SG11201606830WA - Composition and method for polishing glass - Google Patents
Composition and method for polishing glassInfo
- Publication number
- SG11201606830WA SG11201606830WA SG11201606830WA SG11201606830WA SG11201606830WA SG 11201606830W A SG11201606830W A SG 11201606830WA SG 11201606830W A SG11201606830W A SG 11201606830WA SG 11201606830W A SG11201606830W A SG 11201606830WA SG 11201606830W A SG11201606830W A SG 11201606830WA
- Authority
- SG
- Singapore
- Prior art keywords
- composition
- polishing glass
- polishing
- glass
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
- B24B37/044—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor characterised by the composition of the lapping agent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2014/029518 WO2015137982A1 (en) | 2014-03-14 | 2014-03-14 | Composition and method for polishing glass |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201606830WA true SG11201606830WA (en) | 2016-09-29 |
Family
ID=54072240
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201606830WA SG11201606830WA (en) | 2014-03-14 | 2014-03-14 | Composition and method for polishing glass |
Country Status (2)
Country | Link |
---|---|
SG (1) | SG11201606830WA (en) |
WO (1) | WO2015137982A1 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6821897B2 (en) * | 2001-12-05 | 2004-11-23 | Cabot Microelectronics Corporation | Method for copper CMP using polymeric complexing agents |
US6776810B1 (en) * | 2002-02-11 | 2004-08-17 | Cabot Microelectronics Corporation | Anionic abrasive particles treated with positively charged polyelectrolytes for CMP |
KR100832993B1 (en) * | 2006-04-14 | 2008-05-27 | 주식회사 엘지화학 | Adjuvant for chemical mechanical polishing slurry |
CN102165564B (en) * | 2008-09-26 | 2014-10-01 | 罗地亚管理公司 | Abrasive compositions for chemical mechanical polishing and methods for using same |
US20120190200A1 (en) * | 2011-01-24 | 2012-07-26 | Clarkson University | Abrasive Free Silicon Chemical Mechanical Planarization |
-
2014
- 2014-03-14 WO PCT/US2014/029518 patent/WO2015137982A1/en active Application Filing
- 2014-03-14 SG SG11201606830WA patent/SG11201606830WA/en unknown
Also Published As
Publication number | Publication date |
---|---|
WO2015137982A1 (en) | 2015-09-17 |
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