JP2011514674A5 - - Google Patents
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- Publication number
- JP2011514674A5 JP2011514674A5 JP2010548670A JP2010548670A JP2011514674A5 JP 2011514674 A5 JP2011514674 A5 JP 2011514674A5 JP 2010548670 A JP2010548670 A JP 2010548670A JP 2010548670 A JP2010548670 A JP 2010548670A JP 2011514674 A5 JP2011514674 A5 JP 2011514674A5
- Authority
- JP
- Japan
- Prior art keywords
- doped portion
- silicon carbide
- guard ring
- floating guard
- termination structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims 24
- 229910010271 silicon carbide Inorganic materials 0.000 claims 24
- 239000004065 semiconductor Substances 0.000 claims 18
- 238000000034 method Methods 0.000 claims 15
- 239000002019 doping agent Substances 0.000 claims 8
- 230000007423 decrease Effects 0.000 claims 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052796 boron Inorganic materials 0.000 claims 1
- 230000015556 catabolic process Effects 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/037,211 US9640609B2 (en) | 2008-02-26 | 2008-02-26 | Double guard ring edge termination for silicon carbide devices |
| US12/037,211 | 2008-02-26 | ||
| PCT/US2009/000734 WO2009108268A1 (en) | 2008-02-26 | 2009-02-05 | Double guard ring edge termination for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011514674A JP2011514674A (ja) | 2011-05-06 |
| JP2011514674A5 true JP2011514674A5 (enExample) | 2012-04-12 |
| JP5324603B2 JP5324603B2 (ja) | 2013-10-23 |
Family
ID=40524779
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010548670A Active JP5324603B2 (ja) | 2008-02-26 | 2009-02-05 | 炭化ケイ素デバイス用の2重ガード・リング端部終端、及びそれを組み込む炭化ケイ素デバイスを製造する方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US9640609B2 (enExample) |
| EP (1) | EP2248176B1 (enExample) |
| JP (1) | JP5324603B2 (enExample) |
| KR (1) | KR101595587B1 (enExample) |
| CN (1) | CN101981700B (enExample) |
| WO (1) | WO2009108268A1 (enExample) |
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| US8835987B2 (en) | 2007-02-27 | 2014-09-16 | Cree, Inc. | Insulated gate bipolar transistors including current suppressing layers |
| US9640609B2 (en) | 2008-02-26 | 2017-05-02 | Cree, Inc. | Double guard ring edge termination for silicon carbide devices |
| US8232558B2 (en) | 2008-05-21 | 2012-07-31 | Cree, Inc. | Junction barrier Schottky diodes with current surge capability |
| US8097919B2 (en) | 2008-08-11 | 2012-01-17 | Cree, Inc. | Mesa termination structures for power semiconductor devices including mesa step buffers |
| US8637386B2 (en) * | 2009-05-12 | 2014-01-28 | Cree, Inc. | Diffused junction termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same |
| US8193848B2 (en) | 2009-06-02 | 2012-06-05 | Cree, Inc. | Power switching devices having controllable surge current capabilities |
| US8629509B2 (en) | 2009-06-02 | 2014-01-14 | Cree, Inc. | High voltage insulated gate bipolar transistors with minority carrier diverter |
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| US8707760B2 (en) | 2009-07-31 | 2014-04-29 | Tricorntech Corporation | Gas collection and analysis system with front-end and back-end pre-concentrators and moisture removal |
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| JP5558393B2 (ja) * | 2011-03-10 | 2014-07-23 | 株式会社東芝 | 半導体装置 |
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| US9373617B2 (en) | 2011-09-11 | 2016-06-21 | Cree, Inc. | High current, low switching loss SiC power module |
| US8680587B2 (en) | 2011-09-11 | 2014-03-25 | Cree, Inc. | Schottky diode |
| US9640617B2 (en) | 2011-09-11 | 2017-05-02 | Cree, Inc. | High performance power module |
| US8618582B2 (en) | 2011-09-11 | 2013-12-31 | Cree, Inc. | Edge termination structure employing recesses for edge termination elements |
