JP2014523969A5 - - Google Patents

Download PDF

Info

Publication number
JP2014523969A5
JP2014523969A5 JP2014518961A JP2014518961A JP2014523969A5 JP 2014523969 A5 JP2014523969 A5 JP 2014523969A5 JP 2014518961 A JP2014518961 A JP 2014518961A JP 2014518961 A JP2014518961 A JP 2014518961A JP 2014523969 A5 JP2014523969 A5 JP 2014523969A5
Authority
JP
Japan
Prior art keywords
mold
mandrel
wall
reactive material
reservoir
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2014518961A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014523969A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2012/044399 external-priority patent/WO2013003458A1/en
Publication of JP2014523969A publication Critical patent/JP2014523969A/ja
Publication of JP2014523969A5 publication Critical patent/JP2014523969A5/ja
Pending legal-status Critical Current

Links

JP2014518961A 2011-06-27 2012-06-27 スパッタリングターゲット Pending JP2014523969A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161501605P 2011-06-27 2011-06-27
US61/501,605 2011-06-27
PCT/US2012/044399 WO2013003458A1 (en) 2011-06-27 2012-06-27 Sputtering target

Publications (2)

Publication Number Publication Date
JP2014523969A JP2014523969A (ja) 2014-09-18
JP2014523969A5 true JP2014523969A5 (https=) 2015-08-20

Family

ID=46598921

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014518961A Pending JP2014523969A (ja) 2011-06-27 2012-06-27 スパッタリングターゲット

Country Status (6)

Country Link
US (1) US10138544B2 (https=)
EP (1) EP2723915A1 (https=)
JP (1) JP2014523969A (https=)
KR (1) KR101988391B1 (https=)
CN (1) CN103814151B (https=)
WO (1) WO2013003458A1 (https=)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5968808B2 (ja) * 2013-03-07 2016-08-10 Jx金属株式会社 インジウム製円筒形ターゲット部材及び円筒形ターゲット部材の製造方法
JP5941016B2 (ja) * 2013-05-27 2016-06-29 株式会社神戸製鋼所 成膜装置およびそれを用いた成膜方法
JP6305083B2 (ja) * 2014-02-04 2018-04-04 Jx金属株式会社 スパッタリングターゲット及び、それの製造方法
CN105349952A (zh) * 2015-11-09 2016-02-24 基迈克材料科技(苏州)有限公司 金属锂靶材铸造制备方法
CN108827994B (zh) * 2018-06-04 2020-06-19 西安交通大学 一种车载加速器中子源固态锂靶系统
KR101956017B1 (ko) * 2018-12-12 2019-03-08 (주)코아엔지니어링 스퍼터링용 로터리 타겟 어셈블리의 인듐 충진장치 및 충진방법
US12134125B2 (en) 2020-02-13 2024-11-05 Junora Ltd Systems and methods for casting sputtering targets
CN112962070B (zh) * 2021-02-02 2023-02-07 邱从章 一种溅射靶材的制备装备及其制备方法
CN113463047B (zh) * 2021-08-18 2024-09-24 先导电子科技股份有限公司 一种靶材制备电动辅助装置
CN120394829A (zh) * 2025-07-02 2025-08-01 兴化市三诚精密锻造有限公司 一种金属铸造用冷却装置

