JP2011103498A5 - - Google Patents

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Publication number
JP2011103498A5
JP2011103498A5 JP2011031168A JP2011031168A JP2011103498A5 JP 2011103498 A5 JP2011103498 A5 JP 2011103498A5 JP 2011031168 A JP2011031168 A JP 2011031168A JP 2011031168 A JP2011031168 A JP 2011031168A JP 2011103498 A5 JP2011103498 A5 JP 2011103498A5
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JP
Japan
Prior art keywords
water
polishing
cmp
cerium oxide
azobis
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JP2011031168A
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English (en)
Japanese (ja)
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JP2011103498A (ja
JP5509114B2 (ja
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Priority to JP2011031168A priority Critical patent/JP5509114B2/ja
Priority claimed from JP2011031168A external-priority patent/JP5509114B2/ja
Publication of JP2011103498A publication Critical patent/JP2011103498A/ja
Publication of JP2011103498A5 publication Critical patent/JP2011103498A5/ja
Application granted granted Critical
Publication of JP5509114B2 publication Critical patent/JP5509114B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2011031168A 2004-07-23 2011-02-16 Ｃｍｐ研磨剤及び基板の研磨方法 Expired - Lifetime JP5509114B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2011031168A JP5509114B2 (ja) 2004-07-23 2011-02-16 Ｃｍｐ研磨剤及び基板の研磨方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004216039 2004-07-23
JP2004216039 2004-07-23
JP2011031168A JP5509114B2 (ja) 2004-07-23 2011-02-16 Ｃｍｐ研磨剤及び基板の研磨方法

Related Parent Applications (1)

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JP2006529234A Division JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Ｃｍｐ研磨剤及び基板の研磨方法

Related Child Applications (1)

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JP2013042019A Division JP5655879B2 (ja) 2004-07-23 2013-03-04 Ｃｍｐ研磨剤及び基板の研磨方法

Publications (3)

Publication Number Publication Date
JP2011103498A JP2011103498A (ja) 2011-05-26
JP2011103498A5 true JP2011103498A5 (enExample) 2012-06-21
JP5509114B2 JP5509114B2 (ja) 2014-06-04

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ID=35785268

Family Applications (3)

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JP2006529234A Pending JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Ｃｍｐ研磨剤及び基板の研磨方法
JP2011031168A Expired - Lifetime JP5509114B2 (ja) 2004-07-23 2011-02-16 Ｃｍｐ研磨剤及び基板の研磨方法
JP2013042019A Expired - Lifetime JP5655879B2 (ja) 2004-07-23 2013-03-04 Ｃｍｐ研磨剤及び基板の研磨方法

Family Applications Before (1)

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JP2006529234A Pending JPWO2006009160A1 (ja) 2004-07-23 2005-07-20 Ｃｍｐ研磨剤及び基板の研磨方法

Family Applications After (1)

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JP2013042019A Expired - Lifetime JP5655879B2 (ja) 2004-07-23 2013-03-04 Ｃｍｐ研磨剤及び基板の研磨方法

Country Status (7)

Country Link
US (1) US9293344B2 (enExample)
EP (1) EP1796152B1 (enExample)
JP (3) JPWO2006009160A1 (enExample)
KR (1) KR100856171B1 (enExample)
CN (3) CN1985361A (enExample)
TW (1) TWI287040B (enExample)
WO (1) WO2006009160A1 (enExample)

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CN101375376B (zh) 2006-01-31 2012-09-19 日立化成工业株式会社 绝缘膜研磨用cmp研磨剂、研磨方法、通过该研磨方法研磨的半导体电子部件
MD3809C2 (ro) * 2008-06-26 2009-08-31 Акционерное Общество "Azurit" Procedeu de prelucrare de finisare a plăcilor pentru acoperire din calcar hemogen
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US8703004B2 (en) * 2011-11-14 2014-04-22 Kabushiki Kaisha Toshiba Method for chemical planarization and chemical planarization apparatus
US9299573B2 (en) 2012-03-14 2016-03-29 Hitachi Chemical Company, Ltd. Polishing method
EP2826827B1 (en) * 2013-07-18 2019-06-12 Basf Se CMP composition comprising abrasive particles containing ceria
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JP5920840B2 (ja) * 2013-09-30 2016-05-18 株式会社フジミインコーポレーテッド 研磨用組成物およびその製造方法
CN104356950B (zh) * 2014-10-21 2017-01-18 李金平 一种蓝宝石晶片抛光液
JP6206388B2 (ja) * 2014-12-15 2017-10-04 信越半導体株式会社 シリコンウェーハの研磨方法
CN104987839A (zh) * 2015-06-30 2015-10-21 安徽德诺化工有限公司 Led用蓝宝石衬底研磨液
CN110998800B (zh) * 2017-08-14 2023-09-22 株式会社力森诺科 研磨液、研磨液套剂及研磨方法
WO2019064524A1 (ja) 2017-09-29 2019-04-04 日立化成株式会社 研磨液、研磨液セット及び研磨方法
JP6837958B2 (ja) 2017-12-28 2021-03-03 花王株式会社 酸化珪素膜用研磨液組成物
US11718767B2 (en) 2018-08-09 2023-08-08 Versum Materials Us, Llc Chemical mechanical planarization composition for polishing oxide materials and method of use thereof
JP7216880B2 (ja) 2019-02-19 2023-02-02 株式会社レゾナック 研磨液及び研磨方法
CN111014695A (zh) * 2019-11-21 2020-04-17 苏州新锐合金工具股份有限公司 硬质合金混合料的制备方法

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