JP5214179B2 - メタライズド基板およびその製造方法 - Google Patents
メタライズド基板およびその製造方法 Download PDFInfo
- Publication number
- JP5214179B2 JP5214179B2 JP2007155706A JP2007155706A JP5214179B2 JP 5214179 B2 JP5214179 B2 JP 5214179B2 JP 2007155706 A JP2007155706 A JP 2007155706A JP 2007155706 A JP2007155706 A JP 2007155706A JP 5214179 B2 JP5214179 B2 JP 5214179B2
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- Prior art keywords
- plating layer
- nickel
- plating
- layer
- phosphorous
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims description 92
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000007747 plating Methods 0.000 claims description 423
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 177
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 125
- 239000010931 gold Substances 0.000 claims description 114
- 229910052737 gold Inorganic materials 0.000 claims description 111
- 229910052759 nickel Inorganic materials 0.000 claims description 88
- 239000003870 refractory metal Substances 0.000 claims description 64
- 238000009792 diffusion process Methods 0.000 claims description 51
- 230000009467 reduction Effects 0.000 claims description 35
- 230000002265 prevention Effects 0.000 claims description 34
- 238000010438 heat treatment Methods 0.000 claims description 29
- 238000000034 method Methods 0.000 claims description 28
- QDWJUBJKEHXSMT-UHFFFAOYSA-N boranylidynenickel Chemical compound [Ni]#B QDWJUBJKEHXSMT-UHFFFAOYSA-N 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- 239000012298 atmosphere Substances 0.000 claims description 20
- 239000000919 ceramic Substances 0.000 claims description 16
- 238000006467 substitution reaction Methods 0.000 claims description 15
- 230000007935 neutral effect Effects 0.000 claims description 14
- 238000007772 electroless plating Methods 0.000 claims description 12
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 claims description 8
- OFNHPGDEEMZPFG-UHFFFAOYSA-N phosphanylidynenickel Chemical compound [P].[Ni] OFNHPGDEEMZPFG-UHFFFAOYSA-N 0.000 claims description 8
- 230000002378 acidificating effect Effects 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 3
- 229910052750 molybdenum Inorganic materials 0.000 claims description 3
- 239000011733 molybdenum Substances 0.000 claims description 3
- 229910052721 tungsten Inorganic materials 0.000 claims description 3
- 239000010937 tungsten Substances 0.000 claims description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 17
