JP2013513236A - 基板担体の性能を改善する方法 - Google Patents
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- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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Abstract
Description
本出願人の教示が、種々の実施形態と併せて説明されたが、本出願人の教示が、そのような実施形態に限定されることを意図するものではない。対照的に、本出願人の教示は、当業者によって理解されるように、本教示の精神および範囲から逸脱することなく、本明細書に成され得る、種々の代替、修正、および均等物を包含する。
Claims (37)
- 処理性能を改善するために基板担体を修正する方法であって、
a.基板担体によって支持された基板上に少なくとも1つの層を蒸着させることと、
b.前記基板担体上のその対応する位置の関数として前記少なくとも1つの層のパラメータを測定することと、
c.前記基板担体上の複数の位置に対応する前記基板担体の複数の物理的特徴を得るために、前記基板担体上の複数の位置のうちの少なくともいくつかに対応する測定されたパラメータを、前記基板担体の物理的特徴に関連付けることと、
d.前記基板担体上の位置の関数として前記少なくとも1つの蒸着された層の所望のパラメータを得るために、前記基板担体上の複数の対応する位置のうちの1つ以上において、前記基板担体の物理的特徴を修正することと
を含む、方法。 - 前記基板担体は、黒鉛、SiC、金属、およびセラミック材料のうちの少なくとも1つから形成される、請求項1に記載の方法。
- 前記基板は、半導体、金属、および絶縁体材料のうちの少なくとも1つから形成される、請求項1に記載の方法。
- 前記基板上に蒸着される前記少なくとも1つの層の測定されたパラメータを、前記基板担体の物理的特徴に関連付けることは、数学的モデルを使用することを含む、請求項1に記載の方法。
- 前記基板上に蒸着される前記少なくとも1つの層の測定されたパラメータを、前記基板担体の物理的特徴に関連付けることは、実験によって得られるデータを関連付けることを含む、請求項1に記載の方法。
- 前記基板担体の物理的特徴は、前記基板担体の局所深さを含む、請求項1に記載の方法。
- 前記基板担体の物理的特徴は、前記基板担体の局所熱伝導率を含む、請求項1に記載の方法。
- 前記基板担体の物理的特徴は、前記基板担体の局所放射率を含む、請求項1に記載の方法。
- 前記基板担体の物理的特徴は、前記基板担体の局所機械的特性を含む、請求項1に記載の方法。
- 前記パラメータは、性能測定基準を含む、請求項1に記載の方法。
- 前記パラメータは、前記基板上に蒸着される前記少なくとも1つの層の光学的パラメータである、請求項1に記載の方法。
- 前記パラメータは、前記基板上に蒸着される前記少なくとも1つの層の電気パラメータである、請求項1に記載の方法。
- 前記パラメータは、前記基板上に蒸着される前記少なくとも1つの層の電気光学的パラメータである、請求項1に記載の方法。
- 前記基板担体上の前記複数の対応する位置のうちの少なくともいくつかに関連する測定されたパラメータを関連付けることは、特定の場所における前記少なくとも1つの層の放射波長を、前記基板担体の対応する局所深さに関連付けることを含む、請求項1に記載の方法。
- 前記位置の関数として前記基板担体の物理的特徴を修正することは、前記基板担体上の複数の対応する位置のうちの少なくとも1つにおいて、前記基板担体から材料を取り除くことを含む、請求項1に記載の方法。
- 前記材料は、機械加工、レーザー切断、化学エッチング、および静電放電のうちの少なくとも1つによって、前記基板担体上の対応する位置のうちの少なくとも1つにおいて、前記基板担体から取り除かれる、請求項15に記載の方法。
- 前記基板担体の物理的特徴を修正することは、前記基板担に材料を追加することを含む、請求項1に記載の方法。
- 前記基板担体の物理的特徴を修正することは、前記基板担体の局所領域における熱伝導率を変化させることを含む、請求項1に記載の方法。
- 前記局所領域の熱伝導率は、材料を前記局所領域に挿入することによって変化させられる、請求項18に記載の方法。
- 前記局所領域の熱伝導率は、前記局所領域において材料処理を行うことによって変化させられる、請求項18に記載の方法。
- 前記基板担体の物理的特徴を修正することは、前記基板担体の局所領域における放射率を変化させることを含む、請求項1に記載の方法。
- 前記基板担体の物理的特徴を修正することは、前記基板担体の局所領域における局所機械的特性を変化させることを含む、請求項1に記載の方法。
- 基板担体の性能測定基準を改善するための方法であって、
a.材料処理のために基板を支持するための基板担体を製造することであって、前記基板担体は、位置の関数として物理的特徴を有する、ことと、
b.基板担体によって支持される基板上に少なくとも1つの層を蒸着させることと、
c.前記基板担体上のその対応する位置の関数として前記基板上に蒸着される前記少なくとも1つの層の性能測定基準を測定することと、
d.前記基板担体上の複数の位置に対応する前記基板担体の複数の物理的特徴を得るために、前記基板担体上の少なくともいくつかの位置に対応する前記測定された性能測定基準を、前記基板担体の物理的特徴に関連付けることと、
e.前記基板担体上の位置の関数として蒸着された前記少なくとも1つの層の所望の性能測定基準を得るために、前記基板担体上の複数の対応する位置のうちの1つ以上において、前記基板担体の物理的特徴を修正することと
を含む、方法。 - 前記製造された基板担体は、所定の深さ輪郭を有する、請求項23に記載の方法。
- 前記製造された基板担体は、所定の熱輪郭を有する、請求項23に記載の方法。
- 処理性能を改善するために基板担体を修正する方法であって、
