WO2011036900A1 - 加圧モジュール、加圧装置及び基板貼り合せ装置 - Google Patents
加圧モジュール、加圧装置及び基板貼り合せ装置 Download PDFInfo
- Publication number
- WO2011036900A1 WO2011036900A1 PCT/JP2010/005823 JP2010005823W WO2011036900A1 WO 2011036900 A1 WO2011036900 A1 WO 2011036900A1 JP 2010005823 W JP2010005823 W JP 2010005823W WO 2011036900 A1 WO2011036900 A1 WO 2011036900A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- pressure
- unit
- pressurizing
- module according
- stage
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B41/00—Arrangements for controlling or monitoring lamination processes; Safety arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/185—Joining of semiconductor bodies for junction formation
- H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
- Y10T428/24595—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness and varying density
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
Description
[先行技術文献]
[特許文献]
[特許文献1]特開2009-49066号公報
Claims (32)
- 被加圧体が載置される載置面を有するステージと、
前記載置面の面内の圧力分布を可変にする圧力可変部と、
前記圧力可変部の圧力を検出する複数の圧力検出部と
を備える加圧モジュール。 - 前記圧力可変部は、前記複数の圧力検出部で検出された圧力に基づいて、前記載置面の面内の圧力分布を変更する制御部をさらに備える請求項1に記載の加圧モジュール。
- 前記圧力可変部は、外部からの流体の出入により内圧が調整される袋状の中空加圧部を有する請求項1に記載の加圧モジュール。
- 前記複数の圧力検出部は、第1の圧力検出部および第2の圧力検出部を有し、
前記第1の圧力検出部は、前記中空加圧部上に配され、
前記第2の圧力検出部は、前記中空加圧部の外周に配された外周部上に互いに配され、
前記圧力可変部は、前記第1の圧力検出部により検出される圧力と前記第2の圧力検出部により検出される圧力との差に基づいて、前記中空加圧部に出入させる前記流体を制御する制御部を有する請求項3に記載の加圧モジュール。 - 前記ステージを押圧する第1の支柱部および第2の支柱部をさらに備え、
前記第1の圧力検出部および前記第1の支柱部は、前記中空加圧部上に互いに直列的に配され、
前記第2の圧力検出部および前記第2の支柱部は、前記外周部上に互いに直列的に配される請求項4に記載の加圧モジュール。 - 前記複数の圧力検出部は前記中空加圧部上に配され、
前記圧力可変部は、一の前記圧力検出部により検出される圧力と他の前記圧力検出部により検出される圧力との差に基づいて、前記中空加圧部に出入させる前記流体を制御する制御部を有する請求項3に記載の加圧モジュール。 - 前記制御部は、前記第1の圧力検出部により検出される圧力と前記第2の圧力検出部により検出される圧力との差が、予め定められた値以下となるように前記中空加圧部に出入させる流体を制御する請求項4に記載の加圧モジュール。
- 前記制御部は、前記第1の圧力検出部により検出される圧力と前記第2の圧力検出部により検出される圧力との差が、零となるように前記中空加圧部に出入させる流体を制御する請求項7に記載の加圧モジュール。
- 前記制御部は、前記ステージにおける中央部分を周辺部分よりも突出させる場合に、前記第1の圧力検出部により検出される圧力が前記第2の圧力検出部により検出される圧力よりも大きくなるように前記中空加圧部に出入させる流体を制御する請求項4に記載の加圧モジュール。
- 前記制御部は、前記ステージにおける中央部分を周辺部分よりも凹ませる場合に、前記第2の圧力検出部により検出される圧力が前記第1の圧力検出部により検出される圧力よりも大きくなるように前記中空加圧部に出入させる流体を制御する請求項4に記載の加圧モジュール。
- 前記圧力可変部は、圧電素子を有する請求項1に記載の加圧モジュール。
- 前記載置面とは反対の面に一端が設置された支柱部を備え、
前記圧力可変部は、前記支柱部の他端に設置され、前記ステージに加えられる押圧力を前記支柱部を介して前記圧電素子により検出すると共に、前記圧電素子に電力を供給することにより、前記ステージに押圧力を加えるように前記支柱部を押すロードセルを有する請求項11に記載の加圧モジュール。 - ひとつの前記ステージに対して複数の前記支柱部と前記ロードセルを備える請求項12に記載の加圧モジュール。
- 前記ステージに載置された被加圧体が均等に押圧されるように複数の前記ロードセルが制御される請求項13に記載の加圧モジュール。
- 昇降機の上方に前記ロードセルが載置される請求項12に記載の加圧モジュール。
- 前記ステージと前記支柱部の間に設けられる加熱モジュールと、
前記支柱部が貫通するように設けられる熱反射板と
を更に備える請求項12に記載の加圧モジュール。 - 前記複数の圧力検出部のそれぞれに設置された複数の支柱部を更に備え、
