JP2014199416A - 金属酸化物膜、半導体装置 - Google Patents

金属酸化物膜、半導体装置 Download PDF

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Publication number
JP2014199416A
JP2014199416A JP2013268875A JP2013268875A JP2014199416A JP 2014199416 A JP2014199416 A JP 2014199416A JP 2013268875 A JP2013268875 A JP 2013268875A JP 2013268875 A JP2013268875 A JP 2013268875A JP 2014199416 A JP2014199416 A JP 2014199416A
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Prior art keywords
oxide semiconductor
insulating film
film
oxide
layer
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Withdrawn
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JP2013268875A
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Japanese (ja)
Inventor
佑太 遠藤
Yuta Endo
佑太 遠藤
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Semiconductor Energy Laboratory Co Ltd
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Semiconductor Energy Laboratory Co Ltd
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Priority to JP2013268875A priority Critical patent/JP2014199416A/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • H10D86/423—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer comprising semiconductor materials not belonging to the Group IV, e.g. InGaZnO
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362—Active matrix addressed cells
    • G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6704—Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673—Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6733—Multi-gate TFTs
    • H10D30/6734—Multi-gate TFTs having gate electrodes arranged on both top and bottom sides of the channel, e.g. dual-gate TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6729—Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/6737—Thin-film transistors [TFT] characterised by the electrodes characterised by the electrode materials
    • H10D30/6739—Conductor-insulator-semiconductor electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/674—Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00—Field-effect transistors [FET]
    • H10D30/60—Insulated-gate field-effect transistors [IGFET]
    • H10D30/67—Thin-film transistors [TFT]
    • H10D30/6758—Thin-film transistors [TFT] characterised by the insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40—Crystalline structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/691—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator comprising metallic compounds, e.g. metal oxides or metal silicates 
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D64/00—Electrodes of devices having potential barriers
    • H10D64/60—Electrodes characterised by their materials
    • H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
    • H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
    • H10D64/693—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator the insulator comprising nitrogen, e.g. nitrides, oxynitrides or nitrogen-doped materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01—Manufacture or treatment
    • H10D86/021—Manufacture or treatment of multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
    • H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Nonlinear Science (AREA)
  • Geometry (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Optics & Photonics (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Thin Film Transistor (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
  • Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
  • Manufacturing & Machinery (AREA)
JP2013268875A 2012-12-28 2013-12-26 金属酸化物膜、半導体装置 Withdrawn JP2014199416A (ja)

Priority Applications (1)

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JP2013268875A JP2014199416A (ja) 2012-12-28 2013-12-26 金属酸化物膜、半導体装置

Applications Claiming Priority (5)

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JP2012288968 2012-12-28
JP2012288968 2012-12-28
JP2013049065 2013-03-12
JP2013049065 2013-03-12
JP2013268875A JP2014199416A (ja) 2012-12-28 2013-12-26 金属酸化物膜、半導体装置

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JP2015012681A Division JP6262162B2 (ja) 2012-12-28 2015-01-26 半導体装置

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JP2013268875A Withdrawn JP2014199416A (ja) 2012-12-28 2013-12-26 金属酸化物膜、半導体装置
JP2015012681A Active JP6262162B2 (ja) 2012-12-28 2015-01-26 半導体装置
JP2017238416A Active JP6553703B2 (ja) 2012-12-28 2017-12-13 半導体装置、発光装置
JP2019125491A Active JP6638108B2 (ja) 2012-12-28 2019-07-04 表示装置
JP2019231640A Active JP6686225B1 (ja) 2012-12-28 2019-12-23 表示装置
JP2020065781A Active JP6740499B2 (ja) 2012-12-28 2020-04-01 表示装置
JP2020125520A Active JP7145182B2 (ja) 2012-12-28 2020-07-22 表示装置
JP2022147645A Active JP7407253B2 (ja) 2012-12-28 2022-09-16 表示装置、電子機器
JP2023213130A Active JP7588706B2 (ja) 2012-12-28 2023-12-18 表示装置
JP2024197325A Active JP7720467B2 (ja) 2012-12-28 2024-11-12 表示装置
JP2025125334A Pending JP2025146931A (ja) 2012-12-28 2025-07-28 半導体装置

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JP2015012681A Active JP6262162B2 (ja) 2012-12-28 2015-01-26 半導体装置
JP2017238416A Active JP6553703B2 (ja) 2012-12-28 2017-12-13 半導体装置、発光装置
JP2019125491A Active JP6638108B2 (ja) 2012-12-28 2019-07-04 表示装置
JP2019231640A Active JP6686225B1 (ja) 2012-12-28 2019-12-23 表示装置
JP2020065781A Active JP6740499B2 (ja) 2012-12-28 2020-04-01 表示装置
JP2020125520A Active JP7145182B2 (ja) 2012-12-28 2020-07-22 表示装置
JP2022147645A Active JP7407253B2 (ja) 2012-12-28 2022-09-16 表示装置、電子機器
JP2023213130A Active JP7588706B2 (ja) 2012-12-28 2023-12-18 表示装置
JP2024197325A Active JP7720467B2 (ja) 2012-12-28 2024-11-12 表示装置
JP2025125334A Pending JP2025146931A (ja) 2012-12-28 2025-07-28 半導体装置

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US (2) US9196639B2 (enExample)
JP (11) JP2014199416A (enExample)
KR (9) KR102125690B1 (enExample)
CN (1) CN103915447B (enExample)
DE (2) DE102013226794B4 (enExample)
TW (1) TWI607510B (enExample)

