KR100715527B1 - Multi-layered copper-electroformed product - Google Patents

Abstract

The present invention relates to a multilayer copper electroplated article,

Copper plating layer 100, cobalt plating layer 200, substitute platinum plating layer 300, and multilayer copper electroplating products having a structure in which hologram 500, hologram 500, and chromium plating layer 400 are sequentially stacked from the bottom. Since it is characterized by, harmless to the human body, there is an advantage that the hardness and corrosion resistance greatly improved.

Description

MULTI-LAYERED COPPER-ELECTROFORMED PRODUCT}

1 is a cross-sectional view showing the structure of a plating layer manufactured by the multilayer copper electroplating method according to the present invention.

2 is a process chart showing the multilayer copper electroplating method according to the present invention.

3 is a process chart showing the multilayer copper electroplating method according to the present invention.

4 is a diagram showing a schematic configuration of air agitation.

※ Explanation of Major Drawings

100 ... copper plating layer

200 ... Cobalt Plated Layer

300. Substituted platinum plating layer

400 ... chrome plated layer

500 ... Hologram

The present invention relates to a multilayer copper electroplating article, and more particularly to a multilayer copper electroplating article which is harmless to human body and has high hardness.

Electroplating is a method of manufacturing or replicating metal products by electrodeposition.

As a representative example, a metal salt is deposited in a model (circular, master) by electrolysis of a metal salt solution, and then the electrodeposition layer is removed from the model. There is something to get.

Although the said conduction is used as it is, the peeling film process may be performed on the surface which was peeled off again, and the same operation may be performed to obtain the product exactly identical with a model.

In some cases, the metal is thickly plated and then commercialized.

To distinguish between ordinary plating and electroplating, the electrodeposited thickness in ordinary plating is 0.001mm to 0.05mm, whereas electroplating is large from 0.025mm to 25mm.

According to the electroplating, it is possible to adjust the type, hardness, etc. of the metal according to the electrolytic conditions to obtain a wide range of physical properties, to produce a product with almost no error in the original, it is possible to accurately reproduce the surface state. In addition, there is almost no limitation on the size or shape of the product and a high purity metal product can be obtained.

Accordingly, in recent years, many products that have been pre-plated on the surface of watches, glasses, fountain pens, toys, and mobile phone cases have been released.

Nickel (Ni) is mentioned as a typical representative metal for electroplating.

However, in the case of nickel, the nickel allergy is induced by the user and is regulated. In particular, when nickel is contaminated and oxidized in salt water, sweat or cosmetics, it tends to be more harmful.

In addition, conventional electroplating with nickel tends to have a very rough surface of the nickel plating layer. For this reason, in order to obtain a smooth surface, a thick nickel-plated plating layer had to be formed normally. For this reason, when the nickel gloss plating layer is formed on the hologram, the reproducibility of the hologram is greatly reduced.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a multi-layer copper electroplating article exhibiting a sufficient hardness value and harmless to the human body.

In addition, another object of the present invention is to provide a multi-layer copper electroplated article that can greatly increase the reproducibility when the hologram is applied to the surface of the product.

In order to achieve the above object, the multilayer copper electroplated article according to the present invention,

The copper plating layer, the cobalt plating layer, and the substitute platinum plating layer are laminated | stacked continuously from the bottom, It is characterized by the above-mentioned.

Here, when the chromium plating layer is laminated on the substitute platinum plating layer, corrosion resistance and hardness are further improved.

In addition, a hologram is attached to the substitute platinum plating layer, and the chromium plating layer can be laminated thereon.

In particular, the hardness of the copper plating layer is preferably in the range of 180 Hv to 220 Hv in Vickers hardness value.

Further, the plating layer is a copper plating layer 100 having a thickness of 0.2 to 0.3mm from the bottom, a cobalt plating layer 200 having a thickness of 0.6 to 1.4 µm, a substitute platinum plating layer 300 having a thickness of 0.08 to 0.12 µm, and 0.25 to 0.35 µm It is preferable that the thickness of the chromium plating layer 400 is continuously stacked.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 shows a plating layer structure according to the multilayer copper electroplating method of the present invention.

As shown, a copper plating layer 100 having a thickness of 0.2 to 0.3 mm from the bottom, a cobalt plating layer 200 having a thickness of 0.6 to 1.4 μm, a substitute platinum plating layer 300 having a thickness of 0.08 to 0.12 μm, and a 0.25 to 0.35 μm thickness The chromium plating layers 400 are successively laminated to form a laminated structure having a total thickness of 0.25 to 0.32 mm.

The copper plating layer 100 is a uniform and relatively thick base layer having a dense and dense crystal structure. Particularly, in the plating process, when a suitable amount of mercapto thiazole is included in the plating solution, tensile strength can be obtained up to about 60,000 lb / in ² similar to nickel, and hardness can be obtained up to about 180 to 220 Hv (Vickers hardness).