前記圧力可変部の内圧が調整されることにより、前記複数の支柱部を介して前記ステージが押圧される請求項1に記載の加圧モジュール。 - 前記圧力可変部は、外部から出入させる流体を制御することにより内圧を調整できる袋状の中空加圧部を有する請求項17に記載の加圧モジュール。
- 前記ステージと前記複数の支柱部との間に、前記ステージを加熱するための加熱部を備える請求項17に記載の加圧モジュール。
- 前記加熱部は複数の加熱ブロックにより構成される請求項19に記載の加圧モジュール。
- 前記複数の加熱ブロックを支持するフレームを更に備え、
前記複数の支柱部のそれぞれは、前記フレームに連結されている請求項20に記載の加圧モジュール。 - 前記ステージは円形であり、前記フレームは前記円形の中心から放射状に形成されている請求項21に記載の加圧モジュール。
- 前記圧力可変部と前記加熱部との間に熱反射板を備える請求項19に記載の加圧モジュール。
- 前記熱反射板は前記複数の支柱部を貫通させて設置される請求項23に記載の加圧モジュール。
- 前記熱反射板は、前記複数の支柱部の軸方向に互いに離間して複数設置される請求項24に記載の加圧モジュール。
- 更に前記軸方向に平行に熱反射板を備える請求項25に記載の加圧モジュール。
- 前記熱反射板は、金属板である請求項23に記載の加圧モジュール。
- 前記熱反射板の表面には、多層膜が形成されている請求項23に記載の加圧モジュール。
- 前記多層膜は、前記ステージの目標加熱温度近傍の輻射線の波長を反射する請求項28に記載の加圧モジュール。
- 前記複数の圧力検出部の少なくとも1つが異常圧力を検出した場合には、加圧を停止する請求項1に記載の加圧モジュール。
- 請求項1から30のいずれか1項に記載の加圧モジュールを対向させて配置した加圧装置。
- 請求項1から請求項30のいずれかに記載の加圧モジュールと、
前記加圧モジュールの前記ステージに対向して配された他のステージと
を備え、
前記ステージおよび前記他のステージの間に載置された複数の基板を貼り合わせる基板貼り合せ装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020127010098A KR101809760B1 (ko) | 2009-09-28 | 2010-09-28 | 가압 모듈, 가압 장치 및 기판 접합 장치 |
JP2011532916A JPWO2011036900A1 (ja) | 2009-09-28 | 2010-09-28 | 加圧モジュール、加圧装置、基板貼り合せ装置、基板貼り合せ方法および貼り合せ基板 |
CN2010800532520A CN102630334A (zh) | 2009-09-28 | 2010-09-28 | 加压模块、加压装置以及基板贴合装置 |
EP10818577.8A EP2485244A4 (en) | 2009-09-28 | 2010-09-28 | PRESSURE APPLICATION MODULE, PRINT APPLICATION DEVICE AND SUBSTRATE BINDING DEVICE |
US13/431,764 US20120251789A1 (en) | 2009-09-28 | 2012-03-27 | Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate |
US14/299,511 US9498944B2 (en) | 2009-09-28 | 2014-06-09 | Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate |
Applications Claiming Priority (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009223344 | 2009-09-28 | ||
JP2009-223344 | 2009-09-28 | ||
JP2009-233885 | 2009-10-07 | ||
JP2009233882 | 2009-10-07 | ||
JP2009-233882 | 2009-10-07 | ||
JP2009233885 | 2009-10-07 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/431,764 Continuation US20120251789A1 (en) | 2009-09-28 | 2012-03-27 | Pressuring module, pressuring apparatus, substrate bonding apparatus, substrate bonding method, and bonded substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2011036900A1 true WO2011036900A1 (ja) | 2011-03-31 |
Family
ID=43795667
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2010/005823 WO2011036900A1 (ja) | 2009-09-28 | 2010-09-28 | 加圧モジュール、加圧装置及び基板貼り合せ装置 |
Country Status (7)
Country | Link |
---|---|
US (2) | US20120251789A1 (ja) |
EP (2) | EP2485244A4 (ja) |
JP (2) | JPWO2011036900A1 (ja) |
KR (1) | KR101809760B1 (ja) |
CN (2) | CN104377151B (ja) |
TW (1) | TWI550680B (ja) |