Cited By (6)

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JP2016167592A (ja) * 2015-03-03 2016-09-15 株式会社半導体エネルギー研究所 酸化物半導体膜、該酸化物半導体膜を有する半導体装置、及び該半導体装置を有する表示装置
WO2020202902A1 (ja) * 2019-04-05 2020-10-08 ソニー株式会社 撮像素子、積層型撮像素子及び固体撮像装置、並びに、撮像素子の製造方法
JP2021136384A (ja) * 2020-02-28 2021-09-13 株式会社ジャパンディスプレイ 半導体基板及び表示装置
JP2022145780A (ja) * 2017-03-13 2022-10-04 株式会社半導体エネルギー研究所 半導体装置
JP2025028983A (ja) * 2015-02-13 2025-03-05 株式会社半導体エネルギー研究所 表示装置
US12295163B2 (en) 2021-12-16 2025-05-06 Asm Ip Holding B.V. Formation of gate stacks comprising a threshold voltage tuning layer

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KR102770182B1 (ko) 2012-12-28 2025-02-18 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치, 및 반도체 장치의 제작 방법
US9269315B2 (en) 2013-03-08 2016-02-23 Semiconductor Energy Laboratory Co., Ltd. Driving method of semiconductor device
US9293480B2 (en) 2013-07-10 2016-03-22 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and display device including the semiconductor device
KR102244553B1 (ko) * 2013-08-23 2021-04-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 용량 소자 및 반도체 장치
JP2015179247A (ja) 2013-10-22 2015-10-08 株式会社半導体エネルギー研究所 表示装置
JP6506545B2 (ja) 2013-12-27 2019-04-24 株式会社半導体エネルギー研究所 半導体装置
TWI657488B (zh) * 2014-03-20 2019-04-21 日商半導體能源研究所股份有限公司 半導體裝置、具有該半導體裝置的顯示裝置、具有該顯示裝置的顯示模組以及具有該半導體裝置、該顯示裝置和該顯示模組的電子裝置
KR102268641B1 (ko) 2014-07-10 2021-06-23 현대모비스 주식회사 어라운드 뷰 시스템 및 그 동작방법
KR102401993B1 (ko) 2014-08-01 2022-05-25 올싸거널 인코포레이티드 장치의 포토리소그래피 패터닝
JP6653315B2 (ja) * 2014-08-01 2020-02-26 オーソゴナル，インコーポレイテッド 有機電子デバイスのフォトリソグラフィック・パターニング
KR102401991B1 (ko) 2014-08-01 2022-05-25 올싸거널 인코포레이티드 유기 전자 장치의 포토리소그래피 패터닝
EP3175497A4 (en) 2014-08-01 2018-11-21 Orthogonal Inc. Photolithographic patterning of devices
US9766517B2 (en) 2014-09-05 2017-09-19 Semiconductor Energy Laboratory Co., Ltd. Display device and display module
WO2016076168A1 (ja) * 2014-11-11 2016-05-19 シャープ株式会社 半導体装置およびその製造方法
CN111933668A (zh) 2014-12-29 2020-11-13 株式会社半导体能源研究所 半导体装置
WO2016128854A1 (en) * 2015-02-12 2016-08-18 Semiconductor Energy Laboratory Co., Ltd. Oxide semiconductor film and semiconductor device
CN106558620B (zh) * 2015-09-29 2021-09-07 联华电子股份有限公司 半导体元件及其形成方法
WO2017109642A1 (ja) * 2015-12-24 2017-06-29 株式会社半導体エネルギー研究所 金属酸化物膜、および半導体装置
US20170229554A1 (en) * 2016-02-05 2017-08-10 Applied Materials, Inc. High-k dielectric materials utilized in display devices
FR3050338B1 (fr) * 2016-04-15 2023-01-06 Enerbee Generateur d'electricite comprenant un convertisseur magneto-electrique et procede de fabrication associe
JP6870926B2 (ja) * 2016-06-22 2021-05-12 株式会社半導体エネルギー研究所 表示装置、表示モジュール、および電子機器
US20180047692A1 (en) * 2016-08-10 2018-02-15 Amkor Technology, Inc. Method and System for Packing Optimization of Semiconductor Devices
JP6698486B2 (ja) * 2016-09-26 2020-05-27 株式会社ジャパンディスプレイ 表示装置
CN107579006B (zh) * 2017-09-13 2019-08-06 京东方科技集团股份有限公司 一种薄膜晶体管、阵列基板及其制备方法
CN108585853B (zh) * 2017-12-11 2021-12-24 上海大学 一种铕掺杂氧化钪闪烁体及其制备方法和用途
US11978723B2 (en) * 2021-03-31 2024-05-07 Taiwan Semiconductor Manufacturing Company, Ltd. Vertical interconnect structures in three-dimensional integrated circuits
KR20240154164A (ko) * 2023-04-18 2024-10-25 한양대학교 산학협력단 적층형 다중 채널 구조체 및 그 제조 방법, 그리고 이를 포함하는 박막 트랜지스터

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JP2012134467A (ja) * 2010-11-30 2012-07-12 Semiconductor Energy Lab Co Ltd 半導体装置の作製方法
JP2012151461A (ja) * 2010-12-28 2012-08-09 Semiconductor Energy Lab Co Ltd 半導体装置、及び半導体装置の作製方法

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