JP2012532988A5 - - Google Patents
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- JP2012532988A5 JP2012532988A5 JP2012519537A JP2012519537A JP2012532988A5 JP 2012532988 A5 JP2012532988 A5 JP 2012532988A5 JP 2012519537 A JP2012519537 A JP 2012519537A JP 2012519537 A JP2012519537 A JP 2012519537A JP 2012532988 A5 JP2012532988 A5 JP 2012532988A5
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- JP
- Japan
- Prior art keywords
- layer
- article
- less
- microinches
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/500,786 US8652649B2 (en) | 2009-07-10 | 2009-07-10 | Coated articles and methods |
| US12/500,786 | 2009-07-10 | ||
| PCT/US2010/001874 WO2011005302A1 (en) | 2009-07-10 | 2010-06-30 | Coated articles and methods |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015197036A Division JP6342868B2 (ja) | 2009-07-10 | 2015-10-02 | 被コーティング物品およびそのコーティング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2012532988A JP2012532988A (ja) | 2012-12-20 |
| JP2012532988A5 true JP2012532988A5 (enExample) | 2013-08-15 |
Family
ID=42732418
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012519537A Pending JP2012532988A (ja) | 2009-07-10 | 2010-06-30 | 被コーティング物品およびそのコーティング方法 |
| JP2015197036A Active JP6342868B2 (ja) | 2009-07-10 | 2015-10-02 | 被コーティング物品およびそのコーティング方法 |
| JP2018095072A Active JP6644831B2 (ja) | 2009-07-10 | 2018-05-17 | 被コーティング物品およびそのコーティング方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015197036A Active JP6342868B2 (ja) | 2009-07-10 | 2015-10-02 | 被コーティング物品およびそのコーティング方法 |
| JP2018095072A Active JP6644831B2 (ja) | 2009-07-10 | 2018-05-17 | 被コーティング物品およびそのコーティング方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (5) | US8652649B2 (enExample) |
| EP (1) | EP2451990B1 (enExample) |
| JP (3) | JP2012532988A (enExample) |
| KR (2) | KR20140117669A (enExample) |
| CN (2) | CN102597321B (enExample) |
| WO (1) | WO2011005302A1 (enExample) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9005420B2 (en) * | 2007-12-20 | 2015-04-14 | Integran Technologies Inc. | Variable property electrodepositing of metallic structures |
| US8652649B2 (en) * | 2009-07-10 | 2014-02-18 | Xtalic Corporation | Coated articles and methods |
| US20110220511A1 (en) * | 2010-03-12 | 2011-09-15 | Xtalic Corporation | Electrodeposition baths and systems |
| US9694562B2 (en) * | 2010-03-12 | 2017-07-04 | Xtalic Corporation | Coated articles and methods |
| US9322804B2 (en) * | 2010-11-29 | 2016-04-26 | President And Fellows Of Harvard College | Quality control of diamagnetic materials using magnetic levitation |
| US8574722B2 (en) | 2011-05-09 | 2013-11-05 | Tyco Electronics Corporation | Corrosion resistant electrical conductor |
| US20120328904A1 (en) * | 2011-06-23 | 2012-12-27 | Xtalic Corporation | Printed circuit boards and related articles including electrodeposited coatings |
| CN106947986B (zh) * | 2011-09-14 | 2019-07-19 | 克斯塔里克公司 | 涂覆制品、电沉积浴及相关系统 |
| KR101270770B1 (ko) * | 2012-10-04 | 2013-06-03 | 와이엠티 주식회사 | 인쇄회로기판의 도금방법 |
| US9224550B2 (en) | 2012-12-26 | 2015-12-29 | Tyco Electronics Corporation | Corrosion resistant barrier formed by vapor phase tin reflow |
| US20140262798A1 (en) * | 2013-03-15 | 2014-09-18 | Xtalic Corporation | Electrodeposition methods and baths for use with printed circuit boards and other articles |
