び接合部材製造方法 |
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CH708932B1 (en) * | 2013-12-09 | 2017-04-13 | Besi Switzerland Ag | Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components. |
JP6212223B2 (ja) * | 2015-03-30 | 2017-10-11 | 株式会社フジクラ | 荷重検知装置 |
KR101741828B1 (ko) * | 2015-11-30 | 2017-05-31 | 주식회사 아이에스시 | 푸셔장치 |
KR101636069B1 (ko) * | 2015-12-08 | 2016-07-11 | 주식회사 라파스 | 마이크로구조체 제조방법 |
JP2018010925A (ja) * | 2016-07-12 | 2018-01-18 | 東京エレクトロン株式会社 | 接合装置 |
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CN109052315B (zh) * | 2018-08-01 | 2021-07-23 | 南方科技大学 | 一种二维材料的转移系统 |
US11587807B2 (en) * | 2018-10-28 | 2023-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Annealing apparatus and method thereof |
KR102619624B1 (ko) | 2018-11-13 | 2023-12-29 | 삼성전자주식회사 | 기판합착 장치 및 방법 |
JP7488062B2 (ja) * | 2020-03-02 | 2024-05-21 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法および記憶媒体 |
KR20220029052A (ko) | 2020-09-01 | 2022-03-08 | 삼성전자주식회사 | 레이저 본딩 시스템 및 레이저 본딩 장치 |
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- 2010-09-28 KR KR1020127010098A patent/KR101809760B1/ko active IP Right Grant
- 2010-09-28 EP EP15150438.8A patent/EP2879163A1/en not_active Withdrawn
- 2010-09-28 JP JP2011532916A patent/JPWO2011036900A1/ja active Pending
- 2010-09-28 CN CN2010800532520A patent/CN102630334A/zh active Pending
- 2010-09-28 CN CN201410575558.2A patent/CN104377151B/zh not_active Expired - Fee Related
- 2010-09-28 WO PCT/JP2010/005823 patent/WO2011036900A1/ja active Application Filing
- 2010-09-28 EP EP10818577.8A patent/EP2485244A4/en not_active Withdrawn
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2012
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2014
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US20140262045A1 (en) | 2014-09-18 |
EP2879163A1 (en) | 2015-06-03 |
JPWO2011036900A1 (ja) | 2013-02-14 |
EP2485244A1 (en) | 2012-08-08 |
JP6070662B2 (ja) | 2017-02-01 |
CN102630334A (zh) | 2012-08-08 |
KR20120091095A (ko) | 2012-08-17 |
US9498944B2 (en) | 2016-11-22 |
EP2485244A4 (en) | 2014-07-30 |
CN104377151A (zh) | 2015-02-25 |
CN104377151B (zh) | 2019-01-01 |
KR101809760B1 (ko) | 2017-12-15 |
US20120251789A1 (en) | 2012-10-04 |
TW201135802A (en) | 2011-10-16 |
TWI550680B (zh) | 2016-09-21 |
WO2011036900A1 (ja) | 2011-03-31 |
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