Family Cites Families (127)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH577864A5 (https=) 1974-05-29 1976-07-30 Sulzer Ag
ES8402188A1 (es) 1982-04-15 1984-01-16 Creusot Loire Procedimiento de fabricacion de un lingote hueco de acero.
US5215639A (en) 1984-10-09 1993-06-01 Genus, Inc. Composite sputtering target structures and process for producing such structures
DE3532131A1 (de) 1985-09-10 1987-03-12 Bayer Ag Verfahren zur gerichteten erstarrung von metallschmelzen
JPH086175B2 (ja) 1988-02-18 1996-01-24 三井造船株式会社 管材内面スパッタ用ターゲット
DE3912381A1 (de) 1988-04-15 1989-10-26 Sharp Kk Auffaengereinheit
JPH01290765A (ja) 1988-05-16 1989-11-22 Toshiba Corp スパッタリングターゲット
JPH02190470A (ja) 1989-01-13 1990-07-26 Matsushita Electric Ind Co Ltd スパッタ用ターゲット及びその製造方法
JPH02200775A (ja) * 1989-01-31 1990-08-09 Daido Steel Co Ltd スパッタリング用ターゲットおよびその製造方法
JPH02311394A (ja) 1989-05-25 1990-12-26 Daido Steel Co Ltd Wターゲット材
US5096562A (en) 1989-11-08 1992-03-17 The Boc Group, Inc. Rotating cylindrical magnetron structure for large area coating
JPH0539566A (ja) 1991-02-19 1993-02-19 Mitsubishi Materials Corp スパツタリング用ターゲツト及びその製造方法
US5171411A (en) * 1991-05-21 1992-12-15 The Boc Group, Inc. Rotating cylindrical magnetron structure with self supporting zinc alloy target
US5230459A (en) 1992-03-18 1993-07-27 Tosoh Smd, Inc. Method of bonding a sputter target-backing plate assembly assemblies produced thereby
DE4216870C2 (de) 1992-05-22 1994-08-11 Titan Aluminium Feingus Gmbh Verfahren zur Herstellung eines metallischen Gußkörpers nach dem Feingußverfahren
US5693203A (en) 1992-09-29 1997-12-02 Japan Energy Corporation Sputtering target assembly having solid-phase bonded interface
US5487822A (en) 1993-11-24 1996-01-30 Applied Materials, Inc. Integrated sputtering target assembly
US5433835B1 (en) 1993-11-24 1997-05-20 Applied Materials Inc Sputtering device and target with cover to hold cooling fluid
US5474667A (en) 1994-02-22 1995-12-12 Materials Research Corporation Reduced stress sputtering target and method of manufacturing therefor
US5836506A (en) 1995-04-21 1998-11-17 Sony Corporation Sputter target/backing plate assembly and method of making same
US5857611A (en) 1995-08-16 1999-01-12 Sony Corporation Sputter target/backing plate assembly and method of making same
US5591314A (en) 1995-10-27 1997-01-07 Morgan; Steven V. Apparatus for affixing a rotating cylindrical magnetron target to a spindle
US5830336A (en) 1995-12-05 1998-11-03 Minnesota Mining And Manufacturing Company Sputtering of lithium
GB9600210D0 (en) 1996-01-05 1996-03-06 Vanderstraeten E Bvba Improved sputtering targets and method for the preparation thereof
JPH10158829A (ja) 1996-12-04 1998-06-16 Sony Corp スパッタリングターゲット組立体の製造方法
US5963778A (en) 1997-02-13 1999-10-05 Tosoh Smd, Inc. Method for producing near net shape planar sputtering targets and an intermediate therefor
EP0918351A1 (en) 1997-11-19 1999-05-26 Sinvaco N.V. Improved planar magnetron with moving magnet assembly
US6579431B1 (en) 1998-01-14 2003-06-17 Tosoh Smd, Inc. Diffusion bonding of high purity metals and metal alloys to aluminum backing plates using nickel or nickel alloy interlayers
DE69928790T2 (de) 1998-04-16 2006-08-31 Bekaert Advanced Coatings N.V. Mittel zur kontrolle der targetabtragung und der zerstäubung in einem magnetron
US6287435B1 (en) 1998-05-06 2001-09-11 Tokyo Electron Limited Method and apparatus for ionized physical vapor deposition
EP0969238A1 (en) 1998-06-29 2000-01-05 Sinvaco N.V. Vacuum tight coupling for tube sections
US6183686B1 (en) 1998-08-04 2001-02-06 Tosoh Smd, Inc. Sputter target assembly having a metal-matrix-composite backing plate and methods of making same
