JP2012503880A5 - - Google Patents
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- Publication number
- JP2012503880A5 JP2012503880A5 JP2011529022A JP2011529022A JP2012503880A5 JP 2012503880 A5 JP2012503880 A5 JP 2012503880A5 JP 2011529022 A JP2011529022 A JP 2011529022A JP 2011529022 A JP2011529022 A JP 2011529022A JP 2012503880 A5 JP2012503880 A5 JP 2012503880A5
- Authority
- JP
- Japan
- Prior art keywords
- dispersion
- substrate
- silicon nitride
- chloride
- vinylpyridinium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000006185 dispersion Substances 0.000 claims 14
- 239000000758 substrate Substances 0.000 claims 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 9
- 239000000178 monomer Substances 0.000 claims 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 7
- 238000000034 method Methods 0.000 claims 7
- 229920000642 polymer Polymers 0.000 claims 7
- 229910052814 silicon oxide Inorganic materials 0.000 claims 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 claims 5
- 125000000129 anionic group Chemical group 0.000 claims 4
- SYPXNWGMHMNKMW-UHFFFAOYSA-N 2-ethenyl-1-ethylpyridin-1-ium Chemical compound CC[N+]1=CC=CC=C1C=C SYPXNWGMHMNKMW-UHFFFAOYSA-N 0.000 claims 3
- 125000002091 cationic group Chemical group 0.000 claims 3
- 238000001246 colloidal dispersion Methods 0.000 claims 3
- 238000005498 polishing Methods 0.000 claims 3
- 239000000126 substance Substances 0.000 claims 3
- 229910052684 Cerium Inorganic materials 0.000 claims 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 claims 2
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims 2
- GQOKIYDTHHZSCJ-UHFFFAOYSA-M dimethyl-bis(prop-2-enyl)azanium;chloride Chemical compound [Cl-].C=CC[N+](C)(C)CC=C GQOKIYDTHHZSCJ-UHFFFAOYSA-M 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- UZNHKBFIBYXPDV-UHFFFAOYSA-N trimethyl-[3-(2-methylprop-2-enoylamino)propyl]azanium;chloride Chemical compound [Cl-].CC(=C)C(=O)NCCC[N+](C)(C)C UZNHKBFIBYXPDV-UHFFFAOYSA-N 0.000 claims 2
- -1 trimethylammoniomethyl Chemical group 0.000 claims 2
- 229910052726 zirconium Inorganic materials 0.000 claims 2
- CSPHGSFZFWKVDL-UHFFFAOYSA-M (3-chloro-2-hydroxypropyl)-trimethylazanium;chloride Chemical compound [Cl-].C[N+](C)(C)CC(O)CCl CSPHGSFZFWKVDL-UHFFFAOYSA-M 0.000 claims 1
- WLZPCFOGJNCCRJ-UHFFFAOYSA-M 4-ethenyl-1-ethylpyridin-1-ium;bromide Chemical compound [Br-].CC[N+]1=CC=C(C=C)C=C1 WLZPCFOGJNCCRJ-UHFFFAOYSA-M 0.000 claims 1
- AMYCWFKWUBKIDD-UHFFFAOYSA-M 4-ethenyl-1-ethylpyridin-1-ium;chloride Chemical compound [Cl-].CC[N+]1=CC=C(C=C)C=C1 AMYCWFKWUBKIDD-UHFFFAOYSA-M 0.000 claims 1
- CZCNWNDODBDUEX-UHFFFAOYSA-M 4-ethenyl-1-ethylpyridin-1-ium;methyl sulfate Chemical compound COS([O-])(=O)=O.CC[N+]1=CC=C(C=C)C=C1 CZCNWNDODBDUEX-UHFFFAOYSA-M 0.000 claims 1
- ACKOMRKOSWHRSO-UHFFFAOYSA-O 5-carbamoylhex-5-enyl(trimethyl)azanium Chemical compound C[N+](C)(C)CCCCC(=C)C(N)=O ACKOMRKOSWHRSO-UHFFFAOYSA-O 0.000 claims 1
- FLCAEMBIQVZWIF-UHFFFAOYSA-N 6-(dimethylamino)-2-methylhex-2-enamide Chemical compound CN(C)CCCC=C(C)C(N)=O FLCAEMBIQVZWIF-UHFFFAOYSA-N 0.000 claims 1
- 239000005630 Diquat Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 150000001450 anions Chemical class 0.000 claims 1
- 150000001875 compounds Chemical class 0.000 claims 1
- SYJFEGQWDCRVNX-UHFFFAOYSA-N diquat Chemical compound C1=CC=[N+]2CC[N+]3=CC=CC=C3C2=C1 SYJFEGQWDCRVNX-UHFFFAOYSA-N 0.000 claims 1
- 235000014413 iron hydroxide Nutrition 0.000 claims 1
- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims 1
- 229910000000 metal hydroxide Inorganic materials 0.000 claims 1
- 229910021518 metal oxyhydroxide Inorganic materials 0.000 claims 1
- SAGAVVTVDBUWQA-UHFFFAOYSA-N methyl hydrogen sulfate;hydrochloride Chemical compound Cl.COS(O)(=O)=O SAGAVVTVDBUWQA-UHFFFAOYSA-N 0.000 claims 1
- QFAZBWSBUULFFE-UHFFFAOYSA-N methyl hydrogen sulfate;prop-2-enamide Chemical compound NC(=O)C=C.COS(O)(=O)=O QFAZBWSBUULFFE-UHFFFAOYSA-N 0.000 claims 1
- FSQHDIAYKNDZFC-UHFFFAOYSA-N methyl sulfate;trimethyl-[3-(2-methylprop-2-enoylamino)propyl]azanium Chemical compound COS([O-])(=O)=O.CC(=C)C(=O)NCCC[N+](C)(C)C FSQHDIAYKNDZFC-UHFFFAOYSA-N 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 125000001453 quaternary ammonium group Chemical group 0.000 claims 1
