JP4663975B2 - 電子部品用パッケージ - Google Patents
電子部品用パッケージ Download PDFInfo
- Publication number
- JP4663975B2 JP4663975B2 JP2003400508A JP2003400508A JP4663975B2 JP 4663975 B2 JP4663975 B2 JP 4663975B2 JP 2003400508 A JP2003400508 A JP 2003400508A JP 2003400508 A JP2003400508 A JP 2003400508A JP 4663975 B2 JP4663975 B2 JP 4663975B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- package
- thickness
- layer
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Electroplating Methods And Accessories (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
2,42 パッケージ本体
4 メタライズ層
7 貫通孔
21,51 放熱部材
31,32 Niメッキ層
33 Auメッキ層
S 電子部品
Claims (3)
- パッケージ本体に銅又は銅合金からなる放熱部材が接合され、該放熱部材の表面に、該パッケージ本体に形成されたメタライズ層の表面と同時に、ニッケルメッキが複数回かけられてなる電子部品用パッケージにおいて、
1回目にかけられるニッケルメッキ層の厚さを1.5〜2.5μmとしたことを特徴とする電子部品用パッケージ。 - パッケージ本体に銅又は銅合金からなる放熱部材が接合され、該放熱部材の表面に、該パッケージ本体に形成されたメタライズ層の表面と同時に、ニッケルメッキが複数回かけられてなる電子部品用パッケージにおいて、
1回目にかけられるニッケルメッキ層の厚さを1.5〜2.0μmとしたことを特徴とする電子部品用パッケージ。 - 前記ニッケルメッキ層が、Ni−Coメッキで形成されていることを特徴とする請求項1又は2に記載の電子部品用パッケージ。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003400508A JP4663975B2 (ja) | 2003-11-28 | 2003-11-28 | 電子部品用パッケージ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003400508A JP4663975B2 (ja) | 2003-11-28 | 2003-11-28 | 電子部品用パッケージ |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP29447398A Division JP3512653B2 (ja) | 1998-09-30 | 1998-09-30 | 電子部品用パッケージの製造方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2004080060A JP2004080060A (ja) | 2004-03-11 |
JP2004080060A5 JP2004080060A5 (ja) | 2005-12-22 |
JP4663975B2 true JP4663975B2 (ja) | 2011-04-06 |
Family
ID=32025987
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003400508A Expired - Fee Related JP4663975B2 (ja) | 2003-11-28 | 2003-11-28 | 電子部品用パッケージ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4663975B2 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3764160B2 (ja) | 2004-09-10 | 2006-04-05 | 三井金属鉱業株式会社 | キャパシタ層形成材及びキャパシタ層形成材を用いて得られる内蔵キャパシタ回路を備えるプリント配線板。 |
JP4765099B2 (ja) * | 2005-10-28 | 2011-09-07 | 富士電機株式会社 | 半導体装置およびその製造方法 |
US20080298024A1 (en) * | 2007-05-31 | 2008-12-04 | A.L.M.T. Corp. | Heat spreader and method for manufacturing the same, and semiconductor device |
JP5747805B2 (ja) * | 2011-12-12 | 2015-07-15 | 株式会社デンソー | 電子装置 |
-
2003
- 2003-11-28 JP JP2003400508A patent/JP4663975B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2004080060A (ja) | 2004-03-11 |
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