JP2012089724A - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- JP2012089724A JP2012089724A JP2010236213A JP2010236213A JP2012089724A JP 2012089724 A JP2012089724 A JP 2012089724A JP 2010236213 A JP2010236213 A JP 2010236213A JP 2010236213 A JP2010236213 A JP 2010236213A JP 2012089724 A JP2012089724 A JP 2012089724A
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- solder
- semiconductor device
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- chip connection
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 163
- 238000004519 manufacturing process Methods 0.000 title claims description 49
- 229910000679 solder Inorganic materials 0.000 claims abstract description 316
- 239000000758 substrate Substances 0.000 claims abstract description 77
- 230000004907 flux Effects 0.000 claims abstract description 60
- 238000004140 cleaning Methods 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims description 47
- 238000003825 pressing Methods 0.000 claims 19
- 238000001125 extrusion Methods 0.000 abstract 1
- 239000011805 ball Substances 0.000 description 36
- 230000004048 modification Effects 0.000 description 35
- 238000012986 modification Methods 0.000 description 35
- 238000007747 plating Methods 0.000 description 19
- 239000010953 base metal Substances 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000002844 melting Methods 0.000 description 13
- 230000008018 melting Effects 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 239000002184 metal Substances 0.000 description 12
- 229910052751 metal Inorganic materials 0.000 description 12
- 238000010586 diagram Methods 0.000 description 11
- 238000005476 soldering Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 238000005530 etching Methods 0.000 description 10
- 238000002360 preparation method Methods 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 7
- 239000010949 copper Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 238000007373 indentation Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 4
- 238000005201 scrubbing Methods 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011806 microball Substances 0.000 description 2
- 230000001151 other effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 235000011837 pasties Nutrition 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 230000033764 rhythmic process Effects 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
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- H—ELECTRICITY
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Abstract
【解決手段】フリップチップ接続する前に基板上のフリップチップ接続用のはんだバンプ5aにフラックス9を塗布し、さらにリフロー/洗浄してからフリップチップ接続を行うことで、はんだバンプ5aの表面の酸化膜を薄くするとともに、前記酸化膜の均一化を図ることができ、これにより、フリップチップ接続時に局所的なはんだはみ出しの発生を抑制してはんだブリッジの発生を低減し、半導体装置のフリップチップ接続における接続信頼性の向上を図る。
【選択図】図2
Description
図1は本発明の実施の形態1の半導体装置の構造の一例を示す断面図とフリップチップ接続部の拡大部分断面図、図2は図1に示す半導体装置の組み立てにおける基板側の製造の一例を示す製造フロー図、図3は図1に示す半導体装置の組み立てにおけるフリップチップ接続の一例を示す製造フロー図、図4は図1に示す半導体装置の組み立てにおけるアンダーフィル塗布及びボールマウントの一例を示す製造フロー図である。
図17は本発明の実施の形態2の比較例の半導体装置におけるフリップチップ接続部の構造を示す拡大部分断面図、図18は図17に示す構造の配線基板の端子に対するソルダレジスト膜の開口部の位置を示す平面図、図19は図17に示すA線で切断した構造を上方から眺めたはんだブリッジ構造を示す平面図である。また、図20は本発明の実施の形態2の半導体装置における配線基板の端子に対するソルダレジスト膜の開口部の位置を示す平面図、図21は図20に示すソルダレジスト膜の開口部にはんだバンプを搭載した際のはんだはみ出し方向を示す平面図、図22は本発明の実施の形態2の第1変形例の半導体装置における配線基板の端子に対するソルダレジスト膜の開口部の位置を示す平面図である。さらに、図23は図22に示すソルダレジスト膜の開口部に搭載されたはんだバンプの構造を示す平面図、図24は図22に示すソルダレジスト膜の開口部にはんだバンプを搭載した際のはんだはみ出し方向を示す平面図、図25は本発明の実施の形態2の第2変形例の半導体装置における配線基板のソルダレジスト膜の開口部にはんだバンプを搭載した際のはんだはみ出し方向を示す平面図、図26は本発明の実施の形態2の第3変形例の半導体装置における配線基板のソルダレジスト膜の開口部にはんだバンプを搭載した際のはんだはみ出し方向を示す平面図である。
