JP2012532988A5 - - Google Patents

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Publication number
JP2012532988A5
JP2012532988A5 JP2012519537A JP2012519537A JP2012532988A5 JP 2012532988 A5 JP2012532988 A5 JP 2012532988A5 JP 2012519537 A JP2012519537 A JP 2012519537A JP 2012519537 A JP2012519537 A JP 2012519537A JP 2012532988 A5 JP2012532988 A5 JP 2012532988A5
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JP
Japan
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layer
article
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microinches
coating
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JP2012519537A
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English (en)
Japanese (ja)
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JP2012532988A (ja
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Priority claimed from US12/500,786 external-priority patent/US8652649B2/en
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Publication of JP2012532988A publication Critical patent/JP2012532988A/ja
Publication of JP2012532988A5 publication Critical patent/JP2012532988A5/ja
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JP2012519537A 2009-07-10 2010-06-30 被コーティング物品およびそのコーティング方法 Pending JP2012532988A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/500,786 2009-07-10
US12/500,786 US8652649B2 (en) 2009-07-10 2009-07-10 Coated articles and methods
PCT/US2010/001874 WO2011005302A1 (en) 2009-07-10 2010-06-30 Coated articles and methods

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2015197036A Division JP6342868B2 (ja) 2009-07-10 2015-10-02 被コーティング物品およびそのコーティング方法

Publications (2)

Publication Number Publication Date
JP2012532988A JP2012532988A (ja) 2012-12-20
JP2012532988A5 true JP2012532988A5 (enExample) 2013-08-15

Family

ID=42732418

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2012519537A Pending JP2012532988A (ja) 2009-07-10 2010-06-30 被コーティング物品およびそのコーティング方法
JP2015197036A Active JP6342868B2 (ja) 2009-07-10 2015-10-02 被コーティング物品およびそのコーティング方法
JP2018095072A Active JP6644831B2 (ja) 2009-07-10 2018-05-17 被コーティング物品およびそのコーティング方法

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2015197036A Active JP6342868B2 (ja) 2009-07-10 2015-10-02 被コーティング物品およびそのコーティング方法
JP2018095072A Active JP6644831B2 (ja) 2009-07-10 2018-05-17 被コーティング物品およびそのコーティング方法

Country Status (6)

Country Link
US (5) US8652649B2 (enExample)
EP (1) EP2451990B1 (enExample)
JP (3) JP2012532988A (enExample)
KR (2) KR20140117669A (enExample)
CN (2) CN104694928A (enExample)
WO (1) WO2011005302A1 (enExample)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9005420B2 (en) * 2007-12-20 2015-04-14 Integran Technologies Inc. Variable property electrodepositing of metallic structures
US8652649B2 (en) 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
US9694562B2 (en) * 2010-03-12 2017-07-04 Xtalic Corporation Coated articles and methods
US20110220511A1 (en) * 2010-03-12 2011-09-15 Xtalic Corporation Electrodeposition baths and systems
WO2012075009A1 (en) * 2010-11-29 2012-06-07 President And Fellows Of Harvard College Quality control of diamagnetic materials using magnetic levitation
US8574722B2 (en) 2011-05-09 2013-11-05 Tyco Electronics Corporation Corrosion resistant electrical conductor
US20120328904A1 (en) * 2011-06-23 2012-12-27 Xtalic Corporation Printed circuit boards and related articles including electrodeposited coatings
WO2013040400A1 (en) * 2011-09-14 2013-03-21 Xtalic Corporation Coated articles, electrodeposition baths, and related systems
KR101270770B1 (ko) * 2012-10-04 2013-06-03 와이엠티 주식회사 인쇄회로기판의 도금방법
US9224550B2 (en) 2012-12-26 2015-12-29 Tyco Electronics Corporation Corrosion resistant barrier formed by vapor phase tin reflow
US20140262798A1 (en) * 2013-03-15 2014-09-18 Xtalic Corporation Electrodeposition methods and baths for use with printed circuit boards and other articles
KR101465773B1 (ko) * 2014-05-19 2014-12-01 윤종오 음극 전극이 회전하지 않는 고정형인 릴투릴 도금용 음극 전극
JP6065886B2 (ja) * 2014-07-22 2017-01-25 トヨタ自動車株式会社 金属皮膜の成膜方法
KR101713016B1 (ko) * 2015-07-24 2017-03-07 덕산하이메탈(주) 도금에 의한 발열 및 비정질 특성을 갖는 박판 제조방법
US20170100744A1 (en) * 2015-10-12 2017-04-13 Tyco Electronics Corporation Electronic Component and Process of Producing Electronic Component
CN105543912B (zh) * 2016-02-15 2018-03-09 上海应用技术学院 一种在铜基体上制备复配表面活性剂/La‑Ni‑Mo‑W共沉积镀层的方法
US20170253008A1 (en) * 2016-02-16 2017-09-07 Xtalic Corporation Articles including a multi-layer coating and methods
JP6700852B2 (ja) * 2016-02-25 2020-05-27 日本圧着端子製造株式会社 電子部品、めっき方法、及びめっき装置
US11390960B1 (en) * 2016-09-28 2022-07-19 Plasma Processes, Llc High temperature corrosion resistant composite structure consisting of ruthenium and its alloys
US11152729B2 (en) * 2016-11-14 2021-10-19 TE Connectivity Services Gmbh Electrical connector and electrical connector assembly having a mating array of signal and ground contacts
US9859640B1 (en) 2016-11-14 2018-01-02 Te Connectivity Corporation Electrical connector with plated signal contacts
DE102017002472A1 (de) * 2017-03-14 2018-09-20 Diehl Metal Applications Gmbh Steckverbinder
JP2020521874A (ja) * 2017-05-01 2020-07-27 ザ・ジョンズ・ホプキンス・ユニバーシティ ナノ双晶化ニッケル・モリブデン・タングステン合金を析出する方法
JP2020536177A (ja) 2017-09-28 2020-12-10 マクステリアル インコーポレイテッド 表面コーティングを含む物品およびこれらを生成するための方法
US10875355B2 (en) * 2017-12-28 2020-12-29 Shimano Inc. Bicycle component and bicycle rim
CN109097811B (zh) * 2018-09-13 2020-09-22 济南东方结晶器有限公司 Co-Ni-P-金刚石镀层的电镀液及其制备方法与电镀方法
CN115298023B (zh) * 2020-03-18 2025-05-27 思力柯集团 纳米结构的基于钯的合金和相关方法
EP4355933A4 (en) 2021-06-18 2026-01-07 Maxterial Inc COATED SURFACES, COATINGS AND ARTICLES USING THEM
CN121398963A (zh) * 2022-12-16 2026-01-23 麦克斯特里尔有限公司 具有装饰性表面涂层的制品