US6451185B2 (en) 1998-08-12 2002-09-17 Honeywell International Inc. Diffusion bonded sputtering target assembly with precipitation hardened backing plate and method of making same
US6071389A (en) 1998-08-21 2000-06-06 Tosoh Smd, Inc. Diffusion bonded sputter target assembly and method of making
EP1135233A4 (en) 1998-12-03 2004-11-03 Tosoh Smd Inc INSERT TARGET AND METHOD FOR MANUFACTURING THE SAME
US6192969B1 (en) * 1999-03-22 2001-02-27 Asarco Incorporated Casting of high purity oxygen free copper
JP3967067B2 (ja) 1999-06-15 2007-08-29 東ソー株式会社 スパッタリングターゲット
EP1063679B1 (en) 1999-06-21 2008-01-09 Bekaert Advanced Coatings NV. Erosion profile compensated magnetron with moving magnet assembly
US6164519A (en) 1999-07-08 2000-12-26 Praxair S.T. Technology, Inc. Method of bonding a sputtering target to a backing plate
US6190516B1 (en) 1999-10-06 2001-02-20 Praxair S.T. Technology, Inc. High magnetic flux sputter targets with varied magnetic permeability in selected regions
DE19953470A1 (de) 1999-11-05 2001-05-23 Heraeus Gmbh W C Rohrtarget
US6878250B1 (en) 1999-12-16 2005-04-12 Honeywell International Inc. Sputtering targets formed from cast materials
KR100668126B1 (ko) 2000-05-12 2007-01-16 신닛뽄세이테쯔 카부시키카이샤 박육 주편 연속 주조용 냉각 드럼의 가공 장치
JP2001347356A (ja) 2000-06-07 2001-12-18 Mitsubishi Materials Corp 引け巣が無く表面が滑らかで皺の無い銅または銅合金インゴットの製造方法および装置
US6619537B1 (en) 2000-06-12 2003-09-16 Tosoh Smd, Inc. Diffusion bonding of copper sputtering targets to backing plates using nickel alloy interlayers
US6725522B1 (en) 2000-07-12 2004-04-27 Tosoh Smd, Inc. Method of assembling target and backing plates
KR20030024868A (ko) 2000-08-17 2003-03-26 토소우 에스엠디, 인크 수명-종료-표시를 갖는 고순도 스퍼터 타켓과 이의 제조방법
DE10043748B4 (de) * 2000-09-05 2004-01-15 W. C. Heraeus Gmbh & Co. Kg Zylinderförmiges Sputtertarget, Verfahren zu seiner Herstellung und Verwendung
EP1322444A4 (en) 2000-09-11 2008-01-23 Tosoh Smd Inc METHOD FOR MANUFACTURING CATHODIC SPUTTER TARGETS WITH INTERNAL COOLING CHANNELS
US6409897B1 (en) 2000-09-20 2002-06-25 Poco Graphite, Inc. Rotatable sputter target
JP3905301B2 (ja) 2000-10-31 2007-04-18 日鉱金属株式会社 タンタル又はタングステンターゲット−銅合金製バッキングプレート組立体及びその製造方法
AT4240U1 (de) 2000-11-20 2001-04-25 Plansee Ag Verfahren zur herstellung einer verdampfungsquelle
EP1349682B1 (en) 2000-12-18 2008-10-08 Tosoh Smd, Inc. Low temperature sputter target/backing plate joining technique and assemblies made thereby
DE10063383C1 (de) * 2000-12-19 2002-03-14 Heraeus Gmbh W C Verfahren zur Herstellung eines Rohrtargets und Verwendung
DE10102493B4 (de) 2001-01-19 2007-07-12 W.C. Heraeus Gmbh Rohrförmiges Target und Verfahren zur Herstellung eines solchen Targets
US6599405B2 (en) 2001-05-30 2003-07-29 Praxair S.T. Technology, Inc. Recessed sputter target
US7141812B2 (en) 2002-06-05 2006-11-28 Mikro Systems, Inc. Devices, methods, and systems involving castings
CN1289709C (zh) 2001-08-13 2006-12-13 贝卡尔特股份有限公司 用于制造溅射靶的方法
US6856444B2 (en) 2002-05-10 2005-02-15 Sage Electrochromics, Inc. Inferential temperature measurement of an electrochromic device
US6799627B2 (en) 2002-06-10 2004-10-05 Santoku America, Inc. Castings of metallic alloys with improved surface quality, structural integrity and mechanical properties fabricated in titanium carbide coated graphite molds under vacuum
US20040016635A1 (en) 2002-07-19 2004-01-29 Ford Robert B. Monolithic sputtering target assembly
AU2002368353A1 (en) 2002-11-07 2004-06-03 Honeywell International Inc. Die cast sputter targets
US20060207740A1 (en) * 2002-11-14 2006-09-21 Martin Weigert Processes for producing a sputtering target from a silicon-based alloy, a sputtering target
US6921470B2 (en) 2003-02-13 2005-07-26 Cabot Corporation Method of forming metal blanks for sputtering targets
