JP2014003050A - 熱処理方法および熱処理装置 - Google Patents
熱処理方法および熱処理装置 Download PDFInfo
- Publication number
- JP2014003050A JP2014003050A JP2012135417A JP2012135417A JP2014003050A JP 2014003050 A JP2014003050 A JP 2014003050A JP 2012135417 A JP2012135417 A JP 2012135417A JP 2012135417 A JP2012135417 A JP 2012135417A JP 2014003050 A JP2014003050 A JP 2014003050A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- dielectric constant
- heat treatment
- substrate
- constant film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 158
- 238000000034 method Methods 0.000 title claims abstract description 51
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 104
- 150000002367 halogens Chemical class 0.000 claims abstract description 104
- 239000007789 gas Substances 0.000 claims abstract description 86
- 238000000137 annealing Methods 0.000 claims abstract description 71
- 230000008569 process Effects 0.000 claims abstract description 28
- 230000001678 irradiating effect Effects 0.000 claims abstract description 24
- 238000002425 crystallisation Methods 0.000 claims abstract description 19
- 230000008025 crystallization Effects 0.000 claims abstract description 19
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 14
- 239000001257 hydrogen Substances 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims description 56
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 16
- RAHZWNYVWXNFOC-UHFFFAOYSA-N Sulphur dioxide Chemical compound O=S=O RAHZWNYVWXNFOC-UHFFFAOYSA-N 0.000 claims description 16
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 239000002184 metal Substances 0.000 claims description 11
- 238000012545 processing Methods 0.000 claims description 11
- 150000002431 hydrogen Chemical class 0.000 claims description 9
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 8
- 229910021529 ammonia Inorganic materials 0.000 claims description 8
- 239000010936 titanium Substances 0.000 claims description 8
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical compound S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 claims description 7
- 229910000041 hydrogen chloride Inorganic materials 0.000 claims description 7
- IXCSERBJSXMMFS-UHFFFAOYSA-N hydrogen chloride Substances Cl.Cl IXCSERBJSXMMFS-UHFFFAOYSA-N 0.000 claims description 7
- 239000001272 nitrous oxide Substances 0.000 claims description 7
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 6
- 229910000037 hydrogen sulfide Inorganic materials 0.000 claims description 6
- 239000010955 niobium Substances 0.000 claims description 6
- 230000001737 promoting effect Effects 0.000 claims description 6
- 229910052719 titanium Inorganic materials 0.000 claims description 6
- -1 MoSiN Inorganic materials 0.000 claims description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910004491 TaAlN Inorganic materials 0.000 claims description 5
- 229910004200 TaSiN Inorganic materials 0.000 claims description 5
- 229910008482 TiSiN Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- 229910008807 WSiN Inorganic materials 0.000 claims description 5
- 229910052735 hafnium Inorganic materials 0.000 claims description 5
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 claims description 5
- QRXWMOHMRWLFEY-UHFFFAOYSA-N isoniazide Chemical compound NNC(=O)C1=CC=NC=C1 QRXWMOHMRWLFEY-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 229910052758 niobium Inorganic materials 0.000 claims description 5
