JP2013069807A - 半導体パッケージ及びその製造方法 - Google Patents

半導体パッケージ及びその製造方法 Download PDF

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Publication number
JP2013069807A
JP2013069807A JP2011206549A JP2011206549A JP2013069807A JP 2013069807 A JP2013069807 A JP 2013069807A JP 2011206549 A JP2011206549 A JP 2011206549A JP 2011206549 A JP2011206549 A JP 2011206549A JP 2013069807 A JP2013069807 A JP 2013069807A
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Prior art keywords
insulating layer
semiconductor chip
layer
wiring
semiconductor
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JP2011206549A
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Japanese (ja)
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JP2013069807A5 (enExample
Inventor
Kenta Uchiyama
健太 内山
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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Priority to JP2011206549A priority Critical patent/JP2013069807A/ja
Priority to US13/607,906 priority patent/US9136220B2/en
Publication of JP2013069807A publication Critical patent/JP2013069807A/ja
Publication of JP2013069807A5 publication Critical patent/JP2013069807A5/ja
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    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit

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  • Engineering & Computer Science (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
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JP2018085452A (ja) * 2016-11-24 2018-05-31 株式会社ジェイデバイス 半導体装置及びその製造方法
JP2021520652A (ja) * 2018-05-18 2021-08-19 ロジャーズ ジャーマニー ゲーエムベーハーＲｏｇｅｒｓ Ｇｅｒｍａｎｙ ＧｍｂＨ 電子モジュールとその製造方法
JP2023133675A (ja) * 2022-03-14 2023-09-27 住友電気工業株式会社 高周波装置の製造方法

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KR20150025129A (ko) * 2013-08-28 2015-03-10 삼성전기주식회사 전자 소자 모듈 및 그 제조 방법
US20150279815A1 (en) * 2014-03-28 2015-10-01 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Substrate Having Conductive Columns
US10115648B2 (en) * 2015-11-23 2018-10-30 Samsung Electro-Mechanics Co., Ltd. Fan-out semiconductor package and electronic device including the same
US10068853B2 (en) * 2016-05-05 2018-09-04 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated fan-out package and method of fabricating the same
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