JP2014523969A - スパッタリングターゲット - Google Patents

スパッタリングターゲット Download PDF

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Publication number
JP2014523969A
JP2014523969A JP2014518961A JP2014518961A JP2014523969A JP 2014523969 A JP2014523969 A JP 2014523969A JP 2014518961 A JP2014518961 A JP 2014518961A JP 2014518961 A JP2014518961 A JP 2014518961A JP 2014523969 A JP2014523969 A JP 2014523969A
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JP
Japan
Prior art keywords
mold
reactive material
reservoir
mandrel
target
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Pending
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JP2014518961A
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English (en)
Japanese (ja)
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JP2014523969A5 (https=
Inventor
プレステッド，ディーン・ティー
アスバス，マイケル
フェリン，ローレンス・シー
カーター，ポール・ジー
ラヴェリエール，ガイ・ピー
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ソレラス・リミテッド
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Publication of JP2014523969A publication Critical patent/JP2014523969A/ja
Publication of JP2014523969A5 publication Critical patent/JP2014523969A5/ja
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D25/00—Special casting characterised by the nature of the product
    • B22D25/06—Special casting characterised by the nature of the product by its physical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D7/00—Casting ingots, e.g. from ferrous metals
    • B22D7/005—Casting ingots, e.g. from ferrous metals from non-ferrous metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
    • B22D7/00—Casting ingots, e.g. from ferrous metals
    • B22D7/06—Ingot moulds or their manufacture

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
JP2014518961A 2011-06-27 2012-06-27 スパッタリングターゲット Pending JP2014523969A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161501605P 2011-06-27 2011-06-27
US61/501,605 2011-06-27
PCT/US2012/044399 WO2013003458A1 (en) 2011-06-27 2012-06-27 Sputtering target

Publications (2)

Publication Number Publication Date
JP2014523969A true JP2014523969A (ja) 2014-09-18
JP2014523969A5 JP2014523969A5 (https=) 2015-08-20

Family

ID=46598921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014518961A Pending JP2014523969A (ja) 2011-06-27 2012-06-27 スパッタリングターゲット

Country Status (6)

Country Link
US (1) US10138544B2 (https=)
EP (1) EP2723915A1 (https=)
JP (1) JP2014523969A (https=)
KR (1) KR101988391B1 (https=)
CN (1) CN103814151B (https=)
WO (1) WO2013003458A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5968808B2 (ja) * 2013-03-07 2016-08-10 Ｊｘ金属株式会社 インジウム製円筒形ターゲット部材及び円筒形ターゲット部材の製造方法
JP5941016B2 (ja) * 2013-05-27 2016-06-29 株式会社神戸製鋼所 成膜装置およびそれを用いた成膜方法
JP6305083B2 (ja) * 2014-02-04 2018-04-04 Ｊｘ金属株式会社 スパッタリングターゲット及び、それの製造方法
CN105349952A (zh) * 2015-11-09 2016-02-24 基迈克材料科技（苏州）有限公司 金属锂靶材铸造制备方法
CN108827994B (zh) * 2018-06-04 2020-06-19 西安交通大学 一种车载加速器中子源固态锂靶系统
KR101956017B1 (ko) * 2018-12-12 2019-03-08 (주)코아엔지니어링 스퍼터링용 로터리 타겟 어셈블리의 인듐 충진장치 및 충진방법
US12134125B2 (en) 2020-02-13 2024-11-05 Junora Ltd Systems and methods for casting sputtering targets
CN112962070B (zh) * 2021-02-02 2023-02-07 邱从章 一种溅射靶材的制备装备及其制备方法
CN113463047B (zh) * 2021-08-18 2024-09-24 先导电子科技股份有限公司 一种靶材制备电动辅助装置
CN120394829A (zh) * 2025-07-02 2025-08-01 兴化市三诚精密锻造有限公司 一种金属铸造用冷却装置

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