JP6070662B2 - 駆動装置、積層装置、および駆動方法 - Google Patents
駆動装置、積層装置、および駆動方法 Download PDFInfo
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Description
[先行技術文献]
[特許文献]
[特許文献1]特開2009−49066号公報
Claims (14)
- 少なくとも一部が第1シリンダに挿入された第1ピストンと、少なくとも一部が第2シリンダに挿入された第2ピストンと、前記第1ピストンの位置と前記第2ピストンの位置とを固定する固定部とを有する第1装置と、
前記第1シリンダと、前記第2シリンダとを有する第2装置と、
前記第1シリンダの流体を供給又は排出する制御をする第1制御部と、
前記第2シリンダの流体を供給又は排出する制御をする第2制御部とを有し、
前記第1制御部により前記第1装置と前記第2装置とを相対的に移動させるとき、前記第2制御部は、前記第1装置と前記第2装置との相対的な移動を妨げないように前記第2シリンダの流体を供給又は排出する制御を行い、
前記第2制御部により前記第1装置と前記第2装置とを相対的に移動させるとき、前記第1制御部は、前記第1装置と前記第2装置との相対的な移動を妨げないように前記第1シリンダの流体を供給又は排出する制御を行う駆動装置。 - 請求項1に記載された駆動装置であって、
前記第1制御部は、前記第1装置と前記第2装置とを所定速度より小さい速度で相対的に移動させる制御を行い、
前記第2制御部は、前記第1装置と前記第2装置とを前記所定速度より大きい速度で相対的に移動させる制御を行う駆動装置。 - 請求項1又は請求項2に記載された駆動装置であって、
前記第1制御部は、前記第1装置と前記第2装置とを所定の力よりも大きい力で相対的に移動させる制御を行い、
前記第2制御部は、前記第1装置と前記第2装置とを前記所定の力よりも小さい力で相対的に移動させる制御を行う駆動装置。 - 請求項1から請求項3の何れか1項に記載された駆動装置であって、
前記第2シリンダは、前記第1シリンダよりも重力方向側に備えられる駆動装置。 - 請求項1から請求項4の何れか1項に記載された駆動装置であって、
前記第1制御部により前記第1シリンダに所定の体積の流体を供給又は排出したとき、前記第2制御部により前記第2シリンダに前記所定の体積の流体を供給又は排出したときと比較して、前記第1装置と前記第2装置との相対的な速度は小さくなる駆動装置。 - 請求項1から請求項5の何れか1項に記載された駆動装置であって、
前記第1装置にかかる圧力を検出する圧力検出部と、
前記第1装置の位置を検出する位置検出部とを有し、
前記第1制御部は、前記圧力検出部の出力を用いて制御可能であり、
前記第2制御部は、前記位置検出部の出力を用いて制御可能である駆動装置。 - 請求項1から請求項6の何れか1項に記載された駆動装置と、
前記駆動装置に対向して備えられた加圧モジュールと
を有し、前記駆動装置と前記加圧モジュールとを用いて、第1半導体基板と、第2半導体基板とを積層した積層体を製造する積層装置。 - 請求項7に記載された積層装置であって、
前記第1制御部および前記第2制御部に制御手順を設定する指令を有する指令入力部を更に備え、
前記第2制御部により前記第1装置および前記第2装置のいずれか一方を前記加圧モジュールに向かって移動させ、
前記第1装置および前記第2装置の前記一方が前記加圧モジュールに向かって移動する間、位置センサにより前記一方の変位を検出し、
前記一方が所定の位置に到達したことを前記位置センサが検出するまで、検出された前記一方の変位に応じて、第1シリンダおよび前記第1ピストンが形成する第1ルームの容積を前記第1制御部に調節させる積層装置。 - 請求項7または8に記載された積層装置であって、
前記第1シリンダに流入出する流体の量を制御する第1バルブと、
前記第2シリンダに流入出する流体の量を制御する第2バルブと
を備え、
前記第1バルブにより前記第1ピストンの移動を制御する場合に、前記第2バルブは前記第1ピストンの移動に伴う前記第1シリンダの容積増減分の流体を前記第1シリンダに流出入させ、
前記第2バルブにより前記第2ピストンの移動を制御する場合に、前記第1バルブは前記第2ピストンの移動に伴う前記第2シリンダの容積増減分の流体を前記第2シリンダに流出入させる
積層装置。 - 請求項7から9のいずれか一項に記載された積層装置であって、
前記第1シリンダに配された圧力センサと、
前記圧力センサが検出した前記第1シリンダの圧力をフィードバックして得た偏差に基づいて前記第1制御部が流体の供給又は排出を制御する圧力制御器と、
前記第2ピストンの位置を検知する位置センサと、
前記位置センサが検出した前記第2ピストンの位置の、所定の位置に対する偏差に基づいて前記第2制御部が流体の供給又は排出を制御する位置制御器と、
前記第1ピストンおよび前記加圧モジュールの間の距離が所定の距離よりも小さくなった場合に、前記第1ピストンおよび前記第2ピストンの移動制御を、前記位置制御器から、前記圧力制御器に切り替える積層装置。 - 請求項7から10のいずれか一項に記載された積層装置であって、
前記第1シリンダのシリンダ径は、前記第2シリンダのシリンダ径よりも大きい積層装置。 - 第1ピストンおよび前記第1ピストンに固定された第2ピストンを有する第1装置を、前記第1ピストンの少なくとも一部が挿入された第1シリンダ、および、前記第2ピストンの少なくとも一部が挿入された第2シリンダを有する第2装置に対して相対的に移動させる場合に、
前記第1シリンダに供給又は排出する流体による前記第1装置および前記第2装置の相対的な移動を妨げないように前記第2シリンダに供給又は排出する流体を制御する第1制御段階と、
