JP6079456B2 - 半導体装置の検査方法 - Google Patents
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- 239000004065 semiconductor Substances 0.000 title claims description 55
- 238000007689 inspection Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 37
- 239000002344 surface layer Substances 0.000 claims description 62
- 239000004020 conductor Substances 0.000 claims description 45
- 239000000758 substrate Substances 0.000 claims description 20
- 239000003566 sealing material Substances 0.000 claims description 19
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 230000015556 catabolic process Effects 0.000 claims description 9
- 238000012986 modification Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012360 testing method Methods 0.000 description 5
- 230000010287 polarization Effects 0.000 description 4
- 230000008030 elimination Effects 0.000 description 2
- 238000003379 elimination reaction Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
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- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/12—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing
- G01R31/1227—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials
- G01R31/1263—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation
- G01R31/129—Testing dielectric strength or breakdown voltage ; Testing or monitoring effectiveness or level of insulation, e.g. of a cable or of an apparatus, for example using partial discharge measurements; Electrostatic testing of components, parts or materials of solid or fluid materials, e.g. insulation films, bulk material; of semiconductors or LV electronic components or parts; of cable, line or wire insulation of components or parts made of semiconducting materials; of LV components or parts
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/0619—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE] with a supplementary region doped oppositely to or in rectifying contact with the semiconductor containing or contacting region, e.g. guard rings with PN or Schottky junction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
- H01L29/0603—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
- H01L29/0607—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration
- H01L29/0611—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices
- H01L29/0615—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions for preventing surface leakage or controlling electric field concentration for increasing or controlling the breakdown voltage of reverse biased devices by the doping profile or the shape or the arrangement of the PN junction, or with supplementary regions, e.g. junction termination extension [JTE]
- H01L29/063—Reduced surface field [RESURF] pn-junction structures
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- H—ELECTRICITY
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
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- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
図1は、チップ状態の半導体装置の断面図である。この半導体装置は、チップの中央部分に主電流が流れるセル構造10を備えている。そして、セル構造10を囲むように終端構造12が形成されている。セル構造10と終端構造12は基板14に形成されている。
図5は、検査実施前の半導体装置の断面図である。表面層39には、プロセス中のイオン進入などの外界の影響により、電荷が生じている。本発明の実施の形態2に係る半導体装置の検査方法では、まず電荷除去工程を実施して表面層39の電荷を除去する。
図9は、検査実施前の半導体装置の断面図である。半導体装置は封止材100で封止されている。表面層39の上に封止材100が形成されている。封止材100は例えばゲル封止材であるが特に限定されない。
Claims (5)
- 主電流が流れるセル構造と、前記セル構造を囲む終端構造とが基板に形成された半導体装置に電圧を印加する第1検査工程と、
前記第1検査工程の後に、前記終端構造の前記基板の上に絶縁膜及び/又は半絶縁膜で形成された表面層の電荷を除去する電荷除去工程と、
前記電荷除去工程の後に、前記半導体装置の耐圧を検査する第2検査工程と、を備え、
前記第1検査工程により、前記表面層が分極し、
前記終端構造における前記基板の表面側のうち前記セル構造と反対の部分にはチャネルストッパが形成され、
前記セル構造に、前記表面層の前記セル構造側の部分に接するように表面電極が形成され、
前記終端構造に、前記チャネルストッパと、前記表面層の前記チャネルストッパ側の部分とに接するように外周電極が形成され、
前記電荷除去工程では、
抵抗装置の一端に形成された第1導電体を前記表面電極に当て、前記抵抗装置の他端に形成された第2導電体を前記外周電極に当てることを特徴とする半導体装置の検査方法。 - 主電流が流れるセル構造と、前記セル構造を囲み、かつ表面に絶縁膜及び/又は半絶縁膜で形成された表面層を有する終端構造と、前記表面層の上に形成された封止材とが基板に形成された半導体装置の前記封止材を除去して、前記表面層を露出させる封止材除去工程と、
前記封止材除去工程の後に、前記表面層の電荷を除去する電荷除去工程と、を備え、
前記電荷除去工程では、
電圧印加装置の一端に形成された第1導電体を前記表面層に当て、前記電圧印加装置の他端に形成された第2導電体を前記半導体装置の裏面に当てて、前記第1導電体と前記第2導電体に前記表面層の電荷を消滅させるように電位差を生じさせることを特徴とする半導体装置の検査方法。 - 前記終端構造における前記基板の表面側には、FLR構造、リサーフ構造、又はVLD構造が形成されたことを特徴とする請求項1又は2に記載の半導体装置の検査方法。
- 前記終端構造における前記基板の表面側には複数のFLRが形成され、
前記表面層は、前記複数のFLRの上に、前記複数のFLRと接するように形成されたことを特徴とする請求項1又は2に記載の半導体装置の検査方法。 - 前記半導体装置はダイオード、IGBT、又はMOSFETであることを特徴とする請求項1乃至4のいずれか1項に記載の半導体装置の検査方法。
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JP2013121043A JP6079456B2 (ja) | 2013-06-07 | 2013-06-07 | 半導体装置の検査方法 |
US14/242,016 US9401314B2 (en) | 2013-06-07 | 2014-04-01 | Method of testing semiconductor device |
DE201410209932 DE102014209932A1 (de) | 2013-06-07 | 2014-05-23 | Verfahren zum Testen einer Halbleitervorrichtung |
KR1020140066770A KR101630612B1 (ko) | 2013-06-07 | 2014-06-02 | 반도체장치의 검사방법 |
CN201410253353.2A CN104241155B (zh) | 2013-06-07 | 2014-06-09 | 半导体装置的检查方法 |
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CN105185723B (zh) * | 2015-10-14 | 2018-05-25 | 上海华力微电子有限公司 | 一种半导体器件电性测试方法 |
CN105261574B (zh) * | 2015-10-28 | 2018-04-03 | 上海华力微电子有限公司 | 一种排除电性噪声干扰的方法 |
JP6526343B2 (ja) * | 2016-09-01 | 2019-06-05 | 三菱電機株式会社 | 半導体装置の測定方法 |
DE102016120301A1 (de) * | 2016-10-25 | 2018-04-26 | Infineon Technologies Ag | Leistungshalbleitervorrichtungs-Abschlussstruktur |
CN107947737B (zh) * | 2017-11-20 | 2019-04-16 | 苏州腾晖光伏技术有限公司 | 一种用于多主栅太阳能电池的测试装置 |
CN116110943A (zh) * | 2023-04-11 | 2023-05-12 | 通威微电子有限公司 | 一种耐压器件及其制作方法 |
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KR101630612B1 (ko) | 2016-06-15 |
JP2014238332A (ja) | 2014-12-18 |
CN104241155B (zh) | 2017-08-18 |
CN104241155A (zh) | 2014-12-24 |
US20140363906A1 (en) | 2014-12-11 |
US9401314B2 (en) | 2016-07-26 |
KR20140143703A (ko) | 2014-12-17 |
DE102014209932A1 (de) | 2014-12-11 |
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