WO (1) | WO2011036900A1 (ja) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013084509A1 (ja) | 2011-12-08 | 2013-06-13 | 株式会社ニコン | 加圧装置、基板貼り合わせ装置、及び、重ね合わせ基板 |
US10262885B2 (en) | 2012-08-31 | 2019-04-16 | Semiconductor Technologies & Instruments Pte Ltd | Multifunction wafer and film frame handling system |
JP5956933B2 (ja) | 2013-01-15 | 2016-07-27 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
US9058974B2 (en) * | 2013-06-03 | 2015-06-16 | International Business Machines Corporation | Distorting donor wafer to corresponding distortion of host wafer |
US10121760B2 (en) | 2013-11-01 | 2018-11-06 | Nikon Corporation | Wafer bonding system and method |
KR101697487B1 (ko) * | 2013-11-26 | 2017-02-01 | 안성룡 | 글래스 합착장치 |
CH708932B1 (en) * | 2013-12-09 | 2017-04-13 | Besi Switzerland Ag | Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components. |
WO2016159123A1 (ja) * | 2015-03-30 | 2016-10-06 | 株式会社フジクラ | 荷重検知装置 |
KR101741828B1 (ko) * | 2015-11-30 | 2017-05-31 | 주식회사 아이에스시 | 푸셔장치 |
KR101636069B1 (ko) * | 2015-12-08 | 2016-07-11 | 주식회사 라파스 | 마이크로구조체 제조방법 |
JP2018010925A (ja) * | 2016-07-12 | 2018-01-18 | 東京エレクトロン株式会社 | 接合装置 |
TWI607207B (zh) * | 2016-12-22 | 2017-12-01 | 矽品精密工業股份有限公司 | 模封設備 |
CN108511363B (zh) * | 2017-02-28 | 2020-09-11 | 上海微电子装备(集团)股份有限公司 | 一种键合装置 |
KR102395194B1 (ko) | 2017-06-21 | 2022-05-06 | 삼성전자주식회사 | 웨이퍼 본딩 장치 및 그 장치를 포함한 웨이퍼 본딩 시스템 |
CN109052315B (zh) * | 2018-08-01 | 2021-07-23 | 南方科技大学 | 一种二维材料的转移系统 |
US11587807B2 (en) * | 2018-10-28 | 2023-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Annealing apparatus and method thereof |
KR102619624B1 (ko) | 2018-11-13 | 2023-12-29 | 삼성전자주식회사 | 기판합착 장치 및 방법 |
JP2021141115A (ja) * | 2020-03-02 | 2021-09-16 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法および記憶媒体 |
KR20220029052A (ko) | 2020-09-01 | 2022-03-08 | 삼성전자주식회사 | 레이저 본딩 시스템 및 레이저 본딩 장치 |
WO2023032166A1 (ja) * | 2021-09-03 | 2023-03-09 | ヤマハロボティクスホールディングス株式会社 | 部材間接合装置及び接合部材製造方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000003841A (ja) * | 1998-06-15 | 2000-01-07 | Hamamatsu Photonics Kk | 基板の接着方法 |
JP2004268113A (ja) * | 2003-03-11 | 2004-09-30 | Fujitsu Ltd | 基板貼合せ装置及び基板貼合せ方法 |
JP2005109219A (ja) * | 2003-09-30 | 2005-04-21 | Shin Etsu Handotai Co Ltd | 半導体貼り合わせ装置 |
JP2008258426A (ja) * | 2007-04-05 | 2008-10-23 | Nikon Corp | 基板接合装置、基板接合方法および基板ホルダ |
JP2008262971A (ja) * | 2007-04-10 | 2008-10-30 | Nikon Corp | 基板ホルダ、基板接合装置および基板接合方法 |
JP2009049066A (ja) | 2007-08-14 | 2009-03-05 | Nikon Corp | ウェハ接合装置 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4003A (en) * | 1845-04-16 | Cochrane | ||
JP2501493B2 (ja) | 1990-06-05 | 1996-05-29 | 株式会社名機製作所 | 板体プレス装置 |