- GUCVJGMIXFAOAE-UHFFFAOYSA-N niobium atom Chemical compound [Nb] GUCVJGMIXFAOAE-UHFFFAOYSA-N 0.000 claims description 5
- 229910052715 tantalum Inorganic materials 0.000 claims description 5
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 5
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 5
- 229910052721 tungsten Inorganic materials 0.000 claims description 5
- 239000010937 tungsten Substances 0.000 claims description 5
- LEONUFNNVUYDNQ-UHFFFAOYSA-N vanadium atom Chemical compound [V] LEONUFNNVUYDNQ-UHFFFAOYSA-N 0.000 claims description 5
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052720 vanadium Inorganic materials 0.000 claims description 4
- 229910052726 zirconium Inorganic materials 0.000 claims description 4
- 150000002739 metals Chemical class 0.000 claims description 3
- 238000003672 processing method Methods 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 abstract description 124
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 54
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 35
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 30
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 29
- 229910001873 dinitrogen Inorganic materials 0.000 abstract description 19
- 239000000377 silicon dioxide Substances 0.000 abstract description 19
- 230000007547 defect Effects 0.000 abstract description 9
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 9
- 238000012546 transfer Methods 0.000 description 55
- 230000007246 mechanism Effects 0.000 description 47
- 239000010453 quartz Substances 0.000 description 16
- 230000002093 peripheral effect Effects 0.000 description 13
- 230000005855 radiation Effects 0.000 description 12
- 239000003990 capacitor Substances 0.000 description 11
- 239000011521 glass Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 7
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 6
- 230000008859 change Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 229910052724 xenon Inorganic materials 0.000 description 5
- 238000000231 atomic layer deposition Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-OUBTZVSYSA-N Deuterium Chemical compound [2H] YZCKVEUIGOORGS-OUBTZVSYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- YZCKVEUIGOORGS-NJFSPNSNSA-N Tritium Chemical compound [3H] YZCKVEUIGOORGS-NJFSPNSNSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000004397 blinking Effects 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052805 deuterium Inorganic materials 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229910052722 tritium Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- PNDPGZBMCMUPRI-UHFFFAOYSA-N iodine Chemical compound II PNDPGZBMCMUPRI-UHFFFAOYSA-N 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- VSZWPYCFIRKVQL-UHFFFAOYSA-N selanylidenegallium;selenium Chemical compound [Se].[Se]=[Ga].[Se]=[Ga] VSZWPYCFIRKVQL-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
- H01L21/02318—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment
- H01L21/02356—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer post-treatment treatment to change the morphology of the insulating layer, e.g. transformation of an amorphous layer into a crystalline layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/2636—Bombardment with radiation with high-energy radiation for heating, e.g. electron beam heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