2 配線基板
2a 上面
2b 下面
2c フリップチップ接続用電極
2d 開口部パターン(バンプ搭載部パターン)
2e ソルダレジスト膜
2f 外形パターン
2g 最短部分
2h 凹部
3 アンダーフィル
4 半導体チップ
4a 主面
4b 裏面
4c 電極パッド
4d 保護膜
5,5a,5b はんだバンプ(バンプ、バンプ電極、はんだボール)
5c はんだはみ出し
5d はんだはみ出し方向
6 チップ部品(電子部品)
7 はんだボール(外部端子)
8 はんだ
9 フラックス
10 はんだペースト
11 多数個取り基板
11a ソルダレジスト膜
11b ランド端子
12 ウエハ
12a 保護膜
12b バンプ下地金属膜
12c エッチングレジスト膜
12d めっきレジスト膜
12e はんだめっき膜
13 スキージ
14 印刷マスク
15 プローブ
16 ボール搭載マスク
17 小型はんだボール
18 ボンディングヘッド
18a 排気系
19 ボンディングステージ
19a 排気系
Claims (16)
- 上面と、前記上面と反対側の下面とを有し、前記上面に複数のフリップチップ接続用電極が形成された配線基板と、
前記配線基板の前記上面にフリップチップ接続によって搭載された半導体チップと、
前記配線基板の前記下面に設けられた複数の外部端子と、
を有し、
前記フリップチップ接続の隣り合ったバンプ間において、前記フリップチップ接続用電極の平面視の外形パターンと前記フリップチップ接続用電極の平面視のバンプ搭載部パターンとの距離が最も短くなる最短部分が、前記バンプ間でお互いに向かい合わない位置に配置されていることを特徴とする半導体装置。 - 請求項1記載の半導体装置において、前記最短部分が、前記バンプ間でお互いのはんだはみ出し方向が同一の方向となるような位置に配置されていることを特徴とする半導体装置。
- 請求項1記載の半導体装置において、前記最短部分が、前記バンプ間でお互いのはんだはみ出し方向が異なった方向となるような位置に配置されていることを特徴とする半導体装置。
- (a)上面と、前記上面と反対側の下面とを有し、前記上面に複数のフリップチップ接続用電極が形成された配線基板を準備する工程と、
(b)複数のバンプ電極それぞれが電極パッド上に形成された半導体チップを準備する工程と、
(c)前記配線基板の前記フリップチップ接続用電極それぞれにはんだボールを形成する工程と、
(d)前記(c)工程の後、複数の前記はんだボールにフラックスを塗布し、その後、複数の前記はんだボールのリフロー/洗浄を行う工程と、
(e)前記半導体チップの前記複数のバンプ電極と前記配線基板の複数の前記はんだボールとをフリップチップ接続する工程と、
を有することを特徴とする半導体装置の製造方法。 - 請求項4記載の半導体装置の製造方法において、前記(c)工程では、前記フリップチップ接続用電極にはんだペーストを塗布した後、リフロー/洗浄を行って前記はんだボールを形成することを特徴とする半導体装置の製造方法。
- 請求項4記載の半導体装置の製造方法において、前記(e)工程で前記フリップチップ接続を行う際に、少なくともチップ側の前記バンプ電極か、もしくは基板側の前記はんだボールの何れかを溶融した状態で接続することを特徴とする半導体装置の製造方法。
- 請求項4記載の半導体装置の製造方法において、前記配線基板の前記上面の前記半導体チップの周囲に電子部品がはんだ実装されていることを特徴とする半導体装置の製造方法。
- 請求項4記載の半導体装置の製造方法において、前記(e)工程で前記フリップチップ接続を行う際に、前記半導体チップを第1押し込みと、前記第1押し込み後の第2押し込みとの2段階の押し込みによって前記配線基板に対して押し込んで前記フリップチップ接続を行うことを特徴とする半導体装置の製造方法。
- 請求項8記載の半導体装置の製造方法において、前記第1押し込みの押し込み量は、前記第2押し込みの押し込み量より小さいことを特徴とする半導体装置の製造方法。
- (a)上面と、前記上面と反対側の下面とを有し、前記上面に複数のフリップチップ接続用電極が形成された配線基板を準備する工程と、
(b)複数のバンプ電極それぞれが電極パッド上に形成された半導体チップを準備する工程と、
(c)前記配線基板の前記フリップチップ接続用電極それぞれにフラックスペーストを塗布する工程と、
(d)前記フリップチップ接続用電極それぞれの上の前記フラックスペーストにはんだボールを配置する工程と、
(e)前記(d)工程の後、複数の前記はんだボールのリフロー/洗浄を行う工程と、
(f)前記半導体チップの前記複数のバンプ電極と前記配線基板の複数の前記はんだボールとをフリップチップ接続する工程と、
を有することを特徴とする半導体装置の製造方法。 - 請求項10記載の半導体装置の製造方法において、前記(f)工程で前記フリップチップ接続を行う際に、少なくともチップ側の前記バンプ電極か、もしくは基板側の前記はんだボールの何れかを溶融した状態で接続することを特徴とする半導体装置の製造方法。
- 請求項10記載の半導体装置の製造方法において、前記配線基板の前記上面の前記半導体チップの周囲に電子部品がはんだ実装されていることを特徴とする半導体装置の製造方法。
- 請求項10記載の半導体装置の製造方法において、前記(f)工程で前記フリップチップ接続を行う際に、前記半導体チップを第1押し込みと、前記第1押し込み後の第2押し込みとの2段階の押し込みによって前記配線基板に対して押し込んで前記フリップチップ接続を行うことを特徴とする半導体装置の製造方法。
- 請求項13記載の半導体装置の製造方法において、前記第1押し込みの押し込み量は、前記第2押し込みの押し込み量より小さいことを特徴とする半導体装置の製造方法。
- (a)上面と、前記上面と反対側の下面とを有し、前記上面の複数のフリップチップ接続用電極にはんだボールが形成された配線基板を準備する工程と、
(b)複数のバンプ電極それぞれが電極パッド上に形成された半導体チップを準備する工程と、
(c)前記半導体チップの前記複数のバンプ電極と前記配線基板の複数の前記はんだボールとをフリップチップ接続する工程と、
を有し、
前記(c)工程での前記フリップチップ接続時に、前記半導体チップを第1押し込みと、前記第1押し込み後の第2押し込みとの2段階の押し込みによって前記配線基板に対して押し込んで前記フリップチップ接続を行うことを特徴とする半導体装置の製造方法。 - 請求項15記載の半導体装置の製造方法において、前記第1押し込みの押し込み量は、前記第2押し込みの押し込み量より小さいことを特徴とする半導体装置の製造方法。
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KR20160126908A (ko) * | 2015-04-24 | 2016-11-02 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 열압착 본더, 열압착 본더 작동 방법 및 열압착 본딩에서 수평 스크럽 운동 |
KR102535475B1 (ko) * | 2015-04-24 | 2023-05-24 | 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 | 열압착 본더, 열압착 본더 작동 방법 및 열압착 본딩에서 수평 스크럽 운동 |
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US20170092614A1 (en) | 2017-03-30 |
US10037966B2 (en) | 2018-07-31 |
JP5645592B2 (ja) | 2014-12-24 |
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