JP3366560B2 (ja) * | 1996-11-08 | 2003-01-14 | 株式会社東洋工機 | プレス機械 |
US6938505B2 (en) * | 2002-08-13 | 2005-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chamber wafer detection |
CN100470767C (zh) * | 2004-03-26 | 2009-03-18 | 富士胶片株式会社 | 接合衬底的装置及方法 |
JP4476764B2 (ja) * | 2004-03-26 | 2010-06-09 | 富士フイルム株式会社 | 基板接合装置及び方法 |
EP1811526A4 (en) * | 2004-07-23 | 2008-04-16 | Nikon Corp | HOLDING DEVICE, STAGE DEVICE, EXPOSURE DEVICE AND COMPONENT MANUFACTURING METHOD |
JP4866582B2 (ja) | 2005-09-01 | 2012-02-01 | 株式会社ケミトロニクス | 圧着機構 |
TW200733226A (en) * | 2006-01-18 | 2007-09-01 | Shibaura Mechatronics Corp | Apparatus for treating substrates and method of treating substrates |
US7948034B2 (en) * | 2006-06-22 | 2011-05-24 | Suss Microtec Lithography, Gmbh | Apparatus and method for semiconductor bonding |
EP2053635A4 (en) * | 2006-06-29 | 2010-09-22 | Nikon Corp | METALLIZING APPARATUS OF WAFER |
KR101367661B1 (ko) | 2006-08-25 | 2014-02-27 | 엘아이지에이디피 주식회사 | 척의 평행도 및 평편도 조절유닛을 가진 기판 합착장치 |
JP4247296B1 (ja) * | 2008-02-22 | 2009-04-02 | 三菱重工業株式会社 | 積層接合装置および積層接合方法 |
JP5434471B2 (ja) * | 2009-10-21 | 2014-03-05 | 株式会社ニコン | 加圧装置、基板接合装置、加圧方法および基板接合方法 |
-
2010
- 2010-09-28 EP EP10818577.8A patent/EP2485244A4/en not_active Withdrawn
- 2010-09-28 CN CN201410575558.2A patent/CN104377151B/zh not_active Expired - Fee Related
- 2010-09-28 CN CN2010800532520A patent/CN102630334A/zh active Pending
- 2010-09-28 EP EP15150438.8A patent/EP2879163A1/en not_active Withdrawn
- 2010-09-28 JP JP2011532916A patent/JPWO2011036900A1/ja active Pending
- 2010-09-28 TW TW099132762A patent/TWI550680B/zh not_active IP Right Cessation
- 2010-09-28 KR KR1020127010098A patent/KR101809760B1/ko active IP Right Grant
- 2010-09-28 WO PCT/JP2010/005823 patent/WO2011036900A1/ja active Application Filing
-
2012
- 2012-03-27 US US13/431,764 patent/US20120251789A1/en not_active Abandoned
-
2014
- 2014-06-09 US US14/299,511 patent/US9498944B2/en active Active
- 2014-09-11 JP JP2014185113A patent/JP6070662B2/ja not_active Expired - Fee Related
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000003841A (ja) * | 1998-06-15 | 2000-01-07 | Hamamatsu Photonics Kk | 基板の接着方法 |
JP2004268113A (ja) * | 2003-03-11 | 2004-09-30 | Fujitsu Ltd | 基板貼合せ装置及び基板貼合せ方法 |
JP2005109219A (ja) * | 2003-09-30 | 2005-04-21 | Shin Etsu Handotai Co Ltd | 半導体貼り合わせ装置 |
JP2008258426A (ja) * | 2007-04-05 | 2008-10-23 | Nikon Corp | 基板接合装置、基板接合方法および基板ホルダ |
JP2008262971A (ja) * | 2007-04-10 | 2008-10-30 | Nikon Corp | 基板ホルダ、基板接合装置および基板接合方法 |
JP2009049066A (ja) | 2007-08-14 | 2009-03-05 | Nikon Corp | ウェハ接合装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP2485244A4 |
