CN103531705B - 基底基板、电子器件和电子设备 - Google Patents

基底基板、电子器件和电子设备 Download PDF

Info

Publication number
CN103531705B
CN103531705B CN201310247006.4A CN201310247006A CN103531705B CN 103531705 B CN103531705 B CN 103531705B CN 201310247006 A CN201310247006 A CN 201310247006A CN 103531705 B CN103531705 B CN 103531705B
Authority
CN
China
Prior art keywords
film
metal film
electronic device
substrate
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310247006.4A
Other languages
English (en)
Chinese (zh)
Other versions
CN103531705A (zh
Inventor
中川尚广
镰仓知之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN103531705A publication Critical patent/CN103531705A/zh
Application granted granted Critical
Publication of CN103531705B publication Critical patent/CN103531705B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/15—Containers comprising an insulating or insulated base
    • H10W76/153—Containers comprising an insulating or insulated base having interconnections in passages through the insulating or insulated base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10075—Non-printed oscillator
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10371—Shields or metal cases
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
    • Y10T428/12611—Oxide-containing component
    • Y10T428/12618—Plural oxides
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension
    • Y10T428/263—Coating layer not in excess of 5 mils thick or equivalent
    • Y10T428/264—Up to 3 mils
    • Y10T428/265—1 mil or less

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Chemically Coating (AREA)
CN201310247006.4A 2012-07-03 2013-06-20 基底基板、电子器件和电子设备 Expired - Fee Related CN103531705B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012149808A JP2014013795A (ja) 2012-07-03 2012-07-03 ベース基板、電子デバイスおよび電子機器
JP2012-149808 2012-07-03

Publications (2)

Publication Number Publication Date
CN103531705A CN103531705A (zh) 2014-01-22
CN103531705B true CN103531705B (zh) 2017-03-01

Family

ID=49878363

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310247006.4A Expired - Fee Related CN103531705B (zh) 2012-07-03 2013-06-20 基底基板、电子器件和电子设备

Country Status (3)

Country Link
US (1) US20140009875A1 (https=)
JP (1) JP2014013795A (https=)
CN (1) CN103531705B (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013172442A1 (ja) * 2012-05-18 2013-11-21 株式会社村田製作所 水晶振動子
KR101375956B1 (ko) * 2012-07-05 2014-03-18 엘에스산전 주식회사 자동차용 전장부품 박스
JP6318682B2 (ja) * 2014-02-19 2018-05-09 セイコーエプソン株式会社 圧電アクチュエーター、及び液体噴射ヘッド
JP6468054B2 (ja) * 2015-04-28 2019-02-13 富士通株式会社 プリント基板及びシールド板金固定方法
US20170092838A1 (en) * 2015-09-29 2017-03-30 Seiko Epson Corporation Piezoelectric driving apparatus, method of manufacturing the same, motor, robot, and pump
JP6348534B2 (ja) * 2016-04-21 2018-06-27 田中貴金属工業株式会社 貫通孔の封止構造及び封止方法、並びに、貫通孔を封止するための転写基板
US11309251B2 (en) 2017-07-31 2022-04-19 AdTech Ceramics Company Selective metallization of integrated circuit packages
US20240304539A1 (en) * 2023-03-10 2024-09-12 Advanced Technical Ceramics Company Metal-ceramic mixed package substrate plated with non-magnetic layer stack

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319948A (zh) * 2000-02-25 2001-10-31 株式会社村田制作所 电子元件,电子装置和通信设备

