JP5249173B2 - 半導体素子実装配線基板及びその製造方法 - Google Patents
半導体素子実装配線基板及びその製造方法 Download PDFInfo
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Description
図1は本発明の第1の実施形態に係る半導体素子実装配線基板(パッケージ)の構成を断面図の形態で示したものである。
図7は、本発明の第2の実施形態に係る半導体素子実装配線基板(パッケージ)の製造工程(一部)を断面図の形態で示したものである。
図8は、本発明の第3の実施形態に係る半導体素子実装配線基板(パッケージ)の製造工程(一部)を断面図の形態で示したものである。
20,20a,20b,20c…半導体素子(チップ)封止基板、
21…半導体素子(チップ)、
22…電極パッド(端子)、
23,24…樹脂層(絶縁層)、
25…導体ビア、
26…パッド、
30,30b,30c…再配線基板、
31(31P)…配線層(パッド)、
32,34…樹脂層(絶縁層)、
33(33P)…再配線層(パッド)、
35,38…導電性バンプ、
36…ソルダレジスト層(保護膜/絶縁層)、
37…はんだボール(外部接続端子)、
41…銅板(金属板)、
42…テープ(一時的な支持基材)、
50(52)…仮基板(銅箔)、
VH…ビアホール。
Claims (15)
- 金属板に、その表面から裏面にかけて開口する所要の大きさの開口部を設ける工程と、
前記金属板の裏面を、片面が粘着面とされた支持基材の該粘着面に貼り付ける工程と、
前記支持基材上の、前記金属板の開口部に対応する部分に、その電極端子形成面を上にして半導体素子をフェイスアップの態様で搭載する工程と、
前記支持基材上の前記金属板の表面及び前記半導体素子の電極端子形成面を被覆するように絶縁層を形成して、半導体素子封止基板を作製する工程と、
仮基板の少なくとも一方の面上に、再配線層を絶縁層を介在させて所要の層数となるまで積層し、最外層の再配線層上に所要個数の導電性バンプを形成して、再配線基板を作製する工程と、
前記半導体素子封止基板と前記再配線基板とを、前記半導体素子の電極端子と前記再配線層上の対応する導電性バンプとが対向するよう位置合わせして積層し、前記半導体素子封止基板の絶縁層と前記再配線基板の絶縁層とを接着すると共に、前記電極端子と前記導電性バンプとを接続する工程と、
以上の工程により作製された構造体から、前記支持基材及び前記仮基板を除去する工程と、を含むことを特徴とする半導体素子実装配線基板の製造方法。 - 前記金属板の前記支持基材に貼り付けられる側と反対側の面上の所定の箇所に、パッドを形成する工程を含み、
前記半導体素子封止基板を作製する工程において、前記金属板上の前記パッドも被覆するように前記絶縁層を形成するとともに、
前記再配線基板を作製する工程において、前記最外層の再配線層上に前記導電性バンプを形成する際に、当該再配線層上の、前記半導体素子封止基板における前記パッドの位置に対応する部分に更なる導電性バンプを形成し、
前記支持基材及び前記仮基板を除去する工程で、前記パッドが露出することを特徴とする請求項1に記載の半導体素子実装配線基板の製造方法。 - 前記パッドは、外部接続用として設けられ、他の電子部品の外部接続端子が接合されるよう形成されていることを特徴とする請求項2に記載の半導体素子実装配線基板の製造方法。
- 前記半導体素子封止基板を作製する工程において、前記支持基材上の前記金属板及び前記半導体素子を被覆するように絶縁層を形成した後、該絶縁層の所定の箇所を開口し、前記半導体素子の電極端子に接続される導体ビアを形成する工程を含み、
前記再配線基板を作製する工程に代えて、仮基板の少なくとも一方の面上に、再配線層を絶縁層を介在させて所要の層数となるまで積層し、最外層の再配線層を露出させた再配線基板を作製する工程を含み、