- H01L21/2686—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation using incoherent radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28176—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation with a treatment, e.g. annealing, after the formation of the definitive gate conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28158—Making the insulator
- H01L21/28167—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation
- H01L21/28185—Making the insulator on single crystalline silicon, e.g. using a liquid, i.e. chemical oxidation with a treatment, e.g. annealing, after the formation of the gate insulator and before the formation of the definitive gate conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/0033—Heating devices using lamps
- H05B3/0038—Heating devices using lamps for industrial applications
- H05B3/0047—Heating devices using lamps for industrial applications for semiconductor manufacture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/49—Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
- H01L29/51—Insulating materials associated therewith
- H01L29/517—Insulating materials associated therewith the insulating material comprising a metallic compound, e.g. metal oxide, metal silicate
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- High Energy & Nuclear Physics (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
- Formation Of Insulating Films (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Ceramic Engineering (AREA)
Abstract
【解決手段】高誘電率膜のゲートが形成された半導体ウェハーの表面にフラッシュ光を照射して、当該表面を短時間にて目標温度T2に加熱することにより、下地の二酸化ケイ素膜の成長を抑制しつつ、高誘電率膜の結晶化を促進することができる。続いて、フラッシュ加熱後の半導体ウェハーにハロゲンランプから光を照射することによってその温度をアニール温度T3に維持している。フラッシュ加熱後のアニール処理は水素ガスと窒素ガスとの混合ガスの雰囲気中にて実行される。水素−窒素混合ガスの雰囲気中にて半導体ウェハーをアニール処理することにより、高誘電率膜の界面近傍に存在していた欠陥を水素終端によって消失させることができ、高誘電率膜の界面特性を改善することができる。
【選択図】図11
Description
2 シャッター機構
3 制御部
4 ハロゲン加熱部
5 フラッシュ加熱部
6 チャンバー
7 保持部
10 移載機構
61 チャンバー側部
62 凹部
63 上側チャンバー窓
64 下側チャンバー窓
65 熱処理空間
74 サセプター
91 トリガー電極
92 ガラス管
93 コンデンサ
94 コイル
96 IGBT
97 トリガー回路
111 基材
116 二酸化ケイ素の膜
117 高誘電率膜
118 ゲート電極
180 雰囲気形成機構
FL フラッシュランプ
HL ハロゲンランプ
W 半導体ウェハー
Claims (12)
- 高誘電率膜を形成した基板に光を照射して加熱することによって前記高誘電率膜の結晶化を促進する熱処理方法であって、
前記高誘電率膜が形成された基板の表面にフラッシュランプからフラッシュ光を照射することによって前記高誘電率膜を含む前記基板の表面を第1の温度に加熱するフラッシュ加熱工程と、
前記基板にハロゲンランプから光を照射することによって前記基板の温度を前記第1の温度よりも低い第2の温度に維持するアニール工程と、
を備え、
前記アニール工程は、水素、アンモニア、塩化水素、二酸化硫黄、亜酸化窒素、硫化水素からなる群から選択されたいずれかのガスを含む雰囲気中にて実行されることを特徴とする熱処理方法。 - 請求項1記載の熱処理方法において、
前記アニール工程では、前記基板の温度を300℃以上700℃以下に2秒以上30分以下維持することを特徴とする熱処理方法。 - 請求項1または請求項2記載の熱処理方法において、
前記アニール工程は前記フラッシュ加熱工程の後に実行されることを特徴とする熱処理方法。 - 請求項3記載の熱処理方法において、
前記フラッシュ加熱工程の前に前記基板に前記ハロゲンランプから光を照射することによって前記基板の温度を前記第2の温度に加熱する予備加熱工程をさらに備えることを特徴とする熱処理方法。 - 請求項1から請求項4のいずれかに記載の熱処理方法において、
前記高誘電率膜の上に、チタン、ジルコニウム、ハフニウム、バナジウム、ニオブ、タンタル、モリブデン、タングステンからなる群から選択された1種以上の金属を含むゲート電極を形成することを特徴とする熱処理方法。 - 請求項1から請求項5のいずれかに記載の熱処理方法において、
前記高誘電率膜は、TiN、ZrN、HfN、VN、NbN、TaN、MoN、WN、TiSiN、HfSiN、VSiN、NbSiN、TaSiN、MoSiN、WSiN、HfAlN、VAlN、NbAlN、TaAlN、MoAlN、WAlNからなる群から選択された1種以上を含むことを特徴とする熱処理方法。 - 高誘電率膜を形成した基板に光を照射して加熱することによって前記高誘電率膜の結晶化を促進する熱処理装置であって、
前記高誘電率膜が形成された基板を収容するチャンバーと、
前記チャンバー内にて前記基板を保持する保持手段と、
前記保持手段に保持された前記基板の表面にフラッシュ光を照射して前記高誘電率膜を含む前記基板の表面を第1の温度に加熱するフラッシュランプと、
前記保持手段に保持された基板に光を照射するハロゲンランプと、