a.基板担体によって支持された基板上に少なくとも1つの層を蒸着させることと、
b.前記基板担体上のその対応する位置の関数として、前記基板上に蒸着される前記少なくとも1つの層の温度依存性処理パラメータを測定することと、
c.前記基板担体上の複数の位置に対応する前記基板担体の複数の深さを得るために、前記基板担体上に製造された前記少なくとも1つの層の前記測定されたパラメータを、基板担体の深さに関連付けることと、
d.前記基板担体上の対応する位置の関数として、蒸着された前記少なくとも1つの層の所望のパラメータを得るために、前記基板担体上の複数の対応する位置のうちの1つ以上において、前記基板担体の深さを修正することと
を含む、方法。 - 前記少なくとも1つの層を蒸着させることは、気相成長法により多重量子井戸構造を製造することを含む、請求項26に記載の方法。
- 前記パラメータは、光学強度を含む、請求項26に記載の方法。
- 前記パラメータは、光学的放射波長を含む、請求項26に記載の方法。
- 前記パラメータは、電気パラメータを含む、請求項26に記載の方法。
- 前記パラメータは、電気光学的パラメータを含む、請求項26に記載の方法。
- 前記基板上に蒸着された前記少なくとも1つの層の測定されたパラメータを、前記基板担体の深さに関連付けることは、数学的モデルを使用することを含む、請求項26に記載の方法。
- 前記基板上に蒸着された前記少なくとも1つの層の測定されたパラメータを、前記基板担体の深さに関連付けることは、実験データを関連付けることを含む、請求項26に記載の方法。
- 前記蒸着された少なくとも1つの層の所望のパラメータを得るために、位置の関数として前記基板担体の深さを修正することは、局所において前記基板担体から材料を取り除くことを含む、請求項26に記載の方法。
- 前記材料は、個別の局所において取り除かれる、請求項34に記載の方法。
- 前記材料は、連続する輪郭を形成するために取り除かれる、請求項34に記載の方法。
- 前記蒸着された少なくとも1つの層の所望のパラメータを得るために、位置の関数として前記基板担体の深さを修正することは、局所において前記基板担体に材料を追加することを含む、請求項26に記載の方法。
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US12/629,467 | 2009-12-02 | ||
US12/629,467 US8486726B2 (en) | 2009-12-02 | 2009-12-02 | Method for improving performance of a substrate carrier |
PCT/US2010/056622 WO2011068660A2 (en) | 2009-12-02 | 2010-11-12 | Method for improving performance of a substrate carrier |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019204928A (ja) * | 2018-05-25 | 2019-11-28 | 日機装株式会社 | サセプタ、半導体の製造方法、及び半導体の製造装置 |
Families Citing this family (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101802254B (zh) | 2007-10-11 | 2013-11-27 | 瓦伦斯处理设备公司 | 化学气相沉积反应器 |
US8486726B2 (en) * | 2009-12-02 | 2013-07-16 | Veeco Instruments Inc. | Method for improving performance of a substrate carrier |
JP2012256737A (ja) * | 2011-06-09 | 2012-12-27 | Sony Corp | 半導体装置及び半導体装置の製造方法 |
KR20140045991A (ko) | 2011-07-25 | 2014-04-17 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 객체 특성화 및 제조공정 모니터링을 위한 방법 및 장치 |
TWI541928B (zh) | 2011-10-14 | 2016-07-11 | 晶元光電股份有限公司 | 晶圓載具 |
US20130171350A1 (en) * | 2011-12-29 | 2013-07-04 | Intermolecular Inc. | High Throughput Processing Using Metal Organic Chemical Vapor Deposition |
US10316412B2 (en) | 2012-04-18 | 2019-06-11 | Veeco Instruments Inc. | Wafter carrier for chemical vapor deposition systems |
US8765493B2 (en) * | 2012-11-20 | 2014-07-01 | Ultratech, Inc. | Methods of characterizing semiconductor light-emitting devices based on product wafer characteristics |
TWI486477B (zh) * | 2012-11-23 | 2015-06-01 | Chemical vapor deposition equipment and its vehicles | |
US10167571B2 (en) * | 2013-03-15 | 2019-01-01 | Veeco Instruments Inc. | Wafer carrier having provisions for improving heating uniformity in chemical vapor deposition systems |