US20040186810A1 (en) 2003-02-14 2004-09-23 Michaluk Christopher A. Method of supplying sputtering targets to fabricators and other users
DE602004020599D1 (de) 2003-03-25 2009-05-28 Bekaert Advanced Coatings Universelle vakuumskupplung für ein zylindrisches aufnahmeteil
JP2009513818A (ja) 2003-07-04 2009-04-02 ベーカート・アドヴァンスト・コーティングス 回転管状スパッタターゲット組立体
US20090078570A1 (en) 2003-08-11 2009-03-26 Wuwen Yi Target/backing plate constructions, and methods of forming target/backing plate constructions
US20050051606A1 (en) 2003-09-09 2005-03-10 Rene Perrot Method of manufacturing an extended life sputter target assembly and product thereof
JP2007517133A (ja) 2003-09-11 2007-06-28 ハネウェル・インターナショナル・インコーポレーテッド 粒子トラップを形成するために蒸着処理構成要素を処理する方法及び粒子トラップを表面上に有する蒸着処理構成要素
US6988306B2 (en) 2003-12-01 2006-01-24 Praxair Technology, Inc. High purity ferromagnetic sputter target, assembly and method of manufacturing same
JP2007529626A (ja) 2004-03-15 2007-10-25 ベーカート・アドヴァンスト・コーティングス スパッタターゲットの熱応力緩和方法
EP1733412A1 (en) 2004-04-05 2006-12-20 Bekaert Advanced Coatings A tubular magnet assembly
JP4531091B2 (ja) 2004-04-22 2010-08-25 ベカルト プログレッシブ コンポジッツ,リミテッド ライアビリティー カンパニー 円筒形ろ過カートリッジを保持する圧力容器
US20050236270A1 (en) 2004-04-23 2005-10-27 Heraeus, Inc. Controlled cooling of sputter targets
US7300617B2 (en) 2004-05-13 2007-11-27 David Gerling Method of making fusion cast articles
US20050279630A1 (en) 2004-06-16 2005-12-22 Dynamic Machine Works, Inc. Tubular sputtering targets and methods of flowforming the same
WO2006008197A1 (en) 2004-07-16 2006-01-26 Bekaert Advanced Coatings Cylindrical target obtained by hot isostatic pressing
JP5046334B2 (ja) 2004-10-11 2012-10-10 ソレラス・アドヴァンスト・コーティングス・ナムローゼ・フェンノートシャップ 長型ガス分配システム
PL1799876T3 (pl) 2004-10-18 2009-07-31 Bekaert Advanced Coatings Płaski blok końcowy do podtrzymywania obrotowego targetu do napylania
ATE392007T1 (de) 2004-10-18 2008-04-15 Bekaert Advanced Coatings Endblock für eine sputter-vorrichtung mit drehbarem target
EP1652564A1 (en) 2004-10-27 2006-05-03 Martin Eurlings Back-flush device
EP1652565A1 (en) 2004-10-27 2006-05-03 Martin Eurlings Cross flow filter device with concentric filter elements
DE102004060423B4 (de) 2004-12-14 2016-10-27 Heraeus Deutschland GmbH & Co. KG Rohrtarget und dessen Verwendung
WO2006071596A1 (en) 2004-12-27 2006-07-06 Cardinal Cg Company Oscillating shielded cylindrical target assemblies and their methods of use
US7372610B2 (en) 2005-02-23 2008-05-13 Sage Electrochromics, Inc. Electrochromic devices and methods
US20060201589A1 (en) 2005-03-11 2006-09-14 Honeywell International Inc. Components comprising metallic material, physical vapor deposition targets, thin films, and methods of forming metallic components
EP1856303B1 (en) 2005-03-11 2009-01-07 Bekaert Advanced Coatings Single, right-angled end-block
US7354659B2 (en) 2005-03-30 2008-04-08 Reactive Nanotechnologies, Inc. Method for fabricating large dimension bonds using reactive multilayer joining
US7757883B2 (en) 2005-04-11 2010-07-20 Bekaert Progressive Composites, Llc Side-ported filament wound pressure vessels
JP4820996B2 (ja) * 2005-05-30 2011-11-24 大学共同利用機関法人自然科学研究機構 希ガスの固定化装置及び固定化方法
WO2007003488A1 (en) 2005-06-30 2007-01-11 Bekaert Advanced Coatings A module for coating both sides of a substrate in a single pass
KR100674005B1 (ko) 2005-07-01 2007-01-24 주식회사 에스에프에이 스퍼터링 소스 및 이를 구비한 스퍼터
US20070017803A1 (en) 2005-07-22 2007-01-25 Heraeus, Inc. Enhanced sputter target manufacturing method
US20070062803A1 (en) 2005-09-20 2007-03-22 Cp Technologies, Inc. Device and method of manufacturing sputtering targets
US20070074969A1 (en) 2005-10-03 2007-04-05 Simpson Wayne R Very long cylindrical sputtering target and method for manufacturing