前記半導体素子封止基板と前記再配線基板とを接続する工程に代えて、前記半導体素子封止基板と前記再配線基板とを、前記半導体素子の電極端子上に設けられた前記導体ビアと前記最外層の再配線層上の対応するパッドとが対向するよう位置合わせして積層し、前記導体ビアと前記パッドとを接続する工程を含むことを特徴とする請求項1に記載の半導体素子実装配線基板の製造方法。 - 前記支持基材及び前記仮基板を除去する工程の後に、前記半導体素子が露出している側と反対側の面に露出する再配線層及び絶縁層上に、当該再配線層のパッドの部分を露出させて保護膜を形成する工程を含むことを特徴とする請求項1に記載の半導体素子実装配線基板の製造方法。
- 前記保護層を形成する工程の後に、前記金属板を選択除去する工程を含むことを特徴とする請求項5に記載の半導体素子実装配線基板の製造方法。
- 前記半導体素子封止基板を作製する工程において、前記絶縁層は半硬化状態の樹脂であり、
前記半導体素子封止基板と前記再配線基板とを積層し、前記電極端子と前記導電性バンプとを接続する工程で、加熱・加圧により前記半導体素子封止基板の絶縁層を硬化させて接着を行うことを特徴とする請求項1乃至3のいずれか一項に記載の半導体素子実装配線基板の製造方法。 - 前記半導体素子封止基板の絶縁層を硬化させて接着を行う際に、前記半導体素子封止基板の絶縁層内に前記導電性バンプの先端が入り込み、前記導電性バンプの先端が前記電極端子の端面に押し付けられて、前記導電性バンプと前記電極端子とが接続されることを特徴とする請求項7に記載の半導体素子実装配線基板の製造方法。
- 前記半導体素子の周囲に配置される前記金属板が補強部材として残されることを特徴とする請求項1乃至3のいずれか一項に記載の半導体素子実装配線基板の製造方法。
- 電極端子形成面と、その裏面とを有する半導体素子と、
一方の面と他方の面とを有し、前記半導体素子の電極形成面と側面とを封止する封止部分と、前記封止部分の周囲に配置された周囲部分とを有して、前記半導体素子が埋め込まれて配置され、前記半導体素子の裏面を前記他方の面側に露出する絶縁層から形成された封止基板と、
所要の層数の配線層と絶縁層とが積層され、最外層の前記配線層に導電性バンプが設けられた再配線基板とを有し、
前記再配線基板の導電性バンプの形成面側の前記絶縁層の全面に、前記封止基板の一方の面が接着されており、かつ、
前記封止基板内に前記導電性バンプの先端が入り込み、前記導電性バンプの先端が前記電極端子の端面に押し付けられて、前記導電性バンプと前記電極端子とが接続されていることを特徴とする半導体素子実装配線基板。 - 前記封止基板の周囲部分の前記他方の面に形成され、前記半導体素子の裏面を露出する開口部を備えた金属板を有することを特徴とする請求項10に記載の半導体素子実装配線基板。
- 前記周囲部分の前記他方の面に、前記配線層と接続されたパッドが設けられていることを特徴とする請求項10に記載の半導体素子実装配線基板。
- 前記再配線基板の、前記封止基板が配置された面と反対側の面の前記絶縁層内に、パッドが埋設されており、
前記パッドの表面が、前記パッドが埋設された前記絶縁層の表面に露出し、かつ、前記パッドの側面と裏面が前記絶縁層に接しており、
前記パッドが埋設された前記絶縁層の裏面側に、前記パッドの裏面を露出するビアホールが設けられており、
前記パッドが埋設された前記絶縁層の裏面に、前記ビアホールを介して前記パッドの裏面に接続される配線層が設けられていることを特徴とする請求項10乃至12のいずれか一項に記載の半導体素子実装配線基板。 - 前記パッドが埋設された前記絶縁層の表面に前記パッドを露出するソルダーレジスト層が設けられていることを特徴とする請求項13に記載の半導体素子実装配線基板。
- 前記封止基板の絶縁層は接着機能を有する樹脂から形成され、前記封止基板の絶縁層によって前記再配線基板に接着されていること請求項10乃至14のいずれか一項に記載の半導体素子実装配線基板。
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