DE102013009925A1 (de) * | 2013-06-13 | 2014-12-18 | Centrotherm Photovoltaics Ag | Messobjekt, Verfahren zur Herstellung desselben und Vorrichtung zum thermischen Behandeln von Substraten |
TWI650832B (zh) | 2013-12-26 | 2019-02-11 | 維克儀器公司 | 用於化學氣相沉積系統之具有隔熱蓋的晶圓載具 |
DE102014114220A1 (de) * | 2014-09-30 | 2016-03-31 | Osram Opto Semiconductors Gmbh | Verfahren für das Aufwachsen von Halbleiterschichten und Träger zum Aufwachsen von Halbleiterschichten |
US10438795B2 (en) | 2015-06-22 | 2019-10-08 | Veeco Instruments, Inc. | Self-centering wafer carrier system for chemical vapor deposition |
WO2016209647A1 (en) | 2015-06-22 | 2016-12-29 | Veeco Instruments, Inc. | Self-centering wafer carrier system for chemical vapor deposition |
EP3338299A4 (en) * | 2015-08-18 | 2019-05-15 | Veeco Instruments Inc. | TREATMENT-SPECIFIC SEMICONDUCTOR WAFER SUPPORT CORRECTION FOR ENHANCED THERMAL UNIFORMITY IN CHEMICAL VAPOR DEPOSITION SYSTEMS AND METHODS |
CN106449493B (zh) * | 2016-09-30 | 2020-03-27 | 华灿光电(浙江)有限公司 | 一种适用于制作发光二极管的石墨基座 |
USD860146S1 (en) | 2017-11-30 | 2019-09-17 | Veeco Instruments Inc. | Wafer carrier with a 33-pocket configuration |
USD866491S1 (en) | 2018-03-26 | 2019-11-12 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD858469S1 (en) | 2018-03-26 | 2019-09-03 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD863239S1 (en) | 2018-03-26 | 2019-10-15 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD860147S1 (en) | 2018-03-26 | 2019-09-17 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
USD854506S1 (en) | 2018-03-26 | 2019-07-23 | Veeco Instruments Inc. | Chemical vapor deposition wafer carrier with thermal cover |
CN112534705A (zh) * | 2019-04-16 | 2021-03-19 | 日本特殊陶业株式会社 | 保持装置及其制造方法、保持装置用的构造体的制造方法 |
WO2020220189A1 (zh) * | 2019-04-29 | 2020-11-05 | 苏州晶湛半导体有限公司 | 一种晶片承载盘 |
CN110654690B (zh) * | 2019-09-30 | 2021-05-14 | 湖南红太阳光电科技有限公司 | 一种石墨舟的定位装置及定位方法 |
WO2022047784A1 (zh) * | 2020-09-07 | 2022-03-10 | 苏州晶湛半导体有限公司 | 一种晶片承载盘 |
CN113622020A (zh) * | 2021-06-17 | 2021-11-09 | 华灿光电(浙江)有限公司 | 提高外延片均匀度的外延托盘及其制备方法 |
US20230060609A1 (en) * | 2021-08-31 | 2023-03-02 | Veeco Instruments Inc. | Wafer carrier assembly with pedestal and cover restraint arrangements that control thermal gaps |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758041A (ja) * | 1993-08-20 | 1995-03-03 | Toshiba Ceramics Co Ltd | サセプタ |
JPH10144773A (ja) * | 1996-11-07 | 1998-05-29 | Mitsubishi Heavy Ind Ltd | 基板ホルダー |
WO1999045585A1 (fr) * | 1998-03-05 | 1999-09-10 | Tokyo Electron Limited | Appareil et procede de traitement au plasma |