- 239000004065 semiconductor Substances 0.000 description 16
- 238000006073 displacement reaction Methods 0.000 description 14
- 239000002253 acid Substances 0.000 description 11
- 238000004140 cleaning Methods 0.000 description 11
- 229910052763 palladium Inorganic materials 0.000 description 9
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 6
- 238000002844 melting Methods 0.000 description 6
- 230000008018 melting Effects 0.000 description 6
- 238000009713 electroplating Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 238000009864 tensile test Methods 0.000 description 5
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229910052698 phosphorus Inorganic materials 0.000 description 4
- 239000011574 phosphorus Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- SIWVEOZUMHYXCS-UHFFFAOYSA-N oxo(oxoyttriooxy)yttrium Chemical compound O=[Y]O[Y]=O SIWVEOZUMHYXCS-UHFFFAOYSA-N 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- KWSLGOVYXMQPPX-UHFFFAOYSA-N 5-[3-(trifluoromethyl)phenyl]-2h-tetrazole Chemical compound FC(F)(F)C1=CC=CC(C2=NNN=N2)=C1 KWSLGOVYXMQPPX-UHFFFAOYSA-N 0.000 description 1
- 229910001020 Au alloy Inorganic materials 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- RJTANRZEWTUVMA-UHFFFAOYSA-N boron;n-methylmethanamine Chemical compound [B].CNC RJTANRZEWTUVMA-UHFFFAOYSA-N 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910052576 carbides based ceramic Inorganic materials 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000003353 gold alloy Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- -1 palladium ions Chemical class 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/03—Alloys based on nickel or cobalt based on nickel
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C27/00—Alloys based on rhenium or a refractory metal not mentioned in groups C22C14/00 or C22C16/00
- C22C27/04—Alloys based on tungsten or molybdenum
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C32/00—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ
- C22C32/0047—Non-ferrous alloys containing at least 5% by weight but less than 50% by weight of oxides, carbides, borides, nitrides, silicides or other metal compounds, e.g. oxynitrides, sulfides, whether added as such or formed in situ with carbides, nitrides, borides or silicides as the main non-metallic constituents
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/04—Alloys based on a platinum group metal