前記チャンバー内に、水素、アンモニア、塩化水素、二酸化硫黄、亜酸化窒素、硫化水素からなる群から選択されたいずれかのガスを供給して当該ガスを含む雰囲気を形成する雰囲気形成手段と、
前記チャンバー内に前記ガスを含む雰囲気形成しつつ、前記基板に前記ハロゲンランプから光を照射することによって前記基板の温度を前記第1の温度よりも低い第2の温度に維持するように前記ハロゲンランプの発光および前記雰囲気形成手段を制御する制御手段と、
を備えることを特徴とする熱処理装置。 - 請求項7記載の熱処理装置において、
前記第2の温度は300℃以上700℃以下であり、
前記制御手段は、前記基板を前記第2の温度に2秒以上30分以下維持するように前記ハロゲンランプの発光を制御することを特徴とする熱処理装置。 - 請求項7または請求項8記載の熱処理装置において、
前記制御手段は、前記フラッシュランプからのフラッシュ光照射によって前記基板の表面が前記第1の温度に加熱された後に、前記基板を前記第2の温度に維持するように前記ハロゲンランプの発光を制御することを特徴とする熱処理装置。 - 請求項9記載の熱処理装置において、
前記制御手段は、前記フラッシュランプからのフラッシュ光照射によって前記基板の表面が前記第1の温度に加熱される前に、前記基板が前記第2の温度に加熱されるように前記ハロゲンランプの発光を制御することを特徴とする熱処理装置。 - 請求項7から請求項10のいずれかに記載の熱処理装置において、
前記高誘電率膜の上には、チタン、ジルコニウム、ハフニウム、バナジウム、ニオブ、タンタル、モリブデン、タングステンからなる群から選択された1種以上の金属を含むゲート電極が形成されていることを特徴とする熱処理装置。 - 請求項7から請求項11のいずれかに記載の熱処理装置において、
前記高誘電率膜は、TiN、ZrN、HfN、VN、NbN、TaN、MoN、WN、TiSiN、HfSiN、VSiN、NbSiN、TaSiN、MoSiN、WSiN、HfAlN、VAlN、NbAlN、TaAlN、MoAlN、WAlNからなる群から選択された1種以上を含むことを特徴とする熱処理装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012135417A JP5955658B2 (ja) | 2012-06-15 | 2012-06-15 | 熱処理方法および熱処理装置 |
TW102118474A TWI543265B (zh) | 2012-06-15 | 2013-05-24 | 熱處理方法及熱處理裝置 |
KR20130066463A KR101483861B1 (ko) | 2012-06-15 | 2013-06-11 | 열처리 방법 및 열처리 장치 |
US13/914,698 US9023740B2 (en) | 2012-06-15 | 2013-06-11 | Heat treatment method and heat treatment apparatus for heating substrate by irradiating substrate with light |
US14/688,426 US20150221533A1 (en) | 2012-06-15 | 2015-04-16 | Heat treatment method and heat treatment apparatus for heating substrate by irradiating substrate with light |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012135417A JP5955658B2 (ja) | 2012-06-15 | 2012-06-15 | 熱処理方法および熱処理装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2014003050A true JP2014003050A (ja) | 2014-01-09 |
JP5955658B2 JP5955658B2 (ja) | 2016-07-20 |
Family
ID=49756291
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012135417A Active JP5955658B2 (ja) | 2012-06-15 | 2012-06-15 | 熱処理方法および熱処理装置 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9023740B2 (ja) |
JP (1) | JP5955658B2 (ja) |
KR (1) | KR101483861B1 (ja) |
TW (1) | TWI543265B (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016127194A (ja) * | 2015-01-07 | 2016-07-11 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP2016181641A (ja) * | 2015-03-25 | 2016-10-13 | 株式会社Screenホールディングス | 熱処理装置 |
JP2017045982A (ja) * | 2015-08-26 | 2017-03-02 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP2017092099A (ja) * | 2015-11-04 | 2017-05-25 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP2018046141A (ja) * | 2016-09-14 | 2018-03-22 | 株式会社Screenホールディングス | 熱処理装置 |
JP2018157064A (ja) * | 2017-03-17 | 2018-10-04 | 株式会社Screenホールディングス | 熱処理装置および放射温度計の測定位置調整方法 |
JP2019068107A (ja) * | 2019-01-21 | 2019-04-25 | 株式会社Screenホールディングス | 熱処理方法およびゲート形成方法 |
JP2020010047A (ja) * | 2019-08-26 | 2020-01-16 | 株式会社Screenホールディングス | 熱処理方法 |
JP2020009927A (ja) * | 2018-07-09 | 2020-01-16 | フェニックス電機株式会社 | 加熱用ledランプ、およびそれを備えるウエハ加熱ユニット |
WO2020158318A1 (ja) * | 2019-01-29 | 2020-08-06 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
US10790171B2 (en) | 2015-08-26 | 2020-09-29 | SCREEN Holdings Co., Ltd. | Light-irradiation heat treatment method and heat treatment apparatus |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI566300B (zh) | 2011-03-23 | 2017-01-11 | 斯克林集團公司 | 熱處理方法及熱處理裝置 |
JP5955658B2 (ja) * | 2012-06-15 | 2016-07-20 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
