JP2011253987A - 半導体受光素子及び光モジュール - Google Patents
半導体受光素子及び光モジュール Download PDFInfo
- Publication number
- JP2011253987A JP2011253987A JP2010127802A JP2010127802A JP2011253987A JP 2011253987 A JP2011253987 A JP 2011253987A JP 2010127802 A JP2010127802 A JP 2010127802A JP 2010127802 A JP2010127802 A JP 2010127802A JP 2011253987 A JP2011253987 A JP 2011253987A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- light receiving
- receiving element
- main surface
- semiconductor light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/30—Coatings
- H10F77/306—Coatings for devices having potential barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/0231—Stems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
- H01S5/068—Stabilisation of laser output parameters
- H01S5/0683—Stabilisation of laser output parameters by monitoring the optical output parameters
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F30/00—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors
- H10F30/20—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors
- H10F30/21—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation
- H10F30/22—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes
- H10F30/221—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction
- H10F30/2215—Individual radiation-sensitive semiconductor devices in which radiation controls the flow of current through the devices, e.g. photodetectors the devices having potential barriers, e.g. phototransistors the devices being sensitive to infrared, visible or ultraviolet radiation the devices having only one potential barrier, e.g. photodiodes the potential barrier being a PN homojunction the devices comprising active layers made of only Group III-V materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F55/00—Radiation-sensitive semiconductor devices covered by groups H10F10/00, H10F19/00 or H10F30/00 being structurally associated with electric light sources and electrically or optically coupled thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Light Receiving Elements (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010127802A JP2011253987A (ja) | 2010-06-03 | 2010-06-03 | 半導体受光素子及び光モジュール |
| US13/017,072 US8330243B2 (en) | 2010-06-03 | 2011-01-31 | Semiconductor light-receiving element and optical module |
| TW100103612A TW201145502A (en) | 2010-06-03 | 2011-01-31 | Semiconductor light-receiving element and optical module |
| DE102011076887A DE102011076887A1 (de) | 2010-06-03 | 2011-06-01 | Licht empfangendes Halbleiterelement und optisches Modul |
| KR1020110052557A KR101296192B1 (ko) | 2010-06-03 | 2011-06-01 | 반도체 수광소자 및 광 모듈 |
| CN2011101473865A CN102270666A (zh) | 2010-06-03 | 2011-06-02 | 半导体受光元件以及光模块 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010127802A JP2011253987A (ja) | 2010-06-03 | 2010-06-03 | 半導体受光素子及び光モジュール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011253987A true JP2011253987A (ja) | 2011-12-15 |
| JP2011253987A5 JP2011253987A5 (enExample) | 2013-05-30 |
Family
ID=44974027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010127802A Pending JP2011253987A (ja) | 2010-06-03 | 2010-06-03 | 半導体受光素子及び光モジュール |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8330243B2 (enExample) |
| JP (1) | JP2011253987A (enExample) |
| KR (1) | KR101296192B1 (enExample) |
| CN (1) | CN102270666A (enExample) |
| DE (1) | DE102011076887A1 (enExample) |
| TW (1) | TW201145502A (enExample) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015176904A (ja) * | 2014-03-13 | 2015-10-05 | 三菱電機株式会社 | 半導体受光素子 |
| JP2018066888A (ja) * | 2016-10-20 | 2018-04-26 | 住友電気工業株式会社 | 光モジュール |
| US10365448B2 (en) | 2017-12-15 | 2019-07-30 | Sumitomo Electric Industries, Ltd. | Optical module having two lens system and monitor photodiode between two lenses |
| WO2022044556A1 (ja) * | 2020-08-26 | 2022-03-03 | 浜松ホトニクス株式会社 | 光検出装置 |
| JPWO2022074780A1 (enExample) * | 2020-10-08 | 2022-04-14 |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6518076B2 (ja) * | 2015-02-16 | 2019-05-22 | エイブリック株式会社 | 受光素子を有する光検出半導体装置 |
| DE102020117238B4 (de) * | 2020-06-30 | 2025-03-27 | First Sensor AG | Anordnung für ein optoelektronisches Bauelement, Verfahren zum Herstellen und optoelektronisches Bauelement |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045870A (ja) * | 1990-04-23 | 1992-01-09 | Hitachi Ltd | 光半導体装置及びそれを用いた受光器 |
| JPH05152599A (ja) * | 1991-11-29 | 1993-06-18 | Nec Corp | 半導体受光素子 |
| JPH0653538A (ja) * | 1992-07-28 | 1994-02-25 | Toshiba Corp | 半導体受光素子 |
