JP2011006709A - エポキシ樹脂組成物 - Google Patents
エポキシ樹脂組成物 Download PDFInfo
- Publication number
- JP2011006709A JP2011006709A JP2010229291A JP2010229291A JP2011006709A JP 2011006709 A JP2011006709 A JP 2011006709A JP 2010229291 A JP2010229291 A JP 2010229291A JP 2010229291 A JP2010229291 A JP 2010229291A JP 2011006709 A JP2011006709 A JP 2011006709A
- Authority
- JP
- Japan
- Prior art keywords
- curing
- epoxy resin
- tetrakis
- hydroxyphenyl
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5093—Complexes of amines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
【解決手段】エポキシ基と反応してエポキシ樹脂を硬化させる硬化剤と、エポキシ基1モルに対して0.001〜0.1モルのテトラキスフェノール系化合物を含有することを特徴とするエポキシ樹脂組成物である。
【選択図】なし
Description
言い換えれば、本発明のエポキシ樹脂組成物は、エポキシ樹脂を硬化させる硬化剤の硬化速度を進め、エポキシ樹脂組成物の硬化完結時間を短縮できる利点及び従来の硬化剤の使用量を低減化できる特徴があり、エポキシ樹脂を硬化させる用途、例えば、エポキシ樹脂系接着剤、半導体封止材、プリント配線板用積層板、ワニス、粉体塗料、注型材料、インク等の用途に好適に使用することができる。特にエポキシ系塗料などとして利用するのに極めて好適なエポキシ樹脂組成物を提供する。本発明は、エポキシ樹脂に限らず主剤と副剤の混合により硬化を開始するような2液型熱硬化性樹脂組成物、例えばウレタン樹脂、シリコン樹脂等にも応用が可能である。
基体樹脂(未硬化樹脂)UVR−6410(ユニオンカーバイド社製、商品名)100重量部に、1B2MZ4.0重量部とTEP5.0重量部を添加した。25℃で10分間混練し、更に25℃で20分間静置した後、該樹脂組成物の初期粘度を測定した。その後、該樹脂組成物を25℃で静置し、時間の経過に伴う粘度の変化を測定した。粘度測定は、JIS K−6833−1994に準じ、B8R型回転粘度計(東京計器製)を用いた。測定結果を表1に示した。該樹脂組成物の可使時間を樹脂粘度が初期粘度の2倍になるまでの時間と定義した場合、該樹脂組成物の可使時間は約1時間であった。また、上記の試験において1B2MZの代わりに2E4MZ4.0重量部を使用し、同様にして該樹脂組成物の可使時間を測定した。結果は表1に示したように、該樹脂組成物の可使時間は約2時間であった。更に、上記の試験において、1B2MZ4.0重量部の代わりに、1B2MZ1.0重量部を使用し、同様にして該樹脂組成物の可使時間を測定した。結果は表1に示したように、該樹脂組成物の可使時間は約2時間であった。
なお、TEP、1B2MZ及び2E4MZは次の化合物の略号である。
TEP:1,1,2,2−テトラキス(4−ヒドロキシフェニル)エタン
1B2MZ:1−ベンジル−2−メチルイミダゾール
2E4MZ:2−エチル−4−メチルイミダゾール
実施例1において、TEPを添加しない以外は、実施例1と同様の操作を行い、それぞれの樹脂組成物の可使時間を測定した。結果を表1に示した。1B2MZ4.0重量部を配合した樹脂組成物の可使時間は10時間であった。2E4MZ4.0重量部を配合した樹脂組成物の可使時間は8時間であった。また、1B2MZ1.0重量部を配合した樹脂組成物の可使時間は10時間であった。実施例1と比較例1の結果を比較すると、TEPを配合した樹脂組成物の可使時間は、TEPを配合しない樹脂組成物のそれよりも1/4〜1/10であり、短時間で硬化物が得られることが明らかである。更に、実施例1においてTEPの代わりにフェノール、ビスフェノールA、ビスフェノールSまたは1,1−ビス(4−ヒドロキシフェニル)シクロヘキサンを添加した場合には、TEPを配合した場合のような可使時間の短縮、即ち樹脂組成物の硬化促進はまったく観察されなかった。
Claims (1)
- エポキシ基と反応してエポキシ樹脂を硬化させる硬化剤と、エポキシ基1モルに対して0.001〜0.1モルの1,1,2,2−テトラキス(4−ヒドロキシフェニル)エタンを含有することを特徴とするエポキシ樹脂組成物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010229291A JP5376674B2 (ja) | 1996-12-27 | 2010-10-12 | エポキシ樹脂組成物 |
Applications Claiming Priority (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP35851896 | 1996-12-27 | ||
JP1996358518 | 1996-12-27 | ||
JP1997022040 | 1997-01-21 | ||
JP2204097 | 1997-01-21 | ||
JP12396497 | 1997-05-14 | ||
JP1997123964 | 1997-05-14 | ||
JP17746897 | 1997-07-02 | ||
JP1997177468 | 1997-07-02 | ||