US9484243B2 (en) | 2014-04-17 | 2016-11-01 | Lam Research Corporation | Processing chamber with features from side wall |
CN104332431B (zh) * | 2014-09-10 | 2016-10-19 | 中国电子科技集团公司第四十八研究所 | 一种led芯片退火装置 |
EP3247688A4 (en) * | 2015-01-23 | 2018-01-24 | Hewlett-Packard Development Company, L.P. | Susceptor materials for 3d printing using microwave processing |
US9859121B2 (en) * | 2015-06-29 | 2018-01-02 | International Business Machines Corporation | Multiple nanosecond laser pulse anneal processes and resultant semiconductor structure |
JP6560550B2 (ja) | 2015-07-06 | 2019-08-14 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP6654374B2 (ja) | 2015-08-17 | 2020-02-26 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
US9741576B2 (en) | 2015-08-26 | 2017-08-22 | SCREEN Holdings Co., Ltd. | Light irradiation type heat treatment method and heat treatment apparatus |
JP6652886B2 (ja) * | 2015-08-26 | 2020-02-26 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
KR102446726B1 (ko) | 2015-09-11 | 2022-09-26 | 삼성전자주식회사 | 투명 플레이트 및 그를 포함하는 기판 처리 장치 |
JP6839939B2 (ja) * | 2016-07-26 | 2021-03-10 | 株式会社Screenホールディングス | 熱処理方法 |
JP6278498B1 (ja) * | 2017-05-19 | 2018-02-14 | 日本新工芯技株式会社 | リング状部材の製造方法及びリング状部材 |
JP2019149521A (ja) * | 2018-02-28 | 2019-09-05 | 株式会社Screenホールディングス | 熱処理方法 |
WO2021009377A1 (en) * | 2019-07-17 | 2021-01-21 | Oerlikon Surface Solutions Ag, Pfäffikon | Method for producing coatings with adapted coating properties |
CN110993532B (zh) * | 2019-12-03 | 2022-08-16 | 拓荆科技股份有限公司 | 用于半导体制造的化学品加热装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001267565A (ja) * | 2000-02-14 | 2001-09-28 | Internatl Business Mach Corp <Ibm> | Mosfetデバイスを形成する方法 |
US20020081826A1 (en) * | 2000-12-21 | 2002-06-27 | Rotondaro Antonio L. P. | Annealing of high-K dielectric materials |
JP2007123662A (ja) * | 2005-10-31 | 2007-05-17 | Renesas Technology Corp | 半導体装置の製造方法および半導体装置 |
US20070134942A1 (en) * | 2005-12-08 | 2007-06-14 | Micron Technology, Inc. | Hafnium tantalum titanium oxide films |
WO2012014642A1 (ja) * | 2010-07-28 | 2012-02-02 | 独立行政法人産業技術総合研究所 | ゲートスタック形成方法 |
JP2012028716A (ja) * | 2010-07-28 | 2012-02-09 | National Institute Of Advanced Industrial & Technology | 半導体装置及びその製造方法 |
JP2012104808A (ja) * | 2010-10-14 | 2012-05-31 | Dainippon Screen Mfg Co Ltd | 熱処理装置および熱処理方法 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69125323T2 (de) * | 1990-07-24 | 1997-09-25 | Semiconductor Energy Lab | Verfahren zum Herstellen isolierender Filme, Kapazitäten und Halbleiteranordnungen |
JPH07335904A (ja) * | 1994-06-14 | 1995-12-22 | Semiconductor Energy Lab Co Ltd | 薄膜半導体集積回路 |
KR0165484B1 (ko) * | 1995-11-28 | 1999-02-01 | 김광호 | 탄탈륨산화막 증착 형성방법 및 그 장치 |
JP2001044387A (ja) | 1999-07-28 | 2001-02-16 | Hitachi Ltd | 半導体集積回路装置の製造方法 |
JP2002329668A (ja) | 2001-02-23 | 2002-11-15 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
SG114529A1 (en) | 2001-02-23 | 2005-09-28 | Semiconductor Energy Lab | Method of manufacturing a semiconductor device |
US6884719B2 (en) * | 2001-03-20 | 2005-04-26 | Mattson Technology, Inc. | Method for depositing a coating having a relatively high dielectric constant onto a substrate |
US7199027B2 (en) | 2001-07-10 | 2007-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor film by plasma CVD using a noble gas and nitrogen |