US7593154B2 (en) 2005-10-11 2009-09-22 Sage Electrochromics, Inc. Electrochromic devices having improved ion conducting layers
AT8697U1 (de) 2005-10-14 2006-11-15 Plansee Se Rohrtarget
WO2007074872A1 (ja) 2005-12-28 2007-07-05 Advanced Material Technology Co. Ltd. スパッタリングターゲット構造体
PL1813695T3 (pl) 2006-01-31 2013-04-30 Materion Advanced Materials Tech And Services Inc Rurowa tarcza do napylania katodowego o ulepszonej sztywności
EP1826292A1 (en) 2006-02-23 2007-08-29 Bekaert Advanced Coatings Sputter module.
CN101484605A (zh) 2006-06-02 2009-07-15 贝卡尔特先进涂层公司 可旋转溅射靶
WO2007141173A1 (en) 2006-06-02 2007-12-13 Bekaert Advanced Coatings A rotatable sputter target
JP5080573B2 (ja) 2006-06-19 2012-11-21 ソレラス・アドヴァンスト・コーティングス・ナムローゼ・フェンノートシャップ スパッタリング設備のエンドブロック用のインサート部品
JP4879986B2 (ja) 2006-06-29 2012-02-22 Jx日鉱日石金属株式会社 スパッタリングターゲット/バッキングプレート接合体
US20080041720A1 (en) 2006-08-14 2008-02-21 Jaeyeon Kim Novel manufacturing design and processing methods and apparatus for PVD targets
US20080112878A1 (en) 2006-11-09 2008-05-15 Honeywell International Inc. Alloy casting apparatuses and chalcogenide compound synthesis methods
EP2089764B1 (en) 2006-11-09 2016-01-06 Sage Electrochromics, Inc. Method of making an ion-switching device without a separate lithiation step
US20080110746A1 (en) 2006-11-09 2008-05-15 Kardokus Janine K Novel manufacturing design and processing methods and apparatus for sputtering targets
US8206646B2 (en) 2006-12-22 2012-06-26 Praxair Tecnology, Inc. Method for consolidating and diffusion-bonding powder metallurgy sputtering target
US20080236738A1 (en) 2007-03-30 2008-10-02 Chi-Fung Lo Bonded sputtering target and methods of manufacture
JP5467735B2 (ja) 2007-07-02 2014-04-09 東ソー株式会社 円筒形スパッタリングターゲット
US8702919B2 (en) 2007-08-13 2014-04-22 Honeywell International Inc. Target designs and related methods for coupled target assemblies, methods of production and uses thereof
US20090065354A1 (en) 2007-09-12 2009-03-12 Kardokus Janine K Sputtering targets comprising a novel manufacturing design, methods of production and uses thereof
DE102007044651B4 (de) 2007-09-18 2011-07-21 W.C. Heraeus GmbH, 63450 Rohrsputtertarget mit grabenförmig strukturierter Außenfläche des Trägerrohres sowie Verfahren zu seiner Herstellung
TW200914637A (en) 2007-09-27 2009-04-01 Bekaert Advanced Coatings Insert piece for an end-block of a sputtering installation
WO2009100985A1 (en) 2008-02-15 2009-08-20 Bekaert Advanced Coatings Nv Multiple grooved vacuum coupling
US8465654B2 (en) 2008-03-07 2013-06-18 Bekaert Advanced Filtration Sa Filter candle and mesh pack with a deformable seal, and method of filtering molten or dissolved polymers
US20100178525A1 (en) 2009-01-12 2010-07-15 Scott Campbell Method for making composite sputtering targets and the tartets made in accordance with the method
BRPI0911980A2 (pt) 2008-05-16 2015-10-13 Bekaert Advanced Coatings pulverização catódica rotativa de magnetron com alta rigidez
JP5387118B2 (ja) * 2008-06-10 2014-01-15 東ソー株式会社 円筒形スパッタリングターゲット及びその製造方法
CN102089455A (zh) 2008-07-08 2011-06-08 贝卡尔特先进涂层公司 一种制备包含第一相和第二相的氧化物溅射靶的方法
US9315663B2 (en) 2008-09-26 2016-04-19 Mikro Systems, Inc. Systems, devices, and/or methods for manufacturing castings
JP2010111943A (ja) 2008-10-10 2010-05-20 Hitachi Metals Ltd スパッタリングターゲット材の製造方法
EP2287356A1 (en) 2009-07-31 2011-02-23 Bekaert Advanced Coatings NV. Sputter target, method and apparatus for manufacturing sputter targets
EP2488677B1 (en) 2009-10-12 2013-08-28 Gradel S.à.r.L. Method and apparatus for production of rotatable sputtering targets
US20110089030A1 (en) * 2009-10-20 2011-04-21 Miasole CIG sputtering target and methods of making and using thereof

