JP2011527637A5 - - Google Patents

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JP2011527637A5
JP2011527637A5 JP2011517574A JP2011517574A JP2011527637A5 JP 2011527637 A5 JP2011527637 A5 JP 2011527637A5 JP 2011517574 A JP2011517574 A JP 2011517574A JP 2011517574 A JP2011517574 A JP 2011517574A JP 2011527637 A5 JP2011527637 A5 JP 2011527637A5
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sample
laser beam
determining
emission
laser
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JP2011517574A
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Priority claimed from PCT/US2009/049961 external-priority patent/WO2010006067A2/en
Publication of JP2011527637A publication Critical patent/JP2011527637A/ja
Publication of JP2011527637A5 publication Critical patent/JP2011527637A5/ja
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JP2011517574A 2008-07-09 2009-07-08 レーザ機械加工のための方法および装置 Pending JP2011527637A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US7930408P 2008-07-09 2008-07-09
US61/079,304 2008-07-09
PCT/US2009/049961 WO2010006067A2 (en) 2008-07-09 2009-07-08 Method and apparatus for laser machining

Related Child Applications (1)

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JP2014094307A Division JP6109115B2 (ja) 2008-07-09 2014-04-30 レーザ機械加工のための方法および装置

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JP2011527637A JP2011527637A (ja) 2011-11-04
JP2011527637A5 true JP2011527637A5 (enExample) 2012-08-16

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JP2011517574A Pending JP2011527637A (ja) 2008-07-09 2009-07-08 レーザ機械加工のための方法および装置
JP2011517626A Active JP5744727B2 (ja) 2008-07-09 2009-07-09 レーザ機械加工のための方法および装置
JP2014094307A Active JP6109115B2 (ja) 2008-07-09 2014-04-30 レーザ機械加工のための方法および装置

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JP2011517626A Active JP5744727B2 (ja) 2008-07-09 2009-07-09 レーザ機械加工のための方法および装置
JP2014094307A Active JP6109115B2 (ja) 2008-07-09 2014-04-30 レーザ機械加工のための方法および装置

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US (2) US10493559B2 (enExample)
EP (2) EP2313230A4 (enExample)
JP (3) JP2011527637A (enExample)
CN (2) CN102149509B (enExample)
WO (2) WO2010006067A2 (enExample)

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