JP4212844B2 (ja) | 2001-07-10 | 2009-01-21 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
US20030082909A1 (en) * | 2001-10-30 | 2003-05-01 | Tingkai Li | High-k gate oxides with buffer layers of titanium for MFOS single transistor memory applications |
US6849831B2 (en) * | 2002-03-29 | 2005-02-01 | Mattson Technology, Inc. | Pulsed processing semiconductor heating methods using combinations of heating sources |
US8000584B1 (en) * | 2002-04-26 | 2011-08-16 | Tivo Inc. | Approach for storing digital content onto digital versatile discs (DVDs) |
JP3929939B2 (ja) * | 2003-06-25 | 2007-06-13 | 株式会社東芝 | 処理装置、製造装置、処理方法及び電子装置の製造方法 |
JP2005191482A (ja) * | 2003-12-26 | 2005-07-14 | Semiconductor Leading Edge Technologies Inc | 半導体装置及びその製造方法 |
WO2006137287A1 (ja) * | 2005-06-22 | 2006-12-28 | Hitachi Kokusai Electric Inc. | 半導体装置の製造方法および基板処理装置 |
JP5465373B2 (ja) * | 2007-09-12 | 2014-04-09 | 大日本スクリーン製造株式会社 | 熱処理装置 |
JP5356725B2 (ja) * | 2008-05-13 | 2013-12-04 | 大日本スクリーン製造株式会社 | 熱処理装置 |
JP5401244B2 (ja) | 2009-10-01 | 2014-01-29 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
TWI566300B (zh) * | 2011-03-23 | 2017-01-11 | 斯克林集團公司 | 熱處理方法及熱處理裝置 |
US8809175B2 (en) * | 2011-07-15 | 2014-08-19 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods of anneal after deposition of gate layers |
JP2013058559A (ja) * | 2011-09-07 | 2013-03-28 | Tokyo Electron Ltd | 半導体装置の製造方法及び基板処理システム |
US8921238B2 (en) * | 2011-09-19 | 2014-12-30 | United Microelectronics Corp. | Method for processing high-k dielectric layer |
JP6026090B2 (ja) * | 2011-09-26 | 2016-11-16 | 株式会社Screenホールディングス | 熱処理方法 |
JP2013084902A (ja) * | 2011-09-26 | 2013-05-09 | Dainippon Screen Mfg Co Ltd | 熱処理方法および熱処理装置 |
US9449825B2 (en) * | 2012-02-03 | 2016-09-20 | SCREEN Holdings Co., Ltd. | Heat treatment apparatus for heating substrate by irradiation with flashes of light, and heat treatment method |
JP5955658B2 (ja) * | 2012-06-15 | 2016-07-20 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
-
2012
- 2012-06-15 JP JP2012135417A patent/JP5955658B2/ja active Active
-
2013
- 2013-05-24 TW TW102118474A patent/TWI543265B/zh active
- 2013-06-11 KR KR20130066463A patent/KR101483861B1/ko active IP Right Grant
- 2013-06-11 US US13/914,698 patent/US9023740B2/en active Active
-
2015
- 2015-04-16 US US14/688,426 patent/US20150221533A1/en not_active Abandoned
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001267565A (ja) * | 2000-02-14 | 2001-09-28 | Internatl Business Mach Corp <Ibm> | Mosfetデバイスを形成する方法 |
US20020081826A1 (en) * | 2000-12-21 | 2002-06-27 | Rotondaro Antonio L. P. | Annealing of high-K dielectric materials |
JP2007123662A (ja) * | 2005-10-31 | 2007-05-17 | Renesas Technology Corp | 半導体装置の製造方法および半導体装置 |
US20070134942A1 (en) * | 2005-12-08 | 2007-06-14 | Micron Technology, Inc. | Hafnium tantalum titanium oxide films |
WO2012014642A1 (ja) * | 2010-07-28 | 2012-02-02 | 独立行政法人産業技術総合研究所 | ゲートスタック形成方法 |
JP2012028716A (ja) * | 2010-07-28 | 2012-02-09 | National Institute Of Advanced Industrial & Technology | 半導体装置及びその製造方法 |
JP2012104808A (ja) * | 2010-10-14 | 2012-05-31 | Dainippon Screen Mfg Co Ltd | 熱処理装置および熱処理方法 |
Cited By (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2016127194A (ja) * | 2015-01-07 | 2016-07-11 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP2016181641A (ja) * | 2015-03-25 | 2016-10-13 | 株式会社Screenホールディングス | 熱処理装置 |
