JP2014013795A - ベース基板、電子デバイスおよび電子機器 - Google Patents

ベース基板、電子デバイスおよび電子機器 Download PDF

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Publication number
JP2014013795A
JP2014013795A JP2012149808A JP2012149808A JP2014013795A JP 2014013795 A JP2014013795 A JP 2014013795A JP 2012149808 A JP2012149808 A JP 2012149808A JP 2012149808 A JP2012149808 A JP 2012149808A JP 2014013795 A JP2014013795 A JP 2014013795A
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JP
Japan
Prior art keywords
film
metal film
electronic device
layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2012149808A
Other languages
English (en)
Japanese (ja)
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JP2014013795A5 (https=
Inventor
Naohiro Nakagawa
尚広 中川
Tomoyuki Kamakura
知之 鎌倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2012149808A priority Critical patent/JP2014013795A/ja
Priority to CN201310247006.4A priority patent/CN103531705B/zh
Priority to US13/924,994 priority patent/US20140009875A1/en
Publication of JP2014013795A publication Critical patent/JP2014013795A/ja
Publication of JP2014013795A5 publication Critical patent/JP2014013795A5/ja
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Chemically Coating (AREA)
JP2012149808A 2012-07-03 2012-07-03 ベース基板、電子デバイスおよび電子機器 Withdrawn JP2014013795A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2012149808A JP2014013795A (ja) 2012-07-03 2012-07-03 ベース基板、電子デバイスおよび電子機器
CN201310247006.4A CN103531705B (zh) 2012-07-03 2013-06-20 基底基板、电子器件和电子设备
US13/924,994 US20140009875A1 (en) 2012-07-03 2013-06-24 Base substrate, electronic device, and electronic apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012149808A JP2014013795A (ja) 2012-07-03 2012-07-03 ベース基板、電子デバイスおよび電子機器

Publications (2)

Publication Number Publication Date
JP2014013795A true JP2014013795A (ja) 2014-01-23
JP2014013795A5 JP2014013795A5 (https=) 2015-07-09

Family

ID=49878363

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012149808A Withdrawn JP2014013795A (ja) 2012-07-03 2012-07-03 ベース基板、電子デバイスおよび電子機器

Country Status (3)

Country Link
US (1) US20140009875A1 (https=)
JP (1) JP2014013795A (https=)
CN (1) CN103531705B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013172442A1 (ja) * 2012-05-18 2013-11-21 株式会社村田製作所 水晶振動子
KR101375956B1 (ko) * 2012-07-05 2014-03-18 엘에스산전 주식회사 자동차용 전장부품 박스
JP6318682B2 (ja) * 2014-02-19 2018-05-09 セイコーエプソン株式会社 圧電アクチュエーター、及び液体噴射ヘッド
JP6468054B2 (ja) * 2015-04-28 2019-02-13 富士通株式会社 プリント基板及びシールド板金固定方法
US20170092838A1 (en) * 2015-09-29 2017-03-30 Seiko Epson Corporation Piezoelectric driving apparatus, method of manufacturing the same, motor, robot, and pump
JP6348534B2 (ja) * 2016-04-21 2018-06-27 田中貴金属工業株式会社 貫通孔の封止構造及び封止方法、並びに、貫通孔を封止するための転写基板
US11309251B2 (en) 2017-07-31 2022-04-19 AdTech Ceramics Company Selective metallization of integrated circuit packages
US20240304539A1 (en) * 2023-03-10 2024-09-12 Advanced Technical Ceramics Company Metal-ceramic mixed package substrate plated with non-magnetic layer stack

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111188A (ja) * 2000-10-04 2002-04-12 Kyocera Corp 配線基板
JP2004247649A (ja) * 2003-02-17 2004-09-02 Kyocera Corp 電子部品収納用パッケージ
JP2006032554A (ja) * 2004-07-14 2006-02-02 Japan Radio Co Ltd 電子部品の製造方法
JP2008177261A (ja) * 2007-01-17 2008-07-31 Okuno Chem Ind Co Ltd 多層めっき皮膜及びプリント配線板
JP2008311316A (ja) * 2007-06-12 2008-12-25 Tokuyama Corp メタライズド基板およびその製造方法
JP2010004216A (ja) * 2008-06-19 2010-01-07 Seiko Instruments Inc 電子部品およびその電子部品を有する電子回路基板
JP2011119615A (ja) * 2009-12-07 2011-06-16 Shinko Electric Ind Co Ltd 配線基板及びその製造方法並びに半導体パッケージ

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676812A (en) * 1990-03-24 1997-10-14 Canon Kabushiki Kaisha Electronic equipment with an adhesive member to intercept electromagnetic waves
EP0582411A3 (en) * 1992-07-31 1995-02-22 Gen Electric Chemical metallization processes.
JP2000252380A (ja) * 1999-02-25 2000-09-14 Mitsui Chemicals Inc はんだ接続用パッドおよびそのはんだ接続用パッドを用いた半導体搭載用基板
US6259161B1 (en) * 1999-06-18 2001-07-10 Mitsubishi Denki Kabushiki Kaisha Circuit electrode connected to a pattern formed on an organic substrate and method of forming the same
JP2001313305A (ja) * 2000-02-25 2001-11-09 Murata Mfg Co Ltd 電子部品素子、電子部品装置および通信機装置
US20040126548A1 (en) * 2001-05-28 2004-07-01 Waseda University ULSI wiring and method of manufacturing the same
JP3761023B2 (ja) * 2001-11-20 2006-03-29 セイコーエプソン株式会社 圧電デバイス及びその製造方法
JP2005072282A (ja) * 2003-08-25 2005-03-17 Kyocera Corp 配線基板
JP2006111960A (ja) * 2004-09-17 2006-04-27 Shinko Electric Ind Co Ltd 非シアン無電解金めっき液及び無電解金めっき方法
WO2006040847A1 (ja) * 2004-10-14 2006-04-20 Ibiden Co., Ltd. プリント配線板及びプリント配線板の製造方法
WO2008038681A1 (en) * 2006-09-26 2008-04-03 Hitachi Metals, Ltd. Ceramic substrate component and electronic component using the same
JP5983336B2 (ja) * 2011-11-17 2016-08-31 Tdk株式会社 被覆体及び電子部品
JP6155551B2 (ja) * 2012-04-10 2017-07-05 セイコーエプソン株式会社 電子デバイス、電子機器および電子デバイスの製造方法
JP6024242B2 (ja) * 2012-07-02 2016-11-09 セイコーエプソン株式会社 電子デバイスの製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002111188A (ja) * 2000-10-04 2002-04-12 Kyocera Corp 配線基板
JP2004247649A (ja) * 2003-02-17 2004-09-02 Kyocera Corp 電子部品収納用パッケージ
JP2006032554A (ja) * 2004-07-14 2006-02-02 Japan Radio Co Ltd 電子部品の製造方法
JP2008177261A (ja) * 2007-01-17 2008-07-31 Okuno Chem Ind Co Ltd 多層めっき皮膜及びプリント配線板
JP2008311316A (ja) * 2007-06-12 2008-12-25 Tokuyama Corp メタライズド基板およびその製造方法
JP2010004216A (ja) * 2008-06-19 2010-01-07 Seiko Instruments Inc 電子部品およびその電子部品を有する電子回路基板
JP2011119615A (ja) * 2009-12-07 2011-06-16 Shinko Electric Ind Co Ltd 配線基板及びその製造方法並びに半導体パッケージ

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Publication number Publication date
CN103531705B (zh) 2017-03-01
CN103531705A (zh) 2014-01-22
US20140009875A1 (en) 2014-01-09

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