JP2008124188A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008124188A5 JP2008124188A5 JP2006305111A JP2006305111A JP2008124188A5 JP 2008124188 A5 JP2008124188 A5 JP 2008124188A5 JP 2006305111 A JP2006305111 A JP 2006305111A JP 2006305111 A JP2006305111 A JP 2006305111A JP 2008124188 A5 JP2008124188 A5 JP 2008124188A5
- Authority
- JP
- Japan
- Prior art keywords
- wire
- fine
- insulating
- electrode structure
- thin wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010419 fine particle Substances 0.000 claims 14
- 238000004519 manufacturing process Methods 0.000 claims 13
- 239000004020 conductor Substances 0.000 claims 6
- 238000000034 method Methods 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 5
- 239000004065 semiconductor Substances 0.000 claims 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 3
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 3
- 239000011651 chromium Substances 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 229910052804 chromium Inorganic materials 0.000 claims 1
- 229910017052 cobalt Inorganic materials 0.000 claims 1
- 239000010941 cobalt Substances 0.000 claims 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 125000002228 disulfide group Chemical group 0.000 claims 1
- 238000010894 electron beam technology Methods 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 229910052742 iron Inorganic materials 0.000 claims 1
- 125000002462 isocyano group Chemical group *[N+]#[C-] 0.000 claims 1
- 229910052759 nickel Inorganic materials 0.000 claims 1
- 229910052763 palladium Inorganic materials 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 229910052709 silver Inorganic materials 0.000 claims 1
- 239000004332 silver Substances 0.000 claims 1
- 125000003396 thiol group Chemical group [H]S* 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006305111A JP2008124188A (ja) | 2006-11-10 | 2006-11-10 | 電極構造体及びその製造方法、並びに電子デバイス |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006305111A JP2008124188A (ja) | 2006-11-10 | 2006-11-10 | 電極構造体及びその製造方法、並びに電子デバイス |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008124188A JP2008124188A (ja) | 2008-05-29 |
| JP2008124188A5 true JP2008124188A5 (enExample) | 2009-12-03 |
Family
ID=39508633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006305111A Pending JP2008124188A (ja) | 2006-11-10 | 2006-11-10 | 電極構造体及びその製造方法、並びに電子デバイス |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008124188A (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5360528B2 (ja) * | 2008-05-07 | 2013-12-04 | 国立大学法人北陸先端科学技術大学院大学 | ギャップで分断された薄膜の製造方法、およびこれを用いたデバイスの製造方法 |
| US8114787B2 (en) * | 2009-02-19 | 2012-02-14 | Empire Technology Development Llc | Integrated circuit nanowires |
| KR101407209B1 (ko) * | 2010-10-07 | 2014-06-16 | 포항공과대학교 산학협력단 | 미세 패턴 형성 방법 및 이를 이용한 미세 채널 트랜지스터 및 미세 채널 발광트랜지스터의 형성방법 |
| CN108072683B (zh) * | 2016-11-10 | 2021-04-23 | 元太科技工业股份有限公司 | 感测元件及其形成方法 |
| US11784227B2 (en) | 2017-10-13 | 2023-10-10 | Wayne State University | Method for fabricating wafer scale/nano sub micron gap electrodes and arrays via photolithography |
| GB2610886B (en) * | 2019-08-21 | 2023-09-13 | Pragmatic Printing Ltd | Resistor geometry |
| GB2587793B (en) | 2019-08-21 | 2023-03-22 | Pragmatic Printing Ltd | Electronic circuit comprising transistor and resistor |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2373095A (en) * | 2001-03-09 | 2002-09-11 | Seiko Epson Corp | Patterning substrates with evaporation residues |
-
2006
- 2006-11-10 JP JP2006305111A patent/JP2008124188A/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| MY169953A (en) | Copper metal film, method for producing same, copper metal pattern, conductive wiring line using the copper metal pattern, copper metal bump, heat conduction path, bonding material, and liquid composition | |
| US20100101832A1 (en) | Compound magnetic nanowires for tco replacement | |
| TWI525923B (zh) | 電性接點零件 | |
| WO2010087053A1 (ja) | ボンディングワイヤ | |
| JP2001319946A5 (enExample) | ||
| JP2017092078A (ja) | ボールボンディング用貴金属被覆銅ワイヤ | |
| JP2008124188A5 (enExample) | ||
| TW200701275A (en) | Ceramic electronic component and manufacturing method thereof | |
| JP2012182129A5 (enExample) | ||
| JP2017050407A (ja) | ボールボンディング用パラジウム（Ｐｄ）被覆銅ワイヤ | |
| TW201247524A (en) | Bump with nanolaminated structure, package structure of the same and method of preparing the same | |
| GB2579505A (en) | Dynamic glass and method of formation | |
| JPWO2014027418A1 (ja) | 電子部品および電子部品の製造方法 | |
| US9111556B1 (en) | Low resistance interface metal for disk drive suspension component grounding | |
| JP2008193009A5 (enExample) | ||
| CN106653910A (zh) | 一种光伏焊带及其制备方法 | |
| JP2007043113A5 (ja) | 半導体装置の作製方法 | |
| CN105981165B (zh) | 在载条上制造可结合覆层的方法 | |
| JP2007103828A5 (enExample) | ||
| CN103776882B (zh) | 一种基于氮化硅的纳米金膜电极 | |
| CN104607648B (zh) | 一种制备纳米或亚微米级锡或锡合金微球的方法 | |
| JP7072811B2 (ja) | 金属めっき物 | |
| JP2006108354A5 (enExample) | ||
| KR102216738B1 (ko) | 반도체 패키지용 클립구조체 | |
| CN103367304B (zh) | 封装基板、覆晶式封装及其制造方法 |