JP2010229291A JP5376674B2 (ja) | 1996-12-27 | 2010-10-12 | エポキシ樹脂組成物 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006182704A Division JP2006299281A (ja) | 1996-12-27 | 2006-06-30 | エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011006709A true JP2011006709A (ja) | 2011-01-13 |
JP5376674B2 JP5376674B2 (ja) | 2013-12-25 |
Family
ID=27457687
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010229291A Expired - Lifetime JP5376674B2 (ja) | 1996-12-27 | 2010-10-12 | エポキシ樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
US (3) | US6727325B1 (ja) |
EP (2) | EP1520867A3 (ja) |
JP (1) | JP5376674B2 (ja) |
DE (1) | DE69732651T2 (ja) |
WO (1) | WO1998029469A1 (ja) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7495060B2 (en) * | 1996-12-27 | 2009-02-24 | Nippon Soda Co., Ltd. | Tetrakisphenol and non-clathrated curing agent for epoxy resin |
EP1520867A3 (en) | 1996-12-27 | 2008-04-30 | Nippon Soda Co., Ltd. | Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
GB2323596B (en) * | 1997-03-25 | 2000-02-23 | Kansai Paint Co Ltd | Curable coating composition |
EP1342706B1 (en) * | 2000-12-11 | 2013-04-24 | Nippon Soda Co., Ltd. | Method for producing molecular compound |
JP4234971B2 (ja) * | 2002-10-09 | 2009-03-04 | 日本曹達株式会社 | 新規包接化合物 |
EP1645583A1 (en) * | 2004-10-06 | 2006-04-12 | Cytec Surface Specialties, S.A. | Radiation curable powder coating compositions |
US8735529B2 (en) | 2006-12-21 | 2014-05-27 | Nippon Soda Co., Ltd. | Clathrate compound, curing catalyst, composition for forming cured resin, and cured resin |
WO2008152003A1 (de) * | 2007-06-11 | 2008-12-18 | Basf Se | Katalysator für die härtung von epoxiden |
CN101802049B (zh) * | 2007-09-21 | 2012-09-12 | 日本曹达株式会社 | 含有包合配合物的半导体封装用环氧树脂组合物 |
CN103642001A (zh) | 2009-03-11 | 2014-03-19 | 日本曹达株式会社 | 包合配合物 |
CN102356109B (zh) | 2009-03-17 | 2014-04-02 | 日本曹达株式会社 | 包合配合物、固化剂、固化促进剂、环氧树脂组合物及半导体封装用环氧树脂组合物 |
CN102574988B (zh) | 2009-10-16 | 2014-05-14 | 日本曹达株式会社 | 环氧固化树脂形成用组合物及其固化物 |
CN102892849B (zh) * | 2010-05-21 | 2016-01-20 | 日本曹达株式会社 | 固化性粉体涂料组合物及其固化物 |
JP5765049B2 (ja) * | 2010-05-27 | 2015-08-19 | Jsr株式会社 | 硬化膜形成用感放射線性樹脂組成物、硬化膜形成用感放射線性樹脂組成物の製造方法、硬化膜、硬化膜の形成方法及び表示素子 |
KR101813138B1 (ko) * | 2010-05-27 | 2017-12-28 | 제이에스알 가부시끼가이샤 | 경화막 형성용 감방사선성 수지 조성물, 경화막 형성용 감방사선성 수지 조성물의 제조 방법, 경화막, 경화막의 형성 방법 및 표시 소자 |
CN102375338A (zh) * | 2010-08-16 | 2012-03-14 | Jsr株式会社 | 着色组合物、着色组合物的制造方法、着色图案、滤色器、彩色显示元件以及滤色器的制造方法 |
JP5765059B2 (ja) * | 2010-08-16 | 2015-08-19 | Jsr株式会社 | 着色組成物、着色組成物の製造方法、着色パターン、カラーフィルタ、カラー表示素子及びカラーフィルタの製造方法 |
WO2012082224A1 (en) * | 2010-12-17 | 2012-06-21 | Dow Global Technologies Llc | Curable compositions |
