AU2002239604A1 - Barrier layer for electrical connectors and methods of applying the layer - Google Patents

Barrier layer for electrical connectors and methods of applying the layer

Info

Publication number
AU2002239604A1
AU2002239604A1 AU2002239604A AU3960402A AU2002239604A1 AU 2002239604 A1 AU2002239604 A1 AU 2002239604A1 AU 2002239604 A AU2002239604 A AU 2002239604A AU 3960402 A AU3960402 A AU 3960402A AU 2002239604 A1 AU2002239604 A1 AU 2002239604A1
Authority
AU
Australia
Prior art keywords
layer
applying
methods
electrical connectors
barrier layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002239604A
Inventor
Amit Datta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Handy and Harman
Original Assignee
Handy and Harman
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Handy and Harman filed Critical Handy and Harman
Publication of AU2002239604A1 publication Critical patent/AU2002239604A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12708—Sn-base component
    • Y10T428/12722—Next to Group VIII metal-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12903—Cu-base component
    • Y10T428/1291—Next to Co-, Cu-, or Ni-base component
AU2002239604A 2000-12-11 2001-12-11 Barrier layer for electrical connectors and methods of applying the layer Abandoned AU2002239604A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25475100P 2000-12-11 2000-12-11
US60/254,751 2000-12-11
PCT/US2001/048160 WO2002049077A2 (en) 2000-12-11 2001-12-11 Barrier layer for electrical connectors and methods of applying the layer

Publications (1)

Publication Number Publication Date
AU2002239604A1 true AU2002239604A1 (en) 2002-06-24

Family

ID=22965455

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002239604A Abandoned AU2002239604A1 (en) 2000-12-11 2001-12-11 Barrier layer for electrical connectors and methods of applying the layer

Country Status (3)

Country Link
US (1) US6755958B2 (en)
AU (1) AU2002239604A1 (en)
WO (1) WO2002049077A2 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10318890B4 (en) * 2003-04-17 2014-05-08 Ami Doduco Gmbh Electrical plug contacts and a semi-finished product for their production
JP4739734B2 (en) * 2003-11-28 2011-08-03 ヴィーラント ウェルケ アクチーエン ゲゼルシャフト CONTINUOUS LAYER FOR PRODUCING COMPOSITE FOR ELECTRO-Mechanical Components, COMPOSITE MATERIAL AND METHOD OF USE
DE502004010902D1 (en) * 2003-11-28 2010-04-29 Wieland Werke Ag Layer sequence for producing a composite material for electromechanical components
US7189626B2 (en) * 2004-11-03 2007-03-13 Micron Technology, Inc. Electroless plating of metal caps for chalcogenide-based memory devices
US7575665B2 (en) * 2005-04-28 2009-08-18 Delphi Technologies, Inc. Method of reducing corrosion of silver containing surfaces
KR100680128B1 (en) 2005-05-31 2007-02-08 주동근 The method for manufacturing the multi-layered copper-electroformed product
KR100715527B1 (en) * 2005-05-31 2007-05-08 주동근 Multi-layered copper-electroformed product
KR100680131B1 (en) 2005-05-31 2007-02-08 주동근 The method for manufacturing the multi-layered copper-electroformed product
JP4934456B2 (en) * 2006-02-20 2012-05-16 古河電気工業株式会社 Plating material and electric / electronic component using the plating material
US20080308300A1 (en) * 2007-06-18 2008-12-18 Conti Mark A Method of manufacturing electrically conductive strips
US7727890B2 (en) * 2007-12-10 2010-06-01 International Business Machines Corporation High aspect ratio electroplated metal feature and method
JP4647724B2 (en) * 2009-04-17 2011-03-09 Ｊｘ日鉱日石金属株式会社 Barrier film for semiconductor wiring, sintered sputtering target, and sputtering target manufacturing method
US8652649B2 (en) * 2009-07-10 2014-02-18 Xtalic Corporation Coated articles and methods
JP6046406B2 (en) * 2011-07-26 2016-12-14 ローム アンド ハース エレクトロニック マテリアルズ エルエルシーＲｏｈｍ ａｎｄ Ｈａａｓ Ｅｌｅｃｔｒｏｎｉｃ Ｍａｔｅｒｉａｌｓ ＬＬＣ High temperature resistant silver coated substrate
JP5588419B2 (en) * 2011-10-26 2014-09-10 株式会社東芝 package
US9627790B2 (en) * 2012-10-04 2017-04-18 Fci Americas Technology Llc Electrical contact including corrosion-resistant coating
US20140262798A1 (en) * 2013-03-15 2014-09-18 Xtalic Corporation Electrodeposition methods and baths for use with printed circuit boards and other articles
CN105814746B (en) * 2013-12-04 2018-05-15 株式会社自动网络技术研究所 Electric contact and bonder terminal pair
JP6422658B2 (en) * 2014-02-27 2018-11-14 新光電気工業株式会社 Electroplating bath and electroplating method
CN105371000A (en) * 2015-12-25 2016-03-02 苏州露宇电子科技有限公司 Nuclear magnetic resonance scanner
CN105887085B (en) * 2016-04-22 2018-03-16 武汉钢铁有限公司 A kind of production method for plating the very thin steel band of noble metal
US11152729B2 (en) * 2016-11-14 2021-10-19 TE Connectivity Services Gmbh Electrical connector and electrical connector assembly having a mating array of signal and ground contacts
US9859640B1 (en) 2016-11-14 2018-01-02 Te Connectivity Corporation Electrical connector with plated signal contacts
JP7111000B2 (en) * 2019-01-18 2022-08-02 株式会社オートネットワーク技術研究所 Metal materials and connection terminals

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55146806A (en) 1979-05-02 1980-11-15 Furukawa Electric Co Ltd Method of manufacturing tin or tin alloy plated copper wire
JPS56154261A (en) * 1980-04-28 1981-11-28 Mishima Kosan Co Ltd Mold for continuous casting and its production
JPS5757886A (en) 1980-09-24 1982-04-07 Hitachi Cable Ltd Heat resistant silver coated conductor
US5695810A (en) 1996-11-20 1997-12-09 Cornell Research Foundation, Inc. Use of cobalt tungsten phosphide as a barrier material for copper metallization
CN1407141A (en) 2001-03-16 2003-04-02 希普雷公司 Tinplating

Also Published As

Publication number Publication date
US20030035977A1 (en) 2003-02-20
WO2002049077A3 (en) 2002-09-26
WO2002049077A2 (en) 2002-06-20
US6755958B2 (en) 2004-06-29

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