JP2011527637A - レーザ機械加工のための方法および装置 - Google Patents
レーザ機械加工のための方法および装置 Download PDFInfo
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- JP2011527637A JP2011527637A JP2011517574A JP2011517574A JP2011527637A JP 2011527637 A JP2011527637 A JP 2011527637A JP 2011517574 A JP2011517574 A JP 2011517574A JP 2011517574 A JP2011517574 A JP 2011517574A JP 2011527637 A JP2011527637 A JP 2011527637A
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- sample
- emission
- determining
- laser beam
- laser
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Links
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- 238000003754 machining Methods 0.000 title abstract description 5
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- 239000000758 substrate Substances 0.000 abstract description 24
- 230000008859 change Effects 0.000 abstract description 11
- 239000000523 sample Substances 0.000 description 74
- 238000005459 micromachining Methods 0.000 description 16
- 230000008569 process Effects 0.000 description 13
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- 238000000576 coating method Methods 0.000 description 10
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- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1423—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the flow carrying an electric current
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
- B23K26/348—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding in combination with arc heating, e.g. TIG [tungsten inert gas], MIG [metal inert gas] or plasma welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/26—Electron or ion microscopes
- H01J2237/28—Scanning microscopes
- H01J2237/2813—Scanning microscopes characterised by the application
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Electron Tubes For Measurement (AREA)
- Other Investigation Or Analysis Of Materials By Electrical Means (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7930408P | 2008-07-09 | 2008-07-09 | |
| US61/079,304 | 2008-07-09 | ||
| PCT/US2009/049961 WO2010006067A2 (en) | 2008-07-09 | 2009-07-08 | Method and apparatus for laser machining |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014094307A Division JP6109115B2 (ja) | 2008-07-09 | 2014-04-30 | レーザ機械加工のための方法および装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011527637A true JP2011527637A (ja) | 2011-11-04 |
| JP2011527637A5 JP2011527637A5 (enExample) | 2012-08-16 |
Family
ID=41507711
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011517574A Pending JP2011527637A (ja) | 2008-07-09 | 2009-07-08 | レーザ機械加工のための方法および装置 |
| JP2011517626A Active JP5744727B2 (ja) | 2008-07-09 | 2009-07-09 | レーザ機械加工のための方法および装置 |
| JP2014094307A Active JP6109115B2 (ja) | 2008-07-09 | 2014-04-30 | レーザ機械加工のための方法および装置 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011517626A Active JP5744727B2 (ja) | 2008-07-09 | 2009-07-09 | レーザ機械加工のための方法および装置 |
| JP2014094307A Active JP6109115B2 (ja) | 2008-07-09 | 2014-04-30 | レーザ機械加工のための方法および装置 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US10493559B2 (enExample) |
| EP (2) | EP2313230A4 (enExample) |
| JP (3) | JP2011527637A (enExample) |
| CN (2) | CN102149509B (enExample) |
| WO (2) | WO2010006067A2 (enExample) |
Families Citing this family (54)
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| EP1501115B1 (en) | 2003-07-14 | 2009-07-01 | FEI Company | Dual beam system |
| JP2011527637A (ja) | 2008-07-09 | 2011-11-04 | エフ・イ−・アイ・カンパニー | レーザ機械加工のための方法および装置 |
| US8168961B2 (en) | 2008-11-26 | 2012-05-01 | Fei Company | Charged particle beam masking for laser ablation micromachining |
| US8778804B2 (en) * | 2009-01-30 | 2014-07-15 | Fei Company | High selectivity, low damage electron-beam delineation etch |
| EP2226830B1 (en) | 2009-03-06 | 2014-01-08 | FEI Company | Charged particle beam processing |
| JP5702552B2 (ja) | 2009-05-28 | 2015-04-15 | エフ イー アイ カンパニFei Company | デュアルビームシステムの制御方法 |
| US8524139B2 (en) | 2009-08-10 | 2013-09-03 | FEI Compay | Gas-assisted laser ablation |
| DE102009041993B4 (de) * | 2009-09-18 | 2020-02-13 | Carl Zeiss Microscopy Gmbh | Beobachtungs- und Analysegerät |
| US20140200511A1 (en) * | 2009-10-30 | 2014-07-17 | Searete Llc | Systems, devices, and methods for making or administering frozen particles |
| WO2011060444A2 (en) | 2009-11-16 | 2011-05-19 | Fei Company | Gas delivery for beam processing systems |
| DE102010008296A1 (de) | 2010-02-17 | 2011-08-18 | Carl Zeiss NTS GmbH, 73447 | Laserbearbeitungssystem, Objekthalter und Laserbearbeitungsverfahren |
| US9492887B2 (en) | 2010-04-01 | 2016-11-15 | Electro Scientific Industries, Inc. | Touch screen interface for laser processing |
| KR101854287B1 (ko) * | 2010-04-07 | 2018-05-03 | 에프이아이 컴파니 | 레이저 및 하전 입자 빔 시스템 결합 |
| EP2402475A1 (en) | 2010-06-30 | 2012-01-04 | Fei Company | Beam-induced deposition at cryogenic temperatures |
| US10112257B1 (en) * | 2010-07-09 | 2018-10-30 | General Lasertronics Corporation | Coating ablating apparatus with coating removal detection |
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| CN102430904A (zh) * | 2011-10-19 | 2012-05-02 | 哈尔滨工业大学 | 激光加热辅助铣削加工方法与装置 |
| WO2013059779A1 (en) * | 2011-10-21 | 2013-04-25 | American Laser Enterprises, Llc | System configured for removing a coating from a substrate using electromagnetic radiation |
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Also Published As
| Publication number | Publication date |
|---|---|
| EP2313231A4 (en) | 2017-04-05 |
| US20120103945A1 (en) | 2012-05-03 |
| CN102149510B (zh) | 2015-03-11 |
| EP2313230A4 (en) | 2017-03-08 |
| US20110115129A1 (en) | 2011-05-19 |
| US8853592B2 (en) | 2014-10-07 |
| JP2014166651A (ja) | 2014-09-11 |
| EP2313230A2 (en) | 2011-04-27 |
| JP6109115B2 (ja) | 2017-04-05 |
| JP2011527639A (ja) | 2011-11-04 |
| EP2313231A2 (en) | 2011-04-27 |
| WO2010006067A2 (en) | 2010-01-14 |
| CN102149509B (zh) | 2014-08-20 |
| JP5744727B2 (ja) | 2015-07-08 |
| US10493559B2 (en) | 2019-12-03 |
| WO2010006188A2 (en) | 2010-01-14 |
| WO2010006067A3 (en) | 2010-05-14 |
| CN102149509A (zh) | 2011-08-10 |
| CN102149510A (zh) | 2011-08-10 |
| WO2010006188A3 (en) | 2010-04-22 |
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