Also Published As
Publication number | Publication date |
---|---|
CN104377151A (zh) | 2015-02-25 |
JPWO2011036900A1 (ja) | 2013-02-14 |
EP2879163A1 (en) | 2015-06-03 |
KR20120091095A (ko) | 2012-08-17 |
TWI550680B (zh) | 2016-09-21 |
JP2015043432A (ja) | 2015-03-05 |
CN102630334A (zh) | 2012-08-08 |
US9498944B2 (en) | 2016-11-22 |
CN104377151B (zh) | 2019-01-01 |
JP6070662B2 (ja) | 2017-02-01 |
US20120251789A1 (en) | 2012-10-04 |
EP2485244A4 (en) | 2014-07-30 |
US20140262045A1 (en) | 2014-09-18 |
TW201135802A (en) | 2011-10-16 |
KR101809760B1 (ko) | 2017-12-15 |
EP2485244A1 (en) | 2012-08-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6070662B2 (ja) | 駆動装置、積層装置、および駆動方法 | |
JP6952853B2 (ja) | 接合システム、および接合方法 | |
TWI564982B (zh) | A substrate holding device, a substrate bonding device, a substrate holding method, a substrate bonding method, a laminated semiconductor device, and a laminated substrate | |
JP5935542B2 (ja) | 基板貼り合わせ装置および基板貼り合わせ方法 | |
JP5434471B2 (ja) | 加圧装置、基板接合装置、加圧方法および基板接合方法 | |
JP5707793B2 (ja) | 基板貼り合せ装置、基板貼り合せ方法および積層半導体装置製造方法 | |
JP2011082366A (ja) | 加熱モジュール | |
JP2015026862A (ja) | 加熱モジュールおよび貼り合わせ装置 | |
JP2011082367A (ja) | 加圧加熱モジュール | |
JP2011222633A (ja) | 基板貼り合わせ装置、積層半導体の製造方法および積層半導体 | |
JP2011222632A (ja) | 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 | |
JP5569169B2 (ja) | 基板貼り合せ装置の制御方法、基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 | |
JP5780002B2 (ja) | 基板貼り合わせ装置及び基板貼り合わせ方法 | |
JP5560716B2 (ja) | 加圧装置およびデバイスの製造方法 | |
JP5560590B2 (ja) | 基板貼り合わせ装置 | |
JP4852476B2 (ja) | 薄膜形成装置および薄膜形成方法 | |
JP2014241416A (ja) | 基板貼り合せ装置および積層半導体装置製造方法 | |
JP2012004322A (ja) | 基板貼り合せ装置、積層半導体装置製造方法及び積層半導体装置 | |
CN115315346B (zh) | 微小结构物制造装置及微小结构物的制造方法 | |
JP2014203975A (ja) | 薄膜形成装置 | |
KR101000091B1 (ko) | 기판 합착장치 | |
KR20100079838A (ko) | 기판 합착장치 | |
JP2012079818A (ja) | 基板貼り合せ装置、加熱装置、積層半導体装置の製造方法及び積層半導体装置 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WWE | Wipo information: entry into national phase |
Ref document number: 201080053252.0 Country of ref document: CN |
|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 10818577 Country of ref document: EP Kind code of ref document: A1 |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2011532916 Country of ref document: JP |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
ENP | Entry into the national phase |
Ref document number: 20127010098 Country of ref document: KR Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 3543/DELNP/2012 Country of ref document: IN |
|
WWE | Wipo information: entry into national phase |
Ref document number: 2010818577 Country of ref document: EP |