前記第2シリンダに供給又は排出する流体による前記第1装置および前記第2装置の相対的な移動を妨げないように前記第1シリンダに供給又は排出する流体を制御する第2の制御と
のいずれかを実行する駆動方法。 - 請求項12に記載された駆動方法であって、
前記第1制御は、前記第1装置と前記第2装置とを所定速度より小さい速度で相対的に移動させ、
前記第2の制御は、前記第1装置と前記第2装置とを前記所定速度より大きい速度で相対的に移動させる
駆動方法。 - 請求項12又は請求項13に記載された駆動方法であって、
前記第1制御は、前記第1装置と前記第2装置とを所定の力よりも大きい力で相対的に移動させ、
前記第2の制御は、前記第1装置と前記第2装置とを前記所定の力よりも小さい力で相対的に移動させる
駆動方法。
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JP (2) | JPWO2011036900A1 (ja) |
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KR102050323B1 (ko) * | 2011-12-08 | 2019-11-29 | 가부시키가이샤 니콘 | 가압 장치, 기판 접합 장치, 및, 서로 겹침 기판 |
TWI625815B (zh) | 2012-08-31 | 2018-06-01 | 聯達科技設備私人有限公司 | 用於自動校準在膜框架上之晶圓在轉動上的對準誤差之系統與方法 |
JP5956933B2 (ja) | 2013-01-15 | 2016-07-27 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理装置 |
US9058974B2 (en) * | 2013-06-03 | 2015-06-16 | International Business Machines Corporation | Distorting donor wafer to corresponding distortion of host wafer |
US9947637B2 (en) | 2013-11-01 | 2018-04-17 | Nikon Corporation | System and method for clamping wafers together in alignment using pressure |
KR101697487B1 (ko) * | 2013-11-26 | 2017-02-01 | 안성룡 | 글래스 합착장치 |
CH708932B1 (en) * | 2013-12-09 | 2017-04-13 | Besi Switzerland Ag | Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components. |
JP6212223B2 (ja) * | 2015-03-30 | 2017-10-11 | 株式会社フジクラ | 荷重検知装置 |
KR101741828B1 (ko) * | 2015-11-30 | 2017-05-31 | 주식회사 아이에스시 | 푸셔장치 |
KR101636069B1 (ko) * | 2015-12-08 | 2016-07-11 | 주식회사 라파스 | 마이크로구조체 제조방법 |
JP2018010925A (ja) * | 2016-07-12 | 2018-01-18 | 東京エレクトロン株式会社 | 接合装置 |
TWI607207B (zh) * | 2016-12-22 | 2017-12-01 | 矽品精密工業股份有限公司 | 模封設備 |
CN108511363B (zh) * | 2017-02-28 | 2020-09-11 | 上海微电子装备(集团)股份有限公司 | 一种键合装置 |
KR102395194B1 (ko) | 2017-06-21 | 2022-05-06 | 삼성전자주식회사 | 웨이퍼 본딩 장치 및 그 장치를 포함한 웨이퍼 본딩 시스템 |
CN109052315B (zh) * | 2018-08-01 | 2021-07-23 | 南方科技大学 | 一种二维材料的转移系统 |
US11587807B2 (en) * | 2018-10-28 | 2023-02-21 | Taiwan Semiconductor Manufacturing Co., Ltd. | Annealing apparatus and method thereof |
KR102619624B1 (ko) | 2018-11-13 | 2023-12-29 | 삼성전자주식회사 | 기판합착 장치 및 방법 |
JP7488062B2 (ja) * | 2020-03-02 | 2024-05-21 | 東京エレクトロン株式会社 | 接合装置、接合システム、接合方法および記憶媒体 |
KR20220029052A (ko) | 2020-09-01 | 2022-03-08 | 삼성전자주식회사 | 레이저 본딩 시스템 및 레이저 본딩 장치 |
WO2023032166A1 (ja) * | 2021-09-03 | 2023-03-09 | ヤマハロボティクスホールディングス株式会社 | 部材間接合装置及び接合部材製造方法 |
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US4003A (en) * | 1845-04-16 | Cochrane | ||
JP2501493B2 (ja) * | 1990-06-05 | 1996-05-29 | 株式会社名機製作所 | 板体プレス装置 |