- 229910052761 rare earth metal Inorganic materials 0.000 claims 1
- 229910001404 rare earth metal oxide Inorganic materials 0.000 claims 1
- 150000002910 rare earth metals Chemical class 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000010936 titanium Substances 0.000 claims 1
- 229910052719 titanium Inorganic materials 0.000 claims 1
- AIUAMYPYEUQVEM-UHFFFAOYSA-N trimethyl(2-prop-2-enoyloxyethyl)azanium Chemical class C[N+](C)(C)CCOC(=O)C=C AIUAMYPYEUQVEM-UHFFFAOYSA-N 0.000 claims 1
- YKGLFTQEQJSRJS-UHFFFAOYSA-N trimethyl-[2-(2-methylprop-2-enoylamino)ethyl]azanium;bromide Chemical compound [Br-].CC(=C)C(=O)NCC[N+](C)(C)C YKGLFTQEQJSRJS-UHFFFAOYSA-N 0.000 claims 1
- GXJFCAAVAPZBDY-UHFFFAOYSA-N trimethyl-[2-(2-methylprop-2-enoylamino)ethyl]azanium;chloride Chemical compound [Cl-].CC(=C)C(=O)NCC[N+](C)(C)C GXJFCAAVAPZBDY-UHFFFAOYSA-N 0.000 claims 1
- RRHXZLALVWBDKH-UHFFFAOYSA-M trimethyl-[2-(2-methylprop-2-enoyloxy)ethyl]azanium;chloride Chemical compound [Cl-].CC(=C)C(=O)OCC[N+](C)(C)C RRHXZLALVWBDKH-UHFFFAOYSA-M 0.000 claims 1
- UOASMSQZBFHQGX-UHFFFAOYSA-O trimethyl-[2-(prop-2-enoylamino)ethyl]azanium Chemical compound C[N+](C)(C)CCNC(=O)C=C UOASMSQZBFHQGX-UHFFFAOYSA-O 0.000 claims 1
- NFUDTVOYLQNLPF-UHFFFAOYSA-M trimethyl-[3-(2-methylprop-2-enoyloxy)propyl]azanium;chloride Chemical compound [Cl-].CC(=C)C(=O)OCCC[N+](C)(C)C NFUDTVOYLQNLPF-UHFFFAOYSA-M 0.000 claims 1
- OEIXGLMQZVLOQX-UHFFFAOYSA-N trimethyl-[3-(prop-2-enoylamino)propyl]azanium;chloride Chemical compound [Cl-].C[N+](C)(C)CCCNC(=O)C=C OEIXGLMQZVLOQX-UHFFFAOYSA-N 0.000 claims 1
- 229920003169 water-soluble polymer Polymers 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US19449708P | 2008-09-26 | 2008-09-26 | |
| US61/194,497 | 2008-09-26 | ||
| PCT/US2009/005325 WO2010036358A1 (en) | 2008-09-26 | 2009-09-25 | Abrasive compositions for chemical mechanical polishing and methods for using same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2012503880A JP2012503880A (ja) | 2012-02-09 |
| JP2012503880A5 true JP2012503880A5 (enExample) | 2012-11-15 |
| JP5632378B2 JP5632378B2 (ja) | 2014-11-26 |
Family
ID=42057921
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011529022A Expired - Fee Related JP5632378B2 (ja) | 2008-09-26 | 2009-09-25 | 化学機械研磨用研磨剤組成物及びその使用法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US8366959B2 (enExample) |
| EP (1) | EP2329519B1 (enExample) |
| JP (1) | JP5632378B2 (enExample) |
| KR (1) | KR101678114B1 (enExample) |
| CN (1) | CN102165564B (enExample) |
| TW (1) | TW201038690A (enExample) |
| WO (1) | WO2010036358A1 (enExample) |
Families Citing this family (79)
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| TWI256971B (en) * | 2002-08-09 | 2006-06-21 | Hitachi Chemical Co Ltd | CMP abrasive and method for polishing substrate |
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| US7504044B2 (en) * | 2004-11-05 | 2009-03-17 | Cabot Microelectronics Corporation | Polishing composition and method for high silicon nitride to silicon oxide removal rate ratios |
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| US7297633B1 (en) * | 2006-06-05 | 2007-11-20 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Compositions for chemical mechanical polishing silica and silicon nitride having improved endpoint detection |
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| US20090056231A1 (en) * | 2007-08-28 | 2009-03-05 | Daniela White | Copper CMP composition containing ionic polyelectrolyte and method |
-
2009
- 2009-09-25 US US12/586,651 patent/US8366959B2/en not_active Expired - Fee Related
- 2009-09-25 KR KR1020117009492A patent/KR101678114B1/ko not_active Expired - Fee Related
- 2009-09-25 TW TW098132829A patent/TW201038690A/zh unknown
- 2009-09-25 EP EP09816586.3A patent/EP2329519B1/en not_active Not-in-force
- 2009-09-25 CN CN200980138129.6A patent/CN102165564B/zh not_active Expired - Fee Related
- 2009-09-25 WO PCT/US2009/005325 patent/WO2010036358A1/en not_active Ceased
- 2009-09-25 JP JP2011529022A patent/JP5632378B2/ja not_active Expired - Fee Related
-
2013
- 2013-01-03 US US13/733,580 patent/US8822340B2/en not_active Expired - Fee Related
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