| KR101465773B1 (ko) * | 2014-05-19 | 2014-12-01 | 윤종오 | 음극 전극이 회전하지 않는 고정형인 릴투릴 도금용 음극 전극 |
| JP6065886B2 (ja) * | 2014-07-22 | 2017-01-25 | トヨタ自動車株式会社 | 金属皮膜の成膜方法 |
| KR101713016B1 (ko) * | 2015-07-24 | 2017-03-07 | 덕산하이메탈(주) | 도금에 의한 발열 및 비정질 특성을 갖는 박판 제조방법 |
| US20170100744A1 (en) * | 2015-10-12 | 2017-04-13 | Tyco Electronics Corporation | Electronic Component and Process of Producing Electronic Component |
| CN105543912B (zh) * | 2016-02-15 | 2018-03-09 | 上海应用技术学院 | 一种在铜基体上制备复配表面活性剂/La‑Ni‑Mo‑W共沉积镀层的方法 |
| CN107250430A (zh) * | 2016-02-16 | 2017-10-13 | 思力柯集团 | 包括多层涂层的制品和方法 |
| JP6700852B2 (ja) * | 2016-02-25 | 2020-05-27 | 日本圧着端子製造株式会社 | 電子部品、めっき方法、及びめっき装置 |
| US11390960B1 (en) * | 2016-09-28 | 2022-07-19 | Plasma Processes, Llc | High temperature corrosion resistant composite structure consisting of ruthenium and its alloys |
| US9859640B1 (en) | 2016-11-14 | 2018-01-02 | Te Connectivity Corporation | Electrical connector with plated signal contacts |
| US11152729B2 (en) * | 2016-11-14 | 2021-10-19 | TE Connectivity Services Gmbh | Electrical connector and electrical connector assembly having a mating array of signal and ground contacts |
| DE102017002472A1 (de) * | 2017-03-14 | 2018-09-20 | Diehl Metal Applications Gmbh | Steckverbinder |
| US11851320B2 (en) * | 2017-05-01 | 2023-12-26 | The Johns Hopkins University | Method of depositing nanotwinned nickel-molybdenum-tungsten alloys |
| EP3691894A4 (en) * | 2017-09-28 | 2021-07-07 | Maxterial, Inc. | OBJECTS WITH SURFACE COATINGS AND METHODS FOR THEIR MANUFACTURING |
| US10875355B2 (en) * | 2017-12-28 | 2020-12-29 | Shimano Inc. | Bicycle component and bicycle rim |
| CN109097811B (zh) * | 2018-09-13 | 2020-09-22 | 济南东方结晶器有限公司 | Co-Ni-P-金刚石镀层的电镀液及其制备方法与电镀方法 |
| WO2021188674A1 (en) * | 2020-03-18 | 2021-09-23 | Xtalic Corporation | Nanostructured palladium-based alloys and related methods |
| EP4355935A4 (en) | 2021-06-18 | 2025-11-12 | Maxterial Inc | ARTICLES INCLUDING SURFACE COATINGS ON EXTERNAL SURFACES, INTERNAL SURFACES, OR BOTH |
| EP4633944A1 (en) * | 2022-12-16 | 2025-10-22 | Maxterial, Inc. | Articles with decorative surface coatings |
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| US2212516A (en) * | 1936-09-08 | 1940-08-27 | United Shoe Machinery Corp | Shoe and method of making the same |
| US2722949A (en) | 1954-12-09 | 1955-11-08 | Steel Heddle Mfg Co | Heddle frames |
| JPS524061Y2 (enExample) | 1971-07-10 | 1977-01-27 | ||
| US3963455A (en) * | 1973-01-12 | 1976-06-15 | Lea-Ronal, Inc. | Electrodeposited gold plating |
| US3964666A (en) | 1975-03-31 | 1976-06-22 | Western Electric Company, Inc. | Bonding contact members to circuit boards |
| JPS5810998B2 (ja) * | 1975-06-30 | 1983-02-28 | 松下電工株式会社 | 電気接点およびその電気接点の製造方法 |
| JPS524061A (en) * | 1975-06-30 | 1977-01-12 | Matsushita Electric Works Ltd | Plated contacts |
| JPS5280470A (en) * | 1975-12-26 | 1977-07-06 | Matsushita Electric Works Ltd | Plated contacts |
| GB1507782A (en) * | 1976-04-13 | 1978-04-19 | Lea Ronal Inc | Electrodeposition of gold |
| JPS53139173A (en) * | 1977-05-11 | 1978-12-05 | Alps Electric Co Ltd | Composite contact material |
| JPS56154261A (en) * | 1980-04-28 | 1981-11-28 | Mishima Kosan Co Ltd | Mold for continuous casting and its production |
| US4463059A (en) * | 1982-06-30 | 1984-07-31 | International Business Machines Corporation | Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding |