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/4501—Shape
- H01L2224/45012—Cross-sectional shape
- H01L2224/45015—Cross-sectional shape being circular
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
- H01L2224/48599—Principal constituent of the connecting portion of the wire connector being Gold (Au)
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/485—Material
- H01L2224/48505—Material at the bonding interface
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Description
熱処理した下地ニッケルメッキ層(30)上に、無電解ニッケル−リンメッキを以下の(a)または(b)のいずれかの条件で施して、層状ニッケル−リンメッキ層(40)を形成する工程、
(a)酸性ニッケル−リンメッキ浴を用いてメッキをする、
(b)中性ニッケル−リンメッキ浴を用いてメッキをし、その後、450℃以上900℃以下の還元性雰囲気で熱処理する、
層状ニッケル−リンメッキ層(40)上に、以下の(c)〜(e)のいずれかの方法により、拡散防止メッキ層(50)を形成する工程、
(c)無電解メッキにより、中性のニッケル−リンメッキ浴を用いて、柱状ニッケル−リンメッキ層を形成する、
(d)無電解パラジウム−リンメッキを施す、
(e)無電解パラジウム金属メッキを施す、
拡散防止メッキ層(50)上に無電解金メッキを施して金メッキ層(60)を形成する工程、
を備えて構成される、メタライズド基板(100)の製造方法である。
図1に層構成を模式的に示したように、本発明のメタライズド基板100は、高融点金属層20を備えたセラミックス基板10の高融点金属層20上に、下地ニッケルメッキ層30、層状ニッケル−リンメッキ層40、拡散防止メッキ層50、および、金メッキ層60が順に形成された構成を有している。
セラミックス基板10を構成するセラミックス材料は、特に限定されず、例えば、(i)酸化アルミニウム、酸化ベリリウム、ムライトなどの酸化物系セラミックス、(ii)窒化アルミニウム、窒化ケイ素などの窒化物系セラミックス、(iii)炭化ケイ素などの炭化物系セラミックス、(iv)アルミナやシリカなどをベースにしたガラスセラミックスを挙げることができる。この中でも、放熱性の高い基板を作製するという観点からは、窒化アルミニウムを用いることが好ましい。
下地ニッケルメッキ層30としては、ニッケル金属メッキ層、ニッケル−ホウ素メッキ層、または、ニッケル−コバルトメッキ層を挙げることができる。下地ニッケルメッキ層30は、高融点金属層20と層状ニッケル−リンメッキ層40との密着性を向上させるために形成される層である。一方で、下地ニッケルメッキ層30は還元雰囲気での加熱処理を行わなければ高融点金属層20と高い密着力は得られないため、下地ニッケルメッキ層30を形成したのち、加熱処理を行わなければならない。このため熱処理を行っても溶融しないような金属が求められ、耐熱性の高いニッケル金属メッキ層、ニッケル−ホウ素メッキ層、ニッケル−コバルトメッキ層が好ましい。
下地ニッケルメッキ層30上には、層状ニッケル−リンメッキ層40が形成される。層状ニッケル−メッキ層40は、下地ニッケルメッキ層30と、その上の拡散防止メッキ層50との密着性を良好にするための層である。例えば、上記した下地ニッケルメッキ層30の上に直接拡散防止メッキ層50を形成したとすると、ワイヤボンディング時において下地ニッケルメッキ層30と拡散防止メッキ層50との間の密着性が十分なものとならず、層間で剥離する場合がある。あるいは、拡散防止メッキ層50上への金メッキ処理において拡散防止メッキ層50が浸食され、金メッキ液が下地ニッケルメッキ層30を浸食し層間で剥離する場合がある。特に、拡散防止メッキ層50を下記に詳述する柱状ニッケル−リンメッキ層とすることにより、高い耐熱性が得られることが分ったが、この柱状ニッケル−リンメッキ層は無電解金メッキ層によって浸食されやすく、層状ニッケル−リンメッキ層40が形成されていなければ、浸食された部分を起点にワイヤボンディングで剥がれが発生し易い場合があった。層状ニッケル−リンメッキ層40は、このような層間剥離を防止することができる。
層状ニッケル−リンメッキ層40の上には、拡散防止メッキ層50が形成される。拡散防止メッキ層50は、柱状ニッケル−リンメッキ層、パラジウム−リンメッキ層、パラジウム金属メッキ層のいずれかであり、いずれの層も、下層のニッケル成分が金メッキ層60中に拡散するのを防止することができる。
拡散防止メッキ層50上には、金メッキ層60が形成される。金メッキには、純金メッキの他、金を主成分とする金合金からなるメッキも含まれる。金メッキ層60はメッキの最表層であり、この上に半導体チップが接合されたり、ワイヤボンディングされたりする。金メッキ層60の厚みは、特に限定されないが、ワイヤボンディング性、経済性の点から、0.1μm以上、1.0μm以下とすることが好ましい。