Next, the cobalt plated layer 200 is a base plated layer of a white background, and enhances adhesion between copper and layers, and improves the hardness of the hologram surface when the hologram 500 is attached to the copper plated layer 100.

In addition, the substitute platinum plating layer 300 is a layer that provides corrosion resistance to the hologram and other plating layers and exhibits a white outer surface color. In particular, even if the surface is contaminated by saline, sweat or cosmetics serves to prevent oxidation.

In addition, the chromium plating layer 400 is a plating layer for further improving surface hardness and corrosion resistance in order to protect the hologram 500 and the lower plating layer.

2 and 3 show an example of a manufacturing process for producing a multi-layer copper electroplated article according to the present invention.

As shown in Figure 2, the manufacturing process of the multi-layer copper electroplating layer according to the present embodiment, the step of obtaining a two-dimensional type of the negative sound conducted by plating the one-dimensional type, and substitutes for the two-dimensional type of the conducted negative shape Platinum plating (IWP), cobalt base plating (CBP) on the substitute platinum plating layer, pyrophosphate copper plating on the cobalt base plating layer (PCP), and the new plating layer conducting negative two-dimensional type It comprises a step of separating from, forming step, and chromium plating step (CRP) on the substitute platinum plating layer.

The one-dimensional type is made of copper (Cu), nickel (Ni), or brass and has a predetermined shape.

When the hologram is included in the surface of the product, the hologram is installed on the surface of the one-dimensional type in advance so that it can be copied to the inner surface of the two-dimensional type. In addition, when subsequent multi-layer plating is performed on the inner surface of the two-dimensional negative type, the hologram is also copied to the surface of the substitute platinum plating layer, so that the hologram is accurately generated in a predetermined shape on the surface of the final product.

In addition, the inverted negative two-dimensional type may be made by pre-plating a metal such as copper, nickel or brass in a one-dimensional type in a conventional manner. If a two-dimensional type is made of copper, the following pyrophosphate copper plating (PCP) process can be followed.

In order to easily separate the plating layer from the one-dimensional type or the two-dimensional type, it is preferable to apply a separating coating agent to the circular shape. The separation coating agent may be used by dissolving ammonium dichromate in water about 120 ~ 170g / l, immersed in the separation coating agent 1 or 2 dimensional type for 1 to 3 minutes, then take out the plating operation sequentially until copper plating By doing so, the final pole product can be made.

Hereinafter, each plating process will be described in detail.

First, the Imitation White Gold Plating (IWP) substitutes 70 to 90 g / l citric acid (C ₆ H ₈ O ₇ .H ₂ O) and potassium citrate (K ₂ C ₆ H ₅ O ₇ .H ₂ O). 60 to 80 g / l, 5 to 15 g / l of cuprous chloride, 0.05 to 0.15 g / l of indium sulfate, 1 to 1.5 g / l of Plating Gold Chemical (Plating Gold Chemical) It is made by applying a cathode current density of 0.3 to 1 A / dm ² , an anode current density of 1 to 4 A / dm ² , and a voltage of 1.2 to ³ V in a plating solution having a pH of 3.5 to 4.0 and a specific gravity of 9 to 13 Be '(Bume). . Platinum plated titanium may be used as the anode.

The plating conditions described above are within a range in which copper is electrodeposited firmly without incomplete plating or peeling phenomenon.

Here, in order to activate the plating more, it is to apply the air stirring as shown in FIG.

And, the plating state can be analyzed through the Hullcell Test. That is, the plating color, the metal component, the consumption per hour, and the precipitation amount per 1 A / dm ² can be determined.

By judging the plating state, the thickness is reached to 0.08 to 0.12 mu m.

Next, the cobalt base plating step (CBP, Cobalt Plating), 200 to 400 g / l cobalt sulfate, 15 to 25 g / l ammonium chloride, 60 to 70 g / l boric acid, 0.1 to 0.2 g / l antifit agent (surfactant), Cobalt plating is achieved by applying a cathode current density of 0.5 to 4.5 A / dm ² , an anode current density of 1 to 4 A / dm ² , and a voltage of 1.5 to 6 V in a plating solution having a temperature of 18 ° C. to 27 ° C. and a pH of 5.0 to 7.0. Conventional conditions may be used. The positive electrode is made of cobalt slag or carbon electrode plate.

The plating conditions described above are within a range in which copper is electrodeposited firmly without incomplete plating or peeling phenomenon.

Here, in order to activate the plating more, it is strongly applied to the air stirring as shown in FIG.

By determining the plating state, a plating layer having a thickness of 0.6 to 1.4 mu m is reached.

