JP2011517329A5 - - Google Patents

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JP2011517329A5
JP2011517329A5 JP2010513240A JP2010513240A JP2011517329A5 JP 2011517329 A5 JP2011517329 A5 JP 2011517329A5 JP 2010513240 A JP2010513240 A JP 2010513240A JP 2010513240 A JP2010513240 A JP 2010513240A JP 2011517329 A5 JP2011517329 A5 JP 2011517329A5
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Japan
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sputtering
plate
backing plate
target
annular groove
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JP2010513240A
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JP5551068B2 (ja
JP2011517329A (ja
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Priority claimed from US11/764,772 external-priority patent/US8968536B2/en
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JP2010513240A 2007-06-18 2008-06-18 寿命を延ばしスパッタリング均一性を高めたスパッタリングターゲット Active JP5551068B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US11/764,772 US8968536B2 (en) 2007-06-18 2007-06-18 Sputtering target having increased life and sputtering uniformity
US11/764,722 2007-06-18
PCT/US2008/007611 WO2008156794A2 (en) 2007-06-18 2008-06-18 Sputtering target having increased life and sputtering uniformity

Publications (3)

Publication Number Publication Date
JP2011517329A JP2011517329A (ja) 2011-06-02
JP2011517329A5 true JP2011517329A5 (https=) 2011-08-04
JP5551068B2 JP5551068B2 (ja) 2014-07-16

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JP2010513240A Active JP5551068B2 (ja) 2007-06-18 2008-06-18 寿命を延ばしスパッタリング均一性を高めたスパッタリングターゲット

Country Status (7)

Country Link
US (1) US8968536B2 (https=)
EP (1) EP2176441A2 (https=)
JP (1) JP5551068B2 (https=)
KR (3) KR102161196B1 (https=)
CN (2) CN101680082B (https=)
TW (1) TWI512125B (https=)
WO (1) WO2008156794A2 (https=)

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