本発明のメタライズド基板100の製造方法は、セラミックス基板10上に形成された高融点金属層20上に、下地ニッケルメッキ層30を形成する工程、所定条件で熱処理する工程、層状ニッケル−リンメッキ層40を形成する工程、拡散防止メッキ層50を形成する工程、および金メッキ層60を形成する工程、を備えて構成される。各工程の詳細は、以上において説明した通りである。
以下本発明を実施例により説明するが、本発明はこれら実施例に限定されるものではない。
平均粒径1.5μmの窒化アルミニウム粉末および焼結助剤として酸化イットリウムを添加し焼結して得た窒化アルミニウム焼結体基板からなる原料基板を準備した。また、平均粒径2μmのタングステン粉末を86質量%、一次平均粒径0.6μmの窒化アルミニウム粉末を7質量%、酸化イットリウム粉末を1質量%、他にバインダーとしてエチルセルロース、可塑剤、分散剤を加え、自動乳鉢、続いて三本ロールミルにて混練を行い粘度120Pa・sの高融点金属ペーストを準備した。
耐熱性を評価するために、得られたメタライズド基板を350℃、大気中10分間で加熱したのち、25μmの金線を用いてワイヤーボンドを20点実施し、ワイヤーボンド後、ワイヤーの引張り破壊モードを確認した。結果を表1に示すが良好なワイヤーボンド性を有していた。20点のうち不着であったものはなく、全てワイヤーがネック切れしていた。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、酸洗浄を行い、pH6.5の中性無電解ニッケル−リンメッキ液を用いて、2μmの柱状ニッケル−リンメッキ層を形成し、水素ガス雰囲気中、500℃で5分熱処理を行い、これを2μmの層状ニッケル−リンメッキ層とした。さらに、無電解パラジウム−リンメッキ液を用いて、拡散防止メッキ層として0.15μmのパラジウム−リンメッキ層を形成した。そして、無電解置換金メッキ液および還元金メッキ液を用いて、0.3μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、酸洗浄を行い、pH5.0の酸性無電解ニッケル−リンメッキ液を用いて、2μmの層状ニッケル−リンメッキ層を形成した。さらに、pH6.5の中性無電解ニッケル−リンメッキ液を用いて、拡散防止メッキ層として0.3μmの柱状ニッケル−リンメッキ層を形成した。そして、無電解置換金メッキ液および還元金メッキ液を用いて、0.5μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、酸洗浄を行い、pH6.5の中性無電解ニッケル−リンメッキ液を用いて、2μmの柱状ニッケル−リンメッキ層を形成し、水素ガス雰囲気中、500℃で5分熱処理を行い、これを2μmの層状ニッケル−リンメッキ層とした。さらに、pH6.5の中性無電解ニッケル−リンメッキ液を用いて、拡散防止メッキ層として0.3μmの柱状ニッケル−リンメッキ層を形成した。そして、無電解置換還元金メッキ液および還元金メッキ液を用いて、0.5μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様にして、高融点金属を有するメタライズド基板を作製した。その後、電極にニッケル電極を用いたバレル電解メッキで、高融点金属層上にニッケル膜を1.2μm被覆し、水素ガス雰囲気中、850℃で2時間加熱処理を行い下地ニッケルメッキ層を形成した。
実施例1と同様に高融点金属を有するメタライズド基板を作製した。その後、電極にコバルト含有のニッケル電極を用いてバレル電解メッキで、高融点金属層上にニッケル−コバルト膜を1.2μm被覆し、水素ガス雰囲気中、850℃で2時間加熱処理を行ない下地ニッケルメッキ層を形成した。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、実施例1と同様に、2μmの層状ニッケル−リンメッキ層を形成した。さらに、ニッケル−リンメッキ層上に、置換タイプの無電解パラジウムメッキ液を用いて、拡散防止メッキ層として0.1μmのパラジウムメッキ層を形成した。最後に、無電解置換還元金メッキ液および還元金メッキ液を用いて、0.3μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、酸洗浄を行い、pH6.5の中性無電解ニッケル−リンメッキ液を用いて、2μmの柱状ニッケル−リンメッキ層を形成した。そして、拡散防止メッキ層を形成せずに、無電解置換金メッキ液および還元金メッキ液を用いて、0.5μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、酸洗浄を行い、pH6.5の中性無電解ニッケル−リンメッキ液を用いて、0.3μmの柱状ニッケル−リンメッキ層を形成した。そして、無電解置換金メッキ液および還元金メッキ液を用いて、0.5μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、酸洗浄を行い、pH5.0の酸性無電解ニッケル−リンメッキ液を用いて、2μmの層状ニッケル−リンメッキ層を形成した。そして、拡散防止メッキ層を形成せずに、無電解置換金メッキ液および還元金メッキ液を用いて、0.5μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、酸洗浄を行い、pH5.0の酸性無電解ニッケル−リンメッキ液を用いて、2μmの層状ニッケル−リンメッキ層を形成した。