Similar Documents

Publication Publication Date Title
JP2014523969A5 (https=)
CN102032783B (zh) 熔炼钛或钛合金的冷坩埚感应熔炼拉锭方法
CN103147120B (zh) 一种高温合金的定向凝固装置
CN103691909B (zh) 一种铝/镁固液复合铸造成型方法
JPH10211565A (ja) 半溶融成形用金属の製造装置
US9376737B2 (en) Method for producing zinc alloy
JP2014523969A (ja) スパッタリングターゲット
EP2436461A3 (en) Unidirectional solidification process and apparatus therefor
EP1321208A3 (en) Method and apparatus for directionally solidified casting
CN104001906A (zh) 薄层快速凝固成型装置及方法
JP2013144313A5 (https=)
CN106825410A (zh) 制备定向镁合金的设备及方法
JP6171216B2 (ja) 半凝固金属の製造装置、半凝固金属の製造方法及び半凝固金属を用いた成形方法
CN106424666A (zh) 钢基双金属离心浇铸快速冷却兼淬火工艺
CN107677126A (zh) 一种电磁悬浮水冷铜坩埚
WO2015059531A1 (en) The pressure reactor for producing materials having directed porosity
RU2015147907A (ru) Способ разливки литийсодержащих алюминиевых сплавов
CN103949599A (zh) 一种棒状硅材料铸造模具及其铸造方法
JP2014014827A (ja) 半凝固金属の製造装置、半凝固成形装置、半凝固金属の製造方法及び半凝固成形方法
JP5956838B2 (ja) 半凝固金属の製造装置及び製造方法
CN205393483U (zh) 钛镍合金连铸用复合结晶器
CN104959575B (zh) 一种固‑液态连接异种大块非晶合金的方法
CN103639374A (zh) 一种制备半固态金属的振动倒锥形通道方法及装置
CN202116632U (zh) 镁合金真空熔炼装置
WO2010124073A3 (en) Improved process and apparatus for direct chill casting