| JP2000036615A (ja) * | 1998-07-21 | 2000-02-02 | Sumitomo Electric Ind Ltd | 受光素子及び受光素子モジュール |
| WO2002063730A1 (fr) * | 2001-02-05 | 2002-08-15 | Sumitomo Electric Industries, Ltd. | Emetteur optique |
| JP2008047580A (ja) * | 2006-08-11 | 2008-02-28 | Sumitomo Electric Ind Ltd | 半導体受光素子 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0452801B1 (en) | 1990-04-16 | 1996-11-27 | Fujitsu Limited | Semiconductor device having light receiving element and method of producing the same |
| JP2847561B2 (ja) | 1990-04-16 | 1999-01-20 | 富士通株式会社 | 半導体受光素子 |
| US5345074A (en) * | 1990-11-13 | 1994-09-06 | Sumitomo Electric Industries, Ltd. | Semiconductor light source |
| JP3115148B2 (ja) | 1993-03-31 | 2000-12-04 | 株式会社東芝 | 半導体装置の製造方法 |
| JPH1117211A (ja) | 1997-06-26 | 1999-01-22 | Hitachi Ltd | 半導体面型受光素子及び装置 |
| US6043550A (en) | 1997-09-03 | 2000-03-28 | Sumitomo Electric Industries, Ltd. | Photodiode and photodiode module |
| JP3221402B2 (ja) | 1998-06-22 | 2001-10-22 | 住友電気工業株式会社 | 受光素子と受光装置 |
| JP3931545B2 (ja) * | 2000-03-22 | 2007-06-20 | 住友電気工業株式会社 | 発光モジュール |
| JP2002289904A (ja) * | 2001-03-23 | 2002-10-04 | Sumitomo Electric Ind Ltd | 半導体受光素子とその製造方法 |
| US6888857B2 (en) * | 2001-09-21 | 2005-05-03 | Sumitomo Electric Industries, Ltd. | Optical module |
| EP1396913A1 (en) * | 2002-09-03 | 2004-03-10 | Agilent Technologies, Inc. - a Delaware corporation - | Single mode distributed feedback lasers |
| JP2005072130A (ja) | 2003-08-21 | 2005-03-17 | Mitsubishi Electric Corp | 半導体レーザ装置 |
| WO2005053124A1 (ja) * | 2003-11-28 | 2005-06-09 | Nec Corporation | 分布帰還型半導体レーザ、分布帰還型半導体レーザアレイ及び光モジュール |
| JP2006147991A (ja) | 2004-11-24 | 2006-06-08 | Canon Inc | 固体撮像素子及びそれを有する光学機器 |
| JP2007013015A (ja) * | 2005-07-04 | 2007-01-18 | Sumitomo Electric Ind Ltd | 半導体受光素子 |
| JP2008010710A (ja) * | 2006-06-30 | 2008-01-17 | Oki Electric Ind Co Ltd | 半導体レーザ装置 |
| US7670638B2 (en) | 2007-05-17 | 2010-03-02 | Sunpower Corporation | Protection layer for fabricating a solar cell |
| KR101444709B1 (ko) | 2007-11-16 | 2014-09-30 | 주성엔지니어링(주) | 기판형 태양전지 및 그 제조방법 |
| JP5303962B2 (ja) * | 2008-02-28 | 2013-10-02 | 三菱電機株式会社 | 半導体受光素子 |
| US8476681B2 (en) * | 2009-09-17 | 2013-07-02 | Sionyx, Inc. | Photosensitive imaging devices and associated methods |
-
2010
- 2010-06-03 JP JP2010127802A patent/JP2011253987A/ja active Pending
-
2011
- 2011-01-31 US US13/017,072 patent/US8330243B2/en not_active Expired - Fee Related
- 2011-01-31 TW TW100103612A patent/TW201145502A/zh unknown
- 2011-06-01 DE DE102011076887A patent/DE102011076887A1/de not_active Ceased
- 2011-06-01 KR KR1020110052557A patent/KR101296192B1/ko not_active Expired - Fee Related
- 2011-06-02 CN CN2011101473865A patent/CN102270666A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH045870A (ja) * | 1990-04-23 | 1992-01-09 | Hitachi Ltd | 光半導体装置及びそれを用いた受光器 |
| JPH05152599A (ja) * | 1991-11-29 | 1993-06-18 | Nec Corp | 半導体受光素子 |
| JPH0653538A (ja) * | 1992-07-28 | 1994-02-25 | Toshiba Corp | 半導体受光素子 |
| JP2000036615A (ja) * | 1998-07-21 | 2000-02-02 | Sumitomo Electric Ind Ltd | 受光素子及び受光素子モジュール |
| WO2002063730A1 (fr) * | 2001-02-05 | 2002-08-15 | Sumitomo Electric Industries, Ltd. | Emetteur optique |
| JP2008047580A (ja) * | 2006-08-11 | 2008-02-28 | Sumitomo Electric Ind Ltd | 半導体受光素子 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015176904A (ja) * | 2014-03-13 | 2015-10-05 | 三菱電機株式会社 | 半導体受光素子 |
| JP2018066888A (ja) * | 2016-10-20 | 2018-04-26 | 住友電気工業株式会社 | 光モジュール |
| US10365448B2 (en) | 2017-12-15 | 2019-07-30 | Sumitomo Electric Industries, Ltd. | Optical module having two lens system and monitor photodiode between two lenses |
| WO2022044556A1 (ja) * | 2020-08-26 | 2022-03-03 | 浜松ホトニクス株式会社 | 光検出装置 |
| JP2022038202A (ja) * | 2020-08-26 | 2022-03-10 | 浜松ホトニクス株式会社 | 光検出装置 |
| JP7674083B2 (ja) | 2020-08-26 | 2025-05-09 | 浜松ホトニクス株式会社 | 光検出装置 |
| JPWO2022074780A1 (enExample) * | 2020-10-08 | 2022-04-14 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101296192B1 (ko) | 2013-08-13 |
| US20110297967A1 (en) | 2011-12-08 |
| DE102011076887A1 (de) | 2011-12-08 |
| TW201145502A (en) | 2011-12-16 |
| KR20110132990A (ko) | 2011-12-09 |
| US8330243B2 (en) | 2012-12-11 |
| CN102270666A (zh) | 2011-12-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130411 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20130411 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20140128 |
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| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20140129 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20140603 |