JP3366560B2 (ja) * | 1996-11-08 | 2003-01-14 | 株式会社東洋工機 | プレス機械 |
JP4260925B2 (ja) * | 1998-06-15 | 2009-04-30 | 浜松ホトニクス株式会社 | 基板の接着方法 |
US6938505B2 (en) * | 2002-08-13 | 2005-09-06 | Taiwan Semiconductor Manufacturing Co., Ltd. | Chamber wafer detection |
JP4245138B2 (ja) * | 2003-03-11 | 2009-03-25 | 富士通株式会社 | 基板貼合せ装置及び基板貼合せ方法 |
JP4549648B2 (ja) * | 2003-09-30 | 2010-09-22 | 信越半導体株式会社 | 半導体貼り合わせ装置 |
JP4476764B2 (ja) * | 2004-03-26 | 2010-06-09 | 富士フイルム株式会社 | 基板接合装置及び方法 |
CN100470767C (zh) * | 2004-03-26 | 2009-03-18 | 富士胶片株式会社 | 接合衬底的装置及方法 |
EP1811526A4 (en) * | 2004-07-23 | 2008-04-16 | Nikon Corp | HOLDING DEVICE, STAGE DEVICE, EXPOSURE DEVICE AND COMPONENT MANUFACTURING METHOD |
JP4866582B2 (ja) | 2005-09-01 | 2012-02-01 | 株式会社ケミトロニクス | 圧着機構 |
TW200733226A (en) * | 2006-01-18 | 2007-09-01 | Shibaura Mechatronics Corp | Apparatus for treating substrates and method of treating substrates |
US7948034B2 (en) * | 2006-06-22 | 2011-05-24 | Suss Microtec Lithography, Gmbh | Apparatus and method for semiconductor bonding |
EP2053635A4 (en) * | 2006-06-29 | 2010-09-22 | Nikon Corp | METALLIZING APPARATUS OF WAFER |
KR101367661B1 (ko) | 2006-08-25 | 2014-02-27 | 엘아이지에이디피 주식회사 | 척의 평행도 및 평편도 조절유닛을 가진 기판 합착장치 |
JP5347235B2 (ja) * | 2007-04-05 | 2013-11-20 | 株式会社ニコン | 基板接合装置および基板接合方法 |
JP5476657B2 (ja) * | 2007-04-10 | 2014-04-23 | 株式会社ニコン | 基板ホルダ、基板接合装置および基板接合方法 |
JP5272348B2 (ja) * | 2007-08-14 | 2013-08-28 | 株式会社ニコン | ウェハ接合装置 |
JP4247296B1 (ja) * | 2008-02-22 | 2009-04-02 | 三菱重工業株式会社 | 積層接合装置および積層接合方法 |
JP5434471B2 (ja) * | 2009-10-21 | 2014-03-05 | 株式会社ニコン | 加圧装置、基板接合装置、加圧方法および基板接合方法 |
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- 2010-09-28 KR KR1020127010098A patent/KR101809760B1/ko active IP Right Grant
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- 2010-09-28 EP EP15150438.8A patent/EP2879163A1/en not_active Withdrawn
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EP2485244A1 (en) | 2012-08-08 |
CN104377151B (zh) | 2019-01-01 |
EP2485244A4 (en) | 2014-07-30 |
JP2015043432A (ja) | 2015-03-05 |
CN102630334A (zh) | 2012-08-08 |
TW201135802A (en) | 2011-10-16 |
EP2879163A1 (en) | 2015-06-03 |
CN104377151A (zh) | 2015-02-25 |
TWI550680B (zh) | 2016-09-21 |
US20120251789A1 (en) | 2012-10-04 |
US20140262045A1 (en) | 2014-09-18 |
US9498944B2 (en) | 2016-11-22 |
KR101809760B1 (ko) | 2017-12-15 |
WO2011036900A1 (ja) | 2011-03-31 |
JPWO2011036900A1 (ja) | 2013-02-14 |
KR20120091095A (ko) | 2012-08-17 |
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