KR20140080182A (ko) * | 2012-12-20 | 2014-06-30 | 삼성전기주식회사 | 인쇄회로기판용 수지 조성물, 절연필름, 프리프레그 및 인쇄회로기판 |
JP2014185115A (ja) * | 2013-03-25 | 2014-10-02 | Nippon Soda Co Ltd | 新規な包接化合物 |
US10266642B2 (en) | 2014-09-08 | 2019-04-23 | Nippon Soda Co., Ltd. | Crystal polymorphism of inclusion compound and method for producing same, and curable resin composition |
MA41308A (fr) * | 2014-12-22 | 2017-11-14 | Nippon Soda Co | Composition de résine époxy |
TWI734686B (zh) | 2015-05-19 | 2021-08-01 | 瑞士商亨斯邁先進材料授權(瑞士)有限公司 | 熱固性環氧樹脂之固化劑及製備電機工程用絕緣系統的方法 |
GB2569614B (en) | 2017-12-21 | 2022-04-06 | Hexcel Composites Ltd | A curative composition and a resin composition containing the curative composition |
TWI847997B (zh) * | 2018-08-17 | 2024-07-11 | 德商漢高股份有限及兩合公司 | 液體壓縮成型或封裝組合物 |
EP4424673A1 (en) | 2021-10-26 | 2024-09-04 | Adeka Corporation | Clathrate compound, epoxy resin curing agent, and curable resin composition |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6191218A (ja) * | 1984-10-05 | 1986-05-09 | チバ‐ガイギー アクチエンゲルシヤフト | エポキシ樹脂成形材量 |
JPH03192113A (ja) * | 1989-12-21 | 1991-08-22 | Mitsui Toatsu Chem Inc | 半導体封止用樹脂組成物 |
JPH0812746A (ja) * | 1994-04-26 | 1996-01-16 | Toray Ind Inc | エポキシ樹脂組成物および硬化剤 |
JPH09157498A (ja) * | 1995-12-12 | 1997-06-17 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグ及び繊維強化複合材料 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3694407A (en) * | 1970-08-11 | 1972-09-26 | Shell Oil Co | Epoxy-containing condensates,their preparation and use |
CH637150A5 (de) * | 1978-10-30 | 1983-07-15 | Ciba Geigy Ag | Epoxidharzformmasse. |
US4467320A (en) | 1982-05-06 | 1984-08-21 | The Bendix Corporation | Measurement of a linear variable differential transformer signal by phase conversion |
JPS6040125A (ja) | 1983-08-13 | 1985-03-02 | Shikoku Chem Corp | エポキシ硬化方法 |
GB8719616D0 (en) * | 1987-08-19 | 1987-09-23 | Shell Int Research | Heat-hardenable compositions |
JPH0774260B2 (ja) * | 1987-09-14 | 1995-08-09 | 東都化成株式会社 | 硬化性エポキシ樹脂組成物 |
JPH0218413A (ja) * | 1988-07-06 | 1990-01-22 | Toshiba Corp | エポキシ樹脂組成物及び樹脂封止型半導体装置 |
JPH02296814A (ja) | 1989-05-10 | 1990-12-07 | Mitsui Toatsu Chem Inc | ポリフェノール樹脂 |
JP2501154B2 (ja) * | 1990-11-26 | 1996-05-29 | 三井東圧化学株式会社 | テトラキスキシレノ―ルエタンの製造方法 |
JPH04275325A (ja) * | 1991-02-28 | 1992-09-30 | Nippon Steel Chem Co Ltd | 半導体封止用樹脂組成物 |
JP2897850B2 (ja) * | 1991-04-26 | 1999-05-31 | 旭有機材工業株式会社 | 高純度テトラキスフェノールエタンの製造方法 |
US5200475A (en) * | 1991-06-03 | 1993-04-06 | Shell Oil Company | Epoxy resin compositions containing disecondary aromatic amines |
JP3269126B2 (ja) * | 1991-08-06 | 2002-03-25 | 栗田工業株式会社 | エポキシ樹脂用硬化剤及びエポキシ樹脂用硬化促進剤 |