US6001183A (en) * | 1996-06-10 | 1999-12-14 | Emcore Corporation | Wafer carriers for epitaxial growth processes |
JP2004244298A (ja) * | 2002-12-17 | 2004-09-02 | Kobe Steel Ltd | ダイヤモンド気相合成用基板ホルダ及びダイヤモンド気相合成方法 |
JP2007214577A (ja) * | 2006-02-10 | 2007-08-23 | Veeco Instruments Inc | ウエハキャリアの温度補償によってウエハの表面温度を変化させるシステム及び方法 |
JP2007246983A (ja) * | 2006-03-15 | 2007-09-27 | Seiko Epson Corp | 成膜装置 |
WO2008027305A2 (en) * | 2006-08-29 | 2008-03-06 | Lam Research Corporation | Method of tuning thermal conductivity of electrostatic chuck support assembly |
JP2009520452A (ja) * | 2005-11-30 | 2009-05-21 | ラム リサーチ コーポレーション | 静電チャックの目標メサ構成を決定する方法 |
WO2009102502A2 (en) * | 2008-02-15 | 2009-08-20 | Veeco Instruments Inc. | Apparatus and method for batch non-contact material characterization |
JP2009530806A (ja) * | 2006-03-14 | 2009-08-27 | エルジー イノテック カンパニー リミテッド | サセプタ及びこれを備える半導体製造装置 |
Family Cites Families (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5195729A (en) * | 1991-05-17 | 1993-03-23 | National Semiconductor Corporation | Wafer carrier |
US5315473A (en) | 1992-01-21 | 1994-05-24 | Applied Materials, Inc. | Isolated electrostatic chuck and excitation method |
JPH05315429A (ja) | 1992-05-07 | 1993-11-26 | Hitachi Ltd | 半導体製造装置の搬送装置 |
US5548470A (en) * | 1994-07-19 | 1996-08-20 | International Business Machines Corporation | Characterization, modeling, and design of an electrostatic chuck with improved wafer temperature uniformity |
JPH0936049A (ja) | 1995-07-21 | 1997-02-07 | Mitsubishi Electric Corp | 気相成長装置およびこれによって製造された化合物半導体装置 |
JP3596127B2 (ja) | 1995-12-04 | 2004-12-02 | ソニー株式会社 | 静電チャック、薄板保持装置、半導体製造装置、搬送方法及び半導体の製造方法 |
JP3110351B2 (ja) | 1997-07-23 | 2000-11-20 | 日本電気アイシーマイコンシステム株式会社 | 内容アドレス式メモリ回路 |
JP2001510640A (ja) * | 1997-10-03 | 2001-07-31 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 半導体サブストレートのためのホルダ及びこのようなホルダを使用して半導体装置を製造する方法 |
FR2783970B1 (fr) * | 1998-09-25 | 2000-11-03 | Commissariat Energie Atomique | Dispositif autorisant le traitement d'un substrat dans une machine prevue pour traiter de plus grands substrats et systeme de montage d'un substrat dans ce dispositif |
US6100506A (en) * | 1999-07-26 | 2000-08-08 | International Business Machines Corporation | Hot plate with in situ surface temperature adjustment |
JP2001217304A (ja) | 2000-01-31 | 2001-08-10 | Hitachi Ltd | 基板ステージ、それを用いた基板処理装置および基板処理方法 |
KR100720775B1 (ko) * | 2000-07-25 | 2007-05-22 | 동경 엘렉트론 주식회사 | 열처리조건의 결정방법 |
JP3817414B2 (ja) | 2000-08-23 | 2006-09-06 | 株式会社日立製作所 | 試料台ユニットおよびプラズマ処理装置 |
TW525633U (en) * | 2001-03-29 | 2003-03-21 | Au Optronics Corp | Locator for a material sheet |