Pyrophosphate Cupric Plating (PCP, Pyrophosphate Cupric Plating), copper pyrophosphate 75-105g / l, metal copper 22-36g / l, potassium pyrophosphate 280-380g / l, potassium nitrate 10-25g / l, ammonia water It consists of 0.2-3 ml / l, CP-3 (product name) 0.1-0.3 g / l, CPS-2 (product name) 0.3-0.7 g / l, temperature 50 degreeC-60 degreeC, pH 8.2-9.0, P ratio ( P ₂ O ₇ / Cu) In a plating solution of 7.0 to 8.0, a cathode current density of 0.5 to 4.5 A / dm ² , an anode current density of 1 to 4 A / dm ² , and a voltage of 1.5 to 6 V are applied. Here, CP-3 is a wetting agent, and CPS-2 is a product name of auxiliary additives, such as a brightening agent. Pure copper may be used as the anode.

When 0.3-0.5 ml of mercaptothiazole is added with respect to the said copper plating liquid, the hardness of pole copper will improve significantly. As a result of the actual experiment, in the case of ordinary copper plating, 150-160 Hv (based on Vickers hardness) was shown, but when mercaptothiazole was added within the above range, the hardness rose to the range of 180-220 Hv.

Here, the stirring is performed by air stirring or ultrasonic vibration in order to activate the plating more, in the case of increasing the timing of the gaiters (stirring) is possible 4 to 5 times faster electrodeposition. The configuration of the air agitation is as shown in Figure 4, has a structure in which a plurality of air holes perforated in a PVC pipe of 15 to 25mm in diameter. Therefore, agitation is performed by blowing air from the outside of the plating bath and evenly wetting the inside of the plating liquid.

In addition, the plating liquid is treated with activated carbon once a month, and once a week, a carbon filter is used to remove impurities.

When the pH is increased, potassium hydroxide (KOH) is added, and when the pH is lowered, pyrophosphoric acid or tetraphosphoric acid is added.

The plating conditions described above are within a range in which copper is electrodeposited firmly without incomplete plating or peeling phenomenon.

Through determination of the plating state, the thickness reaches 0.2 to 0.3 mm.

Next, chromium plating may be performed by general chromium plating, ATOTECH Co., Ltd. (HEEF-25) high speed hard plating or general agent bath and mica chromium plating.

As standard plating conditions, in a plating solution of 200 to 300 g / l of chromic acid, 2.0 to 4.5 g / l of sulfuric acid and a temperature of 55 to 60 ° C, the cathode current density of 35 to 75 A / dm ² and the anode current density of 1 / of the cathode current density 2, voltage 9-15V can be applied. As the anode, tin, anchimony, or the like may be used. In addition, the plating rate can be appropriately adjusted by the magnitude of the current density.

The plating conditions described above are within a range in which copper is electrodeposited firmly without incomplete plating or peeling phenomenon.

Through the determination of the plating state, the thickness reaches 0.25 to 0.35 mu m.

In the above-described plating examples, the plating bath may be made of a material such as general P.E or P.V.C.

On the other hand, before the chromium plating, it is preferable that the molding operation is performed by pressing or the like in a state where the plated product is separated from the two-dimensional type.

By the plating method according to the present invention as described above, a mobile phone case and various ornaments can be manufactured precisely.

On the other hand, the step of performing alternative platinum plating (IWP) to the negative shape formed circle, the step of cobalt base plating (CBP) on the substitute platinum plating layer, the step of copper plating pyrophosphate on the cobalt base plating layer (PCP) and the plating layer Separation from the negative prototype, molding, and chromium plating on the surrogate platinum plating layer (CRP) can simplify the product without holograms.

In this case, the negative shape is formed by gypsum, copper, nickel, or brass.

The above embodiments merely illustrate the most preferred examples of the present invention, and various changes or modifications may be made by those skilled in the art within the spirit and scope described in the appended claims.

According to the present invention having the above-described configuration, since the base metal is made of copper, it does not cause allergy and the like, and thus, there is an advantage of being harmless to the human body.

In addition, the above-described multilayered structure greatly improves the hardness and corrosion resistance, thereby preventing the occurrence of scratches or oxidation by salt water, sweat, or the like.

In addition, even when only a thin chromium plating layer is formed, the smooth surface is maintained, so the reproducibility of the hologram is excellent.

In addition, it is possible to manufacture a product that accurately embodies a circular outer surface.

Claims (5)

delete delete In the multilayer copper electroplating products, The copper plating layer 100, the cobalt plating layer 200, and the substitute platinum plating layer 300 are sequentially stacked from the bottom, The hologram 500 is attached on the substitute platinum plating layer 300, and the chromium plating layer 400 is laminated thereon. The method of claim 3, The copper plating layer (100) is a Vickers hardness value of the multilayer copper electroplating products, characterized in that in the range of 180Hv ~ 220Hv. The method of claim 3, The plating layer may be 0.2 to 0.3 mm thick copper plating layer 100, 0.6 to 1.4 μm thick cobalt plating layer 200, 0.08 to 0.12 μm thick platinum plating layer 300, and 0.25 to 0.35 μm thick. Multi-layer copper electroplating products, characterized in that the chromium plating layer 400 is a continuous laminated structure.

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