JPH05105739A (ja) * | 1991-10-16 | 1993-04-27 | Nippon Steel Chem Co Ltd | 半導体封止用樹脂組成物 |
JP3812953B2 (ja) | 1992-12-01 | 2006-08-23 | 日本曹達株式会社 | 新規包接化合物及びその製造方法 |
TW281685B (ja) | 1992-04-02 | 1996-07-21 | Hoechst Ag | |
US5364977A (en) * | 1992-12-01 | 1994-11-15 | Nippon Soda Co., Ltd. | Clathrate compounds comprising tetrakisphenols as host |
WO1994014866A1 (en) * | 1992-12-21 | 1994-07-07 | Alliedsignal, Inc. | Solvent free epoxy resin compositions |
JPH06329570A (ja) | 1993-05-25 | 1994-11-29 | Nippon Soda Co Ltd | 新規包接化合物及びその製造方法 |
JP3461014B2 (ja) * | 1993-09-07 | 2003-10-27 | 日本曹達株式会社 | テトラキス(ヒドロキシフェニル)アルカンの製造方法 |
JPH07330871A (ja) * | 1994-06-01 | 1995-12-19 | Kurita Water Ind Ltd | エポキシ樹脂用硬化剤及び硬化促進剤 |
JPH08151429A (ja) | 1994-11-25 | 1996-06-11 | Shikoku Chem Corp | エポキシ樹脂組成物 |
JP3699148B2 (ja) * | 1995-04-04 | 2005-09-28 | 三菱レイヨン株式会社 | プリプレグの常温硬化方法並びに構造物の補修補強方法 |
EP1520867A3 (en) | 1996-12-27 | 2008-04-30 | Nippon Soda Co., Ltd. | Curatives for epoxy resin, curing accelerator, and epoxy resin composition |
-
1997
- 1997-12-26 EP EP04078486A patent/EP1520867A3/en not_active Withdrawn
- 1997-12-26 EP EP97950428A patent/EP0949286B1/en not_active Expired - Lifetime
- 1997-12-26 US US09/331,829 patent/US6727325B1/en not_active Expired - Lifetime
- 1997-12-26 WO PCT/JP1997/004889 patent/WO1998029469A1/ja active IP Right Grant
- 1997-12-26 DE DE69732651T patent/DE69732651T2/de not_active Expired - Lifetime
-
2003
- 2003-11-19 US US10/717,871 patent/US20040106764A1/en not_active Abandoned
-
2008
- 2008-11-26 US US12/323,532 patent/US20090093599A1/en not_active Abandoned
-
2010
- 2010-10-12 JP JP2010229291A patent/JP5376674B2/ja not_active Expired - Lifetime
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6191218A (ja) * | 1984-10-05 | 1986-05-09 | チバ‐ガイギー アクチエンゲルシヤフト | エポキシ樹脂成形材量 |
JPH03192113A (ja) * | 1989-12-21 | 1991-08-22 | Mitsui Toatsu Chem Inc | 半導体封止用樹脂組成物 |
JPH0812746A (ja) * | 1994-04-26 | 1996-01-16 | Toray Ind Inc | エポキシ樹脂組成物および硬化剤 |
JPH09157498A (ja) * | 1995-12-12 | 1997-06-17 | Toray Ind Inc | 繊維強化複合材料用エポキシ樹脂組成物、プリプレグ及び繊維強化複合材料 |
Also Published As
Publication number | Publication date |
---|---|
US20090093599A1 (en) | 2009-04-09 |
US20040106764A1 (en) | 2004-06-03 |
EP1520867A3 (en) | 2008-04-30 |
EP1520867A2 (en) | 2005-04-06 |
EP0949286B1 (en) | 2005-03-02 |
JP5376674B2 (ja) | 2013-12-25 |
EP0949286A1 (en) | 1999-10-13 |
DE69732651D1 (de) | 2005-04-07 |
EP0949286A4 (en) | 2000-12-20 |
DE69732651T2 (de) | 2005-08-04 |
US6727325B1 (en) | 2004-04-27 |
WO1998029469A1 (fr) | 1998-07-09 |
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