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5676812A (en) * 1990-03-24 1997-10-14 Canon Kabushiki Kaisha Electronic equipment with an adhesive member to intercept electromagnetic waves
EP0582411A3 (en) * 1992-07-31 1995-02-22 Gen Electric Chemical metallization processes.
JP2000252380A (ja) * 1999-02-25 2000-09-14 Mitsui Chemicals Inc はんだ接続用パッドおよびそのはんだ接続用パッドを用いた半導体搭載用基板
US6259161B1 (en) * 1999-06-18 2001-07-10 Mitsubishi Denki Kabushiki Kaisha Circuit electrode connected to a pattern formed on an organic substrate and method of forming the same
JP2002111188A (ja) * 2000-10-04 2002-04-12 Kyocera Corp 配線基板
US20040126548A1 (en) * 2001-05-28 2004-07-01 Waseda University ULSI wiring and method of manufacturing the same
JP3761023B2 (ja) * 2001-11-20 2006-03-29 セイコーエプソン株式会社 圧電デバイス及びその製造方法
JP4028808B2 (ja) * 2003-02-17 2007-12-26 京セラ株式会社 電子部品収納用パッケージ
JP2005072282A (ja) * 2003-08-25 2005-03-17 Kyocera Corp 配線基板
JP4012527B2 (ja) * 2004-07-14 2007-11-21 日本無線株式会社 電子部品の製造方法
JP2006111960A (ja) * 2004-09-17 2006-04-27 Shinko Electric Ind Co Ltd 非シアン無電解金めっき液及び無電解金めっき方法
WO2006040847A1 (ja) * 2004-10-14 2006-04-20 Ibiden Co., Ltd. プリント配線板及びプリント配線板の製造方法
WO2008038681A1 (en) * 2006-09-26 2008-04-03 Hitachi Metals, Ltd. Ceramic substrate component and electronic component using the same
JP5288362B2 (ja) * 2007-01-17 2013-09-11 奥野製薬工業株式会社 多層めっき皮膜及びプリント配線板
JP5214179B2 (ja) * 2007-06-12 2013-06-19 株式会社トクヤマ メタライズド基板およびその製造方法
JP2010004216A (ja) * 2008-06-19 2010-01-07 Seiko Instruments Inc 電子部品およびその電子部品を有する電子回路基板
JP5590869B2 (ja) * 2009-12-07 2014-09-17 新光電気工業株式会社 配線基板及びその製造方法並びに半導体パッケージ
JP5983336B2 (ja) * 2011-11-17 2016-08-31 Tdk株式会社 被覆体及び電子部品
JP6155551B2 (ja) * 2012-04-10 2017-07-05 セイコーエプソン株式会社 電子デバイス、電子機器および電子デバイスの製造方法
JP6024242B2 (ja) * 2012-07-02 2016-11-09 セイコーエプソン株式会社 電子デバイスの製造方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1319948A (zh) * 2000-02-25 2001-10-31 株式会社村田制作所 电子元件,电子装置和通信设备

Also Published As

Publication number Publication date
JP2014013795A (ja) 2014-01-23
CN103531705A (zh) 2014-01-22
US20140009875A1 (en) 2014-01-09

Similar Documents

Publication Publication Date Title
CN103531705B (zh) 基底基板、电子器件和电子设备
CN103524149B (zh) 基底基板、电子器件及其制造方法以及电子设备
US9148956B2 (en) Base substrate, electronic device, and method of manufacturing base substrate
CN103368517B (zh) 电子器件、电子设备以及电子器件的制造方法
CN103367627B (zh) 电子器件及其制造方法、电子设备、基底基板的制造方法
US20150357254A1 (en) Substrate for electronic device package, electronic device package, electronic device, and method of manufacturing electronic device
JP2013211441A (ja) パッケージ、パッケージの製造方法、電子デバイスおよび電子機器
JP2015231009A (ja) 電子デバイスパッケージ用基板および電子デバイスパッケージ用基板の製造方法
US20150070855A1 (en) Circuit board, method for manufacturing circuit board, electronic device, electronic apparatus, and moving object
JP2014200042A (ja) 電子部品、電子部品の製造方法、電子機器および移動体
JP2015231001A (ja) 電子デバイスおよび電子デバイスの製造方法
JP2015231191A (ja) 電子デバイスおよび電子デバイスの製造方法
JP6866588B2 (ja) 電子デバイス、電子デバイスの製造方法、電子機器および移動体
JP2014197581A (ja) 蓋体集合体、パッケージの製造方法および電子デバイスの製造方法
CN106052666B (zh) 电子器件、电子器件的制造方法、电子设备以及移动体
JP2015056577A (ja) 回路基板の製造方法、回路基板、電子デバイス、電子機器および移動体
JP2015231010A (ja) 電子デバイスパッケージ用基板、電子デバイスパッケージ、電子デバイスおよび電子デバイスの製造方法
JP6089481B2 (ja) 電子部品の製造方法および電子モジュールの製造方法
JP2015231002A (ja) 電子デバイス用パッケージの製造方法
JP2015213230A (ja) 電子部品、電子部品の製造方法、電子機器および移動体
JP2014175674A (ja) 振動子、振動子の製造方法、発振器、電子機器および移動体
JP2014192438A (ja) パッケージの製造方法、電子デバイスの製造方法、電子デバイス、電子機器および移動体
JP2014192505A (ja) パッケージの製造方法、電子デバイスの製造方法、電子デバイス、電子機器および移動体
JP2013187702A (ja) 電子部品の製造方法、電子部品および電子機器

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170301

Termination date: 20210620