| ATE40721T1 (de) * | 1984-05-11 | 1989-02-15 | Burlington Industries Inc | Elektrischer kontakt beschichtet mit einer amorphen uebergangslegierung der selbst mit einem goldfilm beschichtet ist. |
| US4628165A (en) * | 1985-09-11 | 1986-12-09 | Learonal, Inc. | Electrical contacts and methods of making contacts by electrodeposition |
| GB2186597B (en) * | 1986-02-17 | 1990-04-04 | Plessey Co Plc | Electrical contact surface coating |
| JP2529294B2 (ja) * | 1987-09-25 | 1996-08-28 | 株式会社日立製作所 | 多層めつき方法 |
| JPH01132072A (ja) * | 1987-11-18 | 1989-05-24 | Yazaki Corp | 端子、接点等の金メッキ部品 |
| US5309632A (en) | 1988-03-28 | 1994-05-10 | Hitachi Chemical Co., Ltd. | Process for producing printed wiring board |
| JPH0359972A (ja) * | 1989-07-27 | 1991-03-14 | Yazaki Corp | 電気接点 |
| JP2731040B2 (ja) | 1991-02-05 | 1998-03-25 | 三菱電機株式会社 | 半導体装置の製造方法 |
| US5318687A (en) | 1992-08-07 | 1994-06-07 | International Business Machines Corporation | Low stress electrodeposition of gold for X-ray mask fabrication |
| US5772451A (en) | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
| US20030199179A1 (en) | 1993-11-16 | 2003-10-23 | Formfactor, Inc. | Contact tip structure for microelectronic interconnection elements and method of making same |
| JP2664878B2 (ja) | 1994-01-31 | 1997-10-22 | インターナショナル・ビジネス・マシーンズ・コーポレイション | 半導体チップパッケージおよびその製造方法 |
| JP3000877B2 (ja) | 1995-02-20 | 2000-01-17 | 松下電器産業株式会社 | 金メッキ電極の形成方法、基板及びワイヤボンディング方法 |
| US5675177A (en) | 1995-06-26 | 1997-10-07 | Lucent Technologies Inc. | Ultra-thin noble metal coatings for electronic packaging |
| US5679471A (en) * | 1995-10-16 | 1997-10-21 | General Motors Corporation | Silver-nickel nano-composite coating for terminals of separable electrical connectors |
| US6487106B1 (en) * | 1999-01-12 | 2002-11-26 | Arizona Board Of Regents | Programmable microelectronic devices and method of forming and programming same |
| US6335107B1 (en) * | 1999-09-23 | 2002-01-01 | Lucent Technologies Inc. | Metal article coated with multilayer surface finish for porosity reduction |
| US6359233B1 (en) | 1999-10-26 | 2002-03-19 | Intel Corporation | Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof |
| US20010033020A1 (en) * | 2000-03-24 | 2001-10-25 | Stierman Roger J. | Structure and method for bond pads of copper-metallized integrated circuits |
| WO2002049077A2 (en) * | 2000-12-11 | 2002-06-20 | Handy & Harman | Barrier layer for electrical connectors and methods of applying the layer |
| US6528185B2 (en) * | 2001-02-28 | 2003-03-04 | Hong Kong Polytechnic University | Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles |
| JP2002256444A (ja) * | 2001-03-05 | 2002-09-11 | Okuno Chem Ind Co Ltd | 配線基板 |
| US7930815B2 (en) | 2003-04-11 | 2011-04-26 | Avery Dennison Corporation | Conductive pattern and method of making |
| JP2005068445A (ja) * | 2003-08-25 | 2005-03-17 | Dowa Mining Co Ltd | 金属被覆された金属部材 |
| CN1313647C (zh) * | 2003-09-04 | 2007-05-02 | 长沙高新技术产业开发区英才科技有限公司 | 电沉积钨基系列非晶合金镀层或纳米晶合金镀层及所使用的电镀液和工艺 |
| US7391116B2 (en) * | 2003-10-14 | 2008-06-24 | Gbc Metals, Llc | Fretting and whisker resistant coating system and method |
| JP2005163153A (ja) * | 2003-12-05 | 2005-06-23 | Japan Pure Chemical Co Ltd | 無電解ニッケル置換金めっき処理層、無電解ニッケルめっき液、および無電解ニッケル置換金めっき処理方法 |