US20030209326A1 (en) * | 2002-05-07 | 2003-11-13 | Mattson Technology, Inc. | Process and system for heating semiconductor substrates in a processing chamber containing a susceptor |
JP2004052098A (ja) * | 2002-05-31 | 2004-02-19 | Tokyo Electron Ltd | 基板処理装置およびそれに用いるサセプタ |
JP4035008B2 (ja) | 2002-07-08 | 2008-01-16 | 株式会社日立ハイテクノロジーズ | 真空処理装置 |
JP2004087576A (ja) | 2002-08-23 | 2004-03-18 | Nec Kyushu Ltd | 真空処理装置 |
JP2004103799A (ja) | 2002-09-09 | 2004-04-02 | Canon Inc | 基板保持装置、デバイス製造装置及びデバイス製造方法 |
JPWO2004090967A1 (ja) * | 2003-04-02 | 2006-07-06 | 株式会社Sumco | 半導体ウェーハ用熱処理治具 |
JP3894562B2 (ja) | 2003-10-01 | 2007-03-22 | キヤノン株式会社 | 基板吸着装置、露光装置およびデバイス製造方法 |
US7910218B2 (en) * | 2003-10-22 | 2011-03-22 | Applied Materials, Inc. | Cleaning and refurbishing chamber components having metal coatings |
CN1289892C (zh) * | 2003-12-11 | 2006-12-13 | 中国科学院上海技术物理研究所 | 多量子阱红外探测材料的结构层厚获取方法 |
JP4647595B2 (ja) * | 2004-02-25 | 2011-03-09 | Jx日鉱日石金属株式会社 | 気相成長装置 |
US7585371B2 (en) * | 2004-04-08 | 2009-09-08 | Micron Technology, Inc. | Substrate susceptors for receiving semiconductor substrates to be deposited upon |
JP4509820B2 (ja) * | 2005-02-15 | 2010-07-21 | 東京エレクトロン株式会社 | 熱処理板の温度設定方法,熱処理板の温度設定装置,プログラム及びプログラムを記録したコンピュータ読み取り可能な記録媒体 |
DE112006000327T5 (de) * | 2005-03-03 | 2007-12-27 | Applied Materials, Inc., Santa Clara | Vorrichtung zur Temperatursteuerung eines Substrats |
TW200711029A (en) | 2005-08-05 | 2007-03-16 | Tokyo Electron Ltd | Substrate processing apparatus and substrate stage used therein |
JP4802018B2 (ja) | 2006-03-09 | 2011-10-26 | 筑波精工株式会社 | 静電保持装置及びそれを用いた真空環境装置並びにアライメント装置又は貼り合わせ装置 |
JP4741408B2 (ja) * | 2006-04-27 | 2011-08-03 | 株式会社荏原製作所 | 試料パターン検査装置におけるxy座標補正装置及び方法 |
CN100546944C (zh) * | 2007-09-13 | 2009-10-07 | 北京航空航天大学 | 电热法定向渗积制备炭/炭构件的工艺 |
JP5112808B2 (ja) | 2007-10-15 | 2013-01-09 | 筑波精工株式会社 | 静電型補強装置 |
KR100856019B1 (ko) * | 2008-02-22 | 2008-09-02 | (주)타이닉스 | 플라즈마 처리장치의 기판 홀더 |
US8486726B2 (en) * | 2009-12-02 | 2013-07-16 | Veeco Instruments Inc. | Method for improving performance of a substrate carrier |
US10551613B2 (en) * | 2010-10-20 | 2020-02-04 | Tiansheng ZHOU | Micro-electro-mechanical systems micromirrors and micromirror arrays |
KR101665242B1 (ko) * | 2015-03-20 | 2016-10-11 | 앰코 테크놀로지 코리아 주식회사 | 반도체 패키지 및 이의 제조 방법 |
-
2009
- 2009-12-02 US US12/629,467 patent/US8486726B2/en active Active
-
2010
- 2010-11-12 CN CN201510436976.8A patent/CN105140166A/zh active Pending
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- 2010-11-12 EP EP10834932.5A patent/EP2507826A4/en not_active Withdrawn
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-