| US8664665B2 (en) | 2011-09-11 | 2014-03-04 | Cree, Inc. | Schottky diode employing recesses for elements of junction barrier array |
| JP6132478B2 (ja) * | 2012-05-09 | 2017-05-24 | 三菱電機株式会社 | 半導体装置 |
| US8901639B2 (en) | 2012-07-26 | 2014-12-02 | Cree, Inc. | Monolithic bidirectional silicon carbide switching devices |
| WO2014045480A1 (ja) * | 2012-09-21 | 2014-03-27 | 三菱電機株式会社 | 半導体装置及び半導体装置の製造方法 |
| JP6029411B2 (ja) | 2012-10-02 | 2016-11-24 | 三菱電機株式会社 | 半導体装置 |
| JP6090988B2 (ja) | 2013-03-05 | 2017-03-08 | 株式会社 日立パワーデバイス | 半導体装置 |
| JP6079456B2 (ja) * | 2013-06-07 | 2017-02-15 | 三菱電機株式会社 | 半導体装置の検査方法 |
| US9064738B2 (en) * | 2013-07-19 | 2015-06-23 | Cree, Inc. | Methods of forming junction termination extension edge terminations for high power semiconductor devices and related semiconductor devices |
| JP6183234B2 (ja) * | 2014-01-30 | 2017-08-23 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6265274B2 (ja) * | 2014-09-17 | 2018-01-24 | 富士電機株式会社 | 半導体装置 |
| EP3012870A1 (en) * | 2014-10-20 | 2016-04-27 | ABB Technology AG | Edge termination for high voltage semiconductor devices |
| JP2015079987A (ja) * | 2014-12-17 | 2015-04-23 | 株式会社日立製作所 | 半導体装置 |
| WO2016198388A1 (en) | 2015-06-09 | 2016-12-15 | Abb Schweiz Ag | Method for manufacturing an edge termination for a silicon carbide power semiconductor device |
| CN108369963B (zh) * | 2015-12-15 | 2022-01-25 | 通用电气公司 | 碳化硅超结功率器件的边缘终端设计 |
| JP6649198B2 (ja) * | 2016-07-14 | 2020-02-19 | トヨタ自動車株式会社 | 半導体装置とその製造方法 |
| JP6673174B2 (ja) | 2016-12-12 | 2020-03-25 | 株式会社デンソー | 炭化珪素半導体装置およびその製造方法 |
| US10312710B1 (en) | 2017-01-31 | 2019-06-04 | The United States Of America, As Represented By The Secretary Of The Navy | Energy recovery pulse forming network |
| JP6233537B2 (ja) * | 2017-02-27 | 2017-11-22 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JP6336165B2 (ja) * | 2017-03-14 | 2018-06-06 | 三菱電機株式会社 | 半導体装置 |
| DE102017127848B4 (de) * | 2017-11-24 | 2024-10-17 | Infineon Technologies Ag | Siliziumcarbid-Halbleiterbauelement mit Randabschlussstruktur |
| US10418402B2 (en) * | 2017-11-30 | 2019-09-17 | Stmicroelectronics (Research & Development) Limited | Near ultraviolet photocell |
| JP7132719B2 (ja) * | 2018-01-19 | 2022-09-07 | ローム株式会社 | 半導体装置 |
| CN109087940A (zh) * | 2018-09-11 | 2018-12-25 | 无锡新洁能股份有限公司 | 一种SiC功率器件终端及其制作方法 |
| US20220157951A1 (en) | 2020-11-17 | 2022-05-19 | Hamza Yilmaz | High voltage edge termination structure for power semicondcutor devices and manufacturing method thereof |
| KR102372131B1 (ko) * | 2020-11-27 | 2022-03-08 | 재단법인 부산테크노파크 | 고내압 실리콘 카바이드 쇼트키 베리어 다이오드 및 제조방법 |
| EP4517827A1 (en) * | 2023-08-28 | 2025-03-05 | Nexperia B.V. | A semiconductor device having an improved termination area, as well as a corresponding method and power device |
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| US9640609B2 (en) | 2008-02-26 | 2017-05-02 | Cree, Inc. | Double guard ring edge termination for silicon carbide devices |
| US8097919B2 (en) * | 2008-08-11 | 2012-01-17 | Cree, Inc. | Mesa termination structures for power semiconductor devices including mesa step buffers |
| US8637386B2 (en) * | 2009-05-12 | 2014-01-28 | Cree, Inc. | Diffused junction termination structures for silicon carbide devices and methods of fabricating silicon carbide devices incorporating same |
-
2008
- 2008-02-26 US US12/037,211 patent/US9640609B2/en active Active
-
2009
- 2009-02-05 KR KR1020107021354A patent/KR101595587B1/ko active Active
- 2009-02-05 CN CN200980111322.0A patent/CN101981700B/zh active Active
- 2009-02-05 EP EP09713922.4A patent/EP2248176B1/en active Active
- 2009-02-05 JP JP2010548670A patent/JP5324603B2/ja active Active
- 2009-02-05 WO PCT/US2009/000734 patent/WO2009108268A1/en not_active Ceased
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