Family Cites Families (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2212516A (en) * 1936-09-08 1940-08-27 United Shoe Machinery Corp Shoe and method of making the same
US2722949A (en) 1954-12-09 1955-11-08 Steel Heddle Mfg Co Heddle frames
JPS524061Y2 (enExample) 1971-07-10 1977-01-27
US3963455A (en) * 1973-01-12 1976-06-15 Lea-Ronal, Inc. Electrodeposited gold plating
US3964666A (en) 1975-03-31 1976-06-22 Western Electric Company, Inc. Bonding contact members to circuit boards
JPS5810998B2 (ja) * 1975-06-30 1983-02-28 松下電工株式会社 電気接点およびその電気接点の製造方法
JPS524061A (en) * 1975-06-30 1977-01-12 Matsushita Electric Works Ltd Plated contacts
JPS5280470A (en) * 1975-12-26 1977-07-06 Matsushita Electric Works Ltd Plated contacts
GB1507782A (en) * 1976-04-13 1978-04-19 Lea Ronal Inc Electrodeposition of gold
JPS53139173A (en) * 1977-05-11 1978-12-05 Alps Electric Co Ltd Composite contact material
JPS56154261A (en) * 1980-04-28 1981-11-28 Mishima Kosan Co Ltd Mold for continuous casting and its production
US4463059A (en) * 1982-06-30 1984-07-31 International Business Machines Corporation Layered metal film structures for LSI chip carriers adapted for solder bonding and wire bonding
ATE40721T1 (de) * 1984-05-11 1989-02-15 Burlington Industries Inc Elektrischer kontakt beschichtet mit einer amorphen uebergangslegierung der selbst mit einem goldfilm beschichtet ist.
US4628165A (en) * 1985-09-11 1986-12-09 Learonal, Inc. Electrical contacts and methods of making contacts by electrodeposition
GB2186597B (en) * 1986-02-17 1990-04-04 Plessey Co Plc Electrical contact surface coating
JP2529294B2 (ja) * 1987-09-25 1996-08-28 株式会社日立製作所 多層めつき方法
JPH01132072A (ja) * 1987-11-18 1989-05-24 Yazaki Corp 端子、接点等の金メッキ部品
US5309632A (en) 1988-03-28 1994-05-10 Hitachi Chemical Co., Ltd. Process for producing printed wiring board
JPH0359972A (ja) * 1989-07-27 1991-03-14 Yazaki Corp 電気接点
JP2731040B2 (ja) 1991-02-05 1998-03-25 三菱電機株式会社 半導体装置の製造方法
US5318687A (en) 1992-08-07 1994-06-07 International Business Machines Corporation Low stress electrodeposition of gold for X-ray mask fabrication
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US20030199179A1 (en) 1993-11-16 2003-10-23 Formfactor, Inc. Contact tip structure for microelectronic interconnection elements and method of making same
JP2664878B2 (ja) 1994-01-31 1997-10-22 インターナショナル・ビジネス・マシーンズ・コーポレイション 半導体チップパッケージおよびその製造方法
JP3000877B2 (ja) 1995-02-20 2000-01-17 松下電器産業株式会社 金メッキ電極の形成方法、基板及びワイヤボンディング方法
US5675177A (en) 1995-06-26 1997-10-07 Lucent Technologies Inc. Ultra-thin noble metal coatings for electronic packaging
US5679471A (en) * 1995-10-16 1997-10-21 General Motors Corporation Silver-nickel nano-composite coating for terminals of separable electrical connectors
US6487106B1 (en) 1999-01-12 2002-11-26 Arizona Board Of Regents Programmable microelectronic devices and method of forming and programming same
US6335107B1 (en) * 1999-09-23 2002-01-01 Lucent Technologies Inc. Metal article coated with multilayer surface finish for porosity reduction
US6359233B1 (en) 1999-10-26 2002-03-19 Intel Corporation Printed circuit board multipack structure having internal gold fingers and multipack and printed circuit board formed therefrom, and methods of manufacture thereof