| US20060154084A1 (en) | 2005-01-10 | 2006-07-13 | Massachusetts Institute Of Technology | Production of metal glass in bulk form |
| JP4868123B2 (ja) * | 2005-02-04 | 2012-02-01 | 学校法人早稲田大学 | 金−ニッケル系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法 |
| US7425255B2 (en) * | 2005-06-07 | 2008-09-16 | Massachusetts Institute Of Technology | Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition |
| JP4868116B2 (ja) * | 2005-09-30 | 2012-02-01 | 学校法人早稲田大学 | 金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法 |
| US7521128B2 (en) * | 2006-05-18 | 2009-04-21 | Xtalic Corporation | Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings |
| CN100500924C (zh) * | 2006-08-10 | 2009-06-17 | 中国科学院微电子研究所 | 一种金属纳米晶薄膜的制备方法 |
| JP2008078032A (ja) * | 2006-09-22 | 2008-04-03 | Alps Electric Co Ltd | 接続装置 |
| US20090286103A1 (en) * | 2008-05-14 | 2009-11-19 | Xtalic Corporation | Coated articles and related methods |
| US20090283410A1 (en) * | 2008-05-14 | 2009-11-19 | Xtalic Corporation | Coated articles and related methods |
| US20100116675A1 (en) | 2008-11-07 | 2010-05-13 | Xtalic Corporation | Electrodeposition baths, systems and methods |
| US8652649B2 (en) | 2009-07-10 | 2014-02-18 | Xtalic Corporation | Coated articles and methods |
| US8309382B2 (en) | 2009-10-29 | 2012-11-13 | Advantest America, Inc. | Multi material secondary metallization scheme in MEMS fabrication |
| US8913550B2 (en) * | 2010-02-16 | 2014-12-16 | Intel Corporation | Clustering management in mmWave wireless systems |
| US9694562B2 (en) | 2010-03-12 | 2017-07-04 | Xtalic Corporation | Coated articles and methods |
| JP5681378B2 (ja) * | 2010-04-27 | 2015-03-04 | Dowaメタルテック株式会社 | めっき部材およびその製造方法 |
| FR2974818B1 (fr) | 2011-05-05 | 2013-05-24 | Alchimer | Procede de depot de couches metalliques a base de nickel ou de cobalt sur un substrat solide semi-conducteur ; kit pour la mise en oeuvre de ce procede |
| US8574722B2 (en) | 2011-05-09 | 2013-11-05 | Tyco Electronics Corporation | Corrosion resistant electrical conductor |
| US20120328904A1 (en) * | 2011-06-23 | 2012-12-27 | Xtalic Corporation | Printed circuit boards and related articles including electrodeposited coatings |
| JP7585775B2 (ja) | 2020-12-24 | 2024-11-19 | ブラザー工業株式会社 | サポートプログラム |
-
2009
- 2009-07-10 US US12/500,786 patent/US8652649B2/en active Active
-
2010
- 2010-06-30 EP EP10734583.7A patent/EP2451990B1/en active Active
- 2010-06-30 WO PCT/US2010/001874 patent/WO2011005302A1/en not_active Ceased
- 2010-06-30 KR KR1020147024315A patent/KR20140117669A/ko not_active Ceased
- 2010-06-30 CN CN201080040814.8A patent/CN102597321B/zh active Active
- 2010-06-30 KR KR1020127003466A patent/KR20120041751A/ko not_active Ceased
- 2010-06-30 JP JP2012519537A patent/JP2012532988A/ja active Pending
- 2010-06-30 CN CN201510023205.6A patent/CN104694928A/zh active Pending
-
2014
- 2014-02-17 US US14/182,183 patent/US9765438B2/en active Active
- 2014-09-24 US US14/495,730 patent/US9074294B2/en active Active
-
2015
- 2015-10-02 JP JP2015197036A patent/JP6342868B2/ja active Active
-
2017
- 2017-09-15 US US15/705,959 patent/US20180163314A1/en not_active Abandoned
-
2018
- 2018-05-17 JP JP2018095072A patent/JP6644831B2/ja active Active
-
2019
- 2019-12-16 US US16/715,579 patent/US11634831B2/en active Active
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