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- 2015-07-29 JP JP2015149375A patent/JP2015213195A/ja active Pending
-
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- 2016-01-10 US US14/991,962 patent/US10262883B2/en active Active
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0758041A (ja) * | 1993-08-20 | 1995-03-03 | Toshiba Ceramics Co Ltd | サセプタ |
US6001183A (en) * | 1996-06-10 | 1999-12-14 | Emcore Corporation | Wafer carriers for epitaxial growth processes |
JPH10144773A (ja) * | 1996-11-07 | 1998-05-29 | Mitsubishi Heavy Ind Ltd | 基板ホルダー |
WO1999045585A1 (fr) * | 1998-03-05 | 1999-09-10 | Tokyo Electron Limited | Appareil et procede de traitement au plasma |
JP2004244298A (ja) * | 2002-12-17 | 2004-09-02 | Kobe Steel Ltd | ダイヤモンド気相合成用基板ホルダ及びダイヤモンド気相合成方法 |
JP2009520452A (ja) * | 2005-11-30 | 2009-05-21 | ラム リサーチ コーポレーション | 静電チャックの目標メサ構成を決定する方法 |
JP2007214577A (ja) * | 2006-02-10 | 2007-08-23 | Veeco Instruments Inc | ウエハキャリアの温度補償によってウエハの表面温度を変化させるシステム及び方法 |
JP2009530806A (ja) * | 2006-03-14 | 2009-08-27 | エルジー イノテック カンパニー リミテッド | サセプタ及びこれを備える半導体製造装置 |
JP2007246983A (ja) * | 2006-03-15 | 2007-09-27 | Seiko Epson Corp | 成膜装置 |
WO2008027305A2 (en) * | 2006-08-29 | 2008-03-06 | Lam Research Corporation | Method of tuning thermal conductivity of electrostatic chuck support assembly |
WO2009102502A2 (en) * | 2008-02-15 | 2009-08-20 | Veeco Instruments Inc. | Apparatus and method for batch non-contact material characterization |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019204928A (ja) * | 2018-05-25 | 2019-11-28 | 日機装株式会社 | サセプタ、半導体の製造方法、及び半導体の製造装置 |
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CN104377140B (zh) | 2018-04-03 |
WO2011068660A2 (en) | 2011-06-09 |
US9269565B2 (en) | 2016-02-23 |
EP2507826A2 (en) | 2012-10-10 |
KR20160054018A (ko) | 2016-05-13 |
CN102598239A (zh) | 2012-07-18 |
EP2507826A4 (en) | 2014-11-05 |
CN102598239B (zh) | 2015-07-29 |
US20160126123A1 (en) | 2016-05-05 |
CN105140166A (zh) | 2015-12-09 |
US20110129947A1 (en) | 2011-06-02 |
JP5830026B2 (ja) | 2015-12-09 |
SG193143A1 (en) | 2013-09-30 |
TWI523137B (zh) | 2016-02-21 |
TWI427736B (zh) | 2014-02-21 |
KR20120102613A (ko) | 2012-09-18 |
WO2011068660A3 (en) | 2011-09-22 |
TW201131691A (en) | 2011-09-16 |
CN104377140A (zh) | 2015-02-25 |
TW201434102A (zh) | 2014-09-01 |
KR102033085B1 (ko) | 2019-11-08 |
US10262883B2 (en) | 2019-04-16 |
US20130284091A1 (en) | 2013-10-31 |
US8486726B2 (en) | 2013-07-16 |
KR101617491B1 (ko) | 2016-05-02 |
KR20170076813A (ko) | 2017-07-04 |
SG179007A1 (en) | 2012-04-27 |
JP2015213195A (ja) | 2015-11-26 |
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