US20010033020A1 (en) 2000-03-24 2001-10-25 Stierman Roger J. Structure and method for bond pads of copper-metallized integrated circuits
US6755958B2 (en) * 2000-12-11 2004-06-29 Handy & Harman Barrier layer for electrical connectors and methods of applying the layer
US6528185B2 (en) * 2001-02-28 2003-03-04 Hong Kong Polytechnic University Cobalt-tungsten-phosphorus alloy diffusion barrier coatings, methods for their preparation, and their use in plated articles
JP2002256444A (ja) * 2001-03-05 2002-09-11 Okuno Chem Ind Co Ltd 配線基板
US7930815B2 (en) 2003-04-11 2011-04-26 Avery Dennison Corporation Conductive pattern and method of making
JP2005068445A (ja) * 2003-08-25 2005-03-17 Dowa Mining Co Ltd 金属被覆された金属部材
CN1313647C (zh) * 2003-09-04 2007-05-02 长沙高新技术产业开发区英才科技有限公司 电沉积钨基系列非晶合金镀层或纳米晶合金镀层及所使用的电镀液和工艺
US7391116B2 (en) 2003-10-14 2008-06-24 Gbc Metals, Llc Fretting and whisker resistant coating system and method
JP2005163153A (ja) * 2003-12-05 2005-06-23 Japan Pure Chemical Co Ltd 無電解ニッケル置換金めっき処理層、無電解ニッケルめっき液、および無電解ニッケル置換金めっき処理方法
US20060154084A1 (en) 2005-01-10 2006-07-13 Massachusetts Institute Of Technology Production of metal glass in bulk form
JP4868123B2 (ja) * 2005-02-04 2012-02-01 学校法人早稲田大学 金−ニッケル系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法
US7425255B2 (en) * 2005-06-07 2008-09-16 Massachusetts Institute Of Technology Method for producing alloy deposits and controlling the nanostructure thereof using negative current pulsing electro-deposition
JP4868116B2 (ja) * 2005-09-30 2012-02-01 学校法人早稲田大学 金−コバルト系アモルファス合金めっき皮膜、電気めっき液及び電気めっき方法
US7521128B2 (en) 2006-05-18 2009-04-21 Xtalic Corporation Methods for the implementation of nanocrystalline and amorphous metals and alloys as coatings
CN100500924C (zh) * 2006-08-10 2009-06-17 中国科学院微电子研究所 一种金属纳米晶薄膜的制备方法
JP2008078032A (ja) * 2006-09-22 2008-04-03 Alps Electric Co Ltd 接続装置
US20090283410A1 (en) * 2008-05-14 2009-11-19 Xtalic Corporation Coated articles and related methods
US20090286103A1 (en) * 2008-05-14 2009-11-19 Xtalic Corporation Coated articles and related methods
US20100116675A1 (en) 2008-11-07 2010-05-13 Xtalic Corporation Electrodeposition baths, systems and methods
US8652649B2 (en) 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
US8309382B2 (en) 2009-10-29 2012-11-13 Advantest America, Inc. Multi material secondary metallization scheme in MEMS fabrication
US8913550B2 (en) * 2010-02-16 2014-12-16 Intel Corporation Clustering management in mmWave wireless systems
US9694562B2 (en) 2010-03-12 2017-07-04 Xtalic Corporation Coated articles and methods
JP5681378B2 (ja) * 2010-04-27 2015-03-04 Ｄｏｗａメタルテック株式会社 めっき部材およびその製造方法
FR2974818B1 (fr) 2011-05-05 2013-05-24 Alchimer Procede de depot de couches metalliques a base de nickel ou de cobalt sur un substrat solide semi-conducteur ; kit pour la mise en oeuvre de ce procede
US8574722B2 (en) 2011-05-09 2013-11-05 Tyco Electronics Corporation Corrosion resistant electrical conductor
US20120328904A1 (en) 2011-06-23 2012-12-27 Xtalic Corporation Printed circuit boards and related articles including electrodeposited coatings
JP7585775B2 (ja) 2020-12-24 2024-11-19 ブラザー工業株式会社 サポートプログラム

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