そして、拡散防止メッキ層を形成せずに、無電解置換還元金メッキ液および還元金メッキ液を用いて、0.5μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様に高融点金属を有するメタライズ基板を作製した。その後、下地ニッケルメッキ層を形成せずに、高融点金属層上に、pH5.0の無電解ニッケル−リンメッキ液を用いて、2μmの層状ニッケル−リンメッキ層を形成した。さらに、ニッケル−リンメッキ層上に、無電解パラジウム−リンメッキ液を用いて、拡散防止メッキ層として0.15μmのパラジウム−リンメッキ層を形成した。そして、無電解置換還元金メッキ液および還元金メッキ液を用いて、0.3μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様に、高融点金属を有するメタライズ基板を作製した。その後、無電解メッキシステムを用いて、2μmのニッケル−ホウ素メッキ層を形成した。さらに、ニッケル−ホウ素メッキ層上に、無電解パラジウム−リンメッキ液を用いて、拡散防止メッキ層として0.15μmのパラジウム−リンメッキ層を形成した。そして、無電解置換還元金メッキ液および還元金メッキ液を用いて、0.3μmの金メッキ層を形成し、メタライズド基板を作製した。
実施例1と同様にして、高融点金属層を有する基板を作製し、高融点金属層上に実施例1と同様に下地ニッケルメッキ層を形成した。その後、酸洗浄を行ったのち、無電解メッキシステムを用いて、2μmのニッケル−ホウ素メッキ層を形成した。さらに、無電解パラジウム−リンメッキ液を用いて、拡散防止メッキ層として0.15μmのパラジウム−リンメッキ層を形成した。そして、無電解置換還元金メッキ液および還元金メッキ液を用いて、0.3μmの金メッキ層を形成し、メタライズド基板を作製した。
20 高融点金属層
30 下地ニッケルメッキ層
40 層状ニッケル−リンメッキ層
50 拡散防止メッキ層
60 金メッキ層
100 メタライズド基板
Claims (8)
- セラミックス基板上に形成された高融点金属層上に、下地ニッケルメッキ層、層状ニッケル−リンメッキ層、拡散防止メッキ層、および金メッキ層をこの順で備え、
前記下地ニッケルメッキ層が、ニッケル金属メッキ層、ニッケル−ホウ素メッキ層、またはニッケル−コバルトメッキ層のいずれかであり、
前記拡散防止メッキ層が、柱状ニッケル−リンメッキ層である、
メタライズド基板。 - 前記高融点金属層が、タングステンまたはモリブデンからなる層である、請求項1に記載のメタライズド基板。
- 前記下地ニッケルメッキ層が、ニッケル−ホウ素メッキ層である、請求項1または2に記載のメタライズド基板。
- 前記金メッキ層が、置換型金メッキ層または置換還元型金メッキ層、およびその上に形成された還元型金メッキ層の二層構成である、請求項1〜3のいずれかに記載のメタライズド基板。
- 前記金メッキ層の膜厚が0.1μm以上1.0μm以下である請求項1〜4のいずれかに記載のメタライズド基板。
- セラミックス基板上に形成された高融点金属層上に、無電解ニッケル−ホウ素メッキ、電解ニッケル金属メッキ、または電解ニッケル−コバルトメッキを施して、下地ニッケルメッキ層を形成する工程、
前記下地ニッケルメッキ層を形成した基板を、700℃以上900℃以下の還元性雰囲気下で熱処理する工程、
前記熱処理した下地ニッケルメッキ層上に、無電解ニッケル−リンメッキを以下の(a)または(b)のいずれかの条件で施して、層状ニッケル−リンメッキ層を形成する工程、
(a)酸性ニッケル−リンメッキ浴を用いてメッキをする、
(b)中性ニッケル−リンメッキ浴を用いてメッキをし、その後、450℃以上900℃
以下の還元性雰囲気で熱処理する、
前記層状ニッケル−リンメッキ層上に、以下の(c)の方法により、拡散防止メッキ層を形成する工程、
(c)無電解メッキにより、中性のニッケル−リンメッキ浴を用いて、柱状ニッケル−リンメッキ層を形成する、
前記拡散防止メッキ層上に無電解金メッキを施して金メッキ層を形成する工程、
を備えて構成される、メタライズド基板の製造方法。 - 前記下地ニッケルメッキ層を形成する工程が、無電解ニッケル−ホウ素メッキを施す工程である、請求項6に記載のメタライズド基板の製造方法。
- 前記金メッキ層を形成する工程が、前記拡散防止メッキ層上にまず置換型金メッキまたは置換還元型金メッキを施し、その後、還元型金メッキを施す二段工程である、請求項6または7に記載のメタライズド基板の製造方法。
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US8946663B2 (en) * | 2012-05-15 | 2015-02-03 | Spansion Llc | Soft error resistant circuitry |
JP2014013795A (ja) * | 2012-07-03 | 2014-01-23 | Seiko Epson Corp | ベース基板、電子デバイスおよび電子機器 |
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JP2016058737A (ja) * | 2014-09-11 | 2016-04-21 | 日本特殊陶業株式会社 | セラミック配線基板の製造方法 |
CN105200400B (zh) * | 2015-09-18 | 2017-09-22 | 中国电子科技集团公司第三十八研究所 | 一种高温共烧陶瓷表面二次金属化镀镍的方法 |
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