JP2012503880A5 - - Google Patents

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JP2012503880A5
JP2012503880A5 JP2011529022A JP2011529022A JP2012503880A5 JP 2012503880 A5 JP2012503880 A5 JP 2012503880A5 JP 2011529022 A JP2011529022 A JP 2011529022A JP 2011529022 A JP2011529022 A JP 2011529022A JP 2012503880 A5 JP2012503880 A5 JP 2012503880A5
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dispersion
substrate
silicon nitride
chloride
vinylpyridinium
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JP2011529022A
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JP2012503880A (ja
JP5632378B2 (ja
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Priority claimed from PCT/US2009/005325 external-priority patent/WO2010036358A1/en
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JP2011529022A 2008-09-26 2009-09-25 化学機械研磨用研磨剤組成物及びその使用法 Expired - Fee Related JP5632378B2 (ja)

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Application Number Priority Date Filing Date Title
US19449708P 2008-09-26 2008-09-26
US61/194,497 2008-09-26
PCT/US2009/005325 WO2010036358A1 (en) 2008-09-26 2009-09-25 Abrasive compositions for chemical mechanical polishing and methods for using same

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JP2012503880A JP2012503880A (ja) 2012-02-09
JP2012503880A5 true JP2012503880A5 (enExample) 2012-11-15
JP5632378B2 JP5632378B2 (ja) 2014-11-26

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US (2) US8366959B2 (enExample)
EP (1) EP2329519B1 (enExample)
JP (1) JP5632378B2 (enExample)
KR (1) KR101678114B1 (enExample)
CN (1) CN102165564B (enExample)
TW (1) TW201038690A (enExample)
WO (1) WO2010036358A1 (enExample)

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