JP2020077893A (ja) * | 2015-08-26 | 2020-05-21 | 株式会社Screenホールディングス | 熱処理方法 |
JP2017045982A (ja) * | 2015-08-26 | 2017-03-02 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
US10978319B2 (en) | 2015-08-26 | 2021-04-13 | SCREEN Holdings Co., Ltd. | Light-irradiation heat treatment method and heat treatment apparatus |
US10790171B2 (en) | 2015-08-26 | 2020-09-29 | SCREEN Holdings Co., Ltd. | Light-irradiation heat treatment method and heat treatment apparatus |
JP2017092099A (ja) * | 2015-11-04 | 2017-05-25 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP2018046141A (ja) * | 2016-09-14 | 2018-03-22 | 株式会社Screenホールディングス | 熱処理装置 |
US10950472B2 (en) | 2016-09-14 | 2021-03-16 | SCREEN Holdings Co., Ltd. | Light-irradiation thermal treatment apparatus |
US11881420B2 (en) | 2016-09-14 | 2024-01-23 | SCREEN Holdings Co., Ltd. | Light-irradiation thermal treatment apparatus |
JP2018157064A (ja) * | 2017-03-17 | 2018-10-04 | 株式会社Screenホールディングス | 熱処理装置および放射温度計の測定位置調整方法 |
JP2020009927A (ja) * | 2018-07-09 | 2020-01-16 | フェニックス電機株式会社 | 加熱用ledランプ、およびそれを備えるウエハ加熱ユニット |
JP2019068107A (ja) * | 2019-01-21 | 2019-04-25 | 株式会社Screenホールディングス | 熱処理方法およびゲート形成方法 |
WO2020158318A1 (ja) * | 2019-01-29 | 2020-08-06 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP2020123615A (ja) * | 2019-01-29 | 2020-08-13 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP7169212B2 (ja) | 2019-01-29 | 2022-11-10 | 株式会社Screenホールディングス | 熱処理方法および熱処理装置 |
JP2020010047A (ja) * | 2019-08-26 | 2020-01-16 | 株式会社Screenホールディングス | 熱処理方法 |
Also Published As
Publication number | Publication date |
---|---|
KR101483861B1 (ko) | 2015-01-16 |
US20130337661A1 (en) | 2013-12-19 |
TW201405666A (zh) | 2014-02-01 |
US20150221533A1 (en) | 2015-08-06 |
US9023740B2 (en) | 2015-05-05 |
KR20130141376A (ko) | 2013-12-26 |
JP5955658B2 (ja) | 2016-07-20 |
TWI543265B (zh) | 2016-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP5955658B2 (ja) | 熱処理方法および熱処理装置 | |
JP6026090B2 (ja) | 熱処理方法 | |
JP6472247B2 (ja) | 熱処理方法および熱処理装置 | |
JP5507274B2 (ja) | 熱処理方法および熱処理装置 | |
JP5951241B2 (ja) | 熱処理方法および熱処理装置 | |
JP6598630B2 (ja) | 熱処理方法 | |
JP6425950B2 (ja) | 半導体製造方法および半導体製造装置 | |
JP6774800B2 (ja) | 半導体装置の製造方法 | |
JP2017117862A (ja) | 熱処理装置および熱処理方法 | |
JP5955670B2 (ja) | 熱処理方法 | |
US11322375B2 (en) | Light irradiation type heat treatment method and heat treatment apparatus | |
JP2017092099A (ja) | 熱処理方法および熱処理装置 | |
JP6814855B2 (ja) | 熱処理方法 | |
JP2016181641A (ja) | 熱処理装置 | |
KR20180083790A (ko) | 결정 구조 제어 방법 및 열처리 방법 | |
JP5797916B2 (ja) | 熱処理方法および熱処理装置 | |
JP2012199470A (ja) | 熱処理方法および熱処理装置 | |
JP5944152B2 (ja) | 熱処理方法および熱処理装置 | |
JP2018101760A (ja) | 熱処理方法 | |
JP2019068107A (ja) | 熱処理方法およびゲート形成方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20140825 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150609 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20150616 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20150731 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20160301 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160518 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20160526 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20160614 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20160615 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5955658 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |