JP2010049209A - 撮像装置、撮像システム、及び焦点検出方法 - Google Patents
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/28—Systems for automatic generation of focusing signals
- G02B7/34—Systems for automatic generation of focusing signals using different areas in a pupil plane
- G02B7/343—Systems for automatic generation of focusing signals using different areas in a pupil plane using light beam separating prisms
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- G—PHYSICS
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- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/28—Systems for automatic generation of focusing signals
- G02B7/34—Systems for automatic generation of focusing signals using different areas in a pupil plane
- G02B7/346—Systems for automatic generation of focusing signals using different areas in a pupil plane using horizontal and vertical areas in the pupil plane, i.e. wide area autofocusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B13/00—Viewfinders; Focusing aids for cameras; Means for focusing for cameras; Autofocus systems for cameras
- G03B13/32—Means for focusing
- G03B13/34—Power focusing
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B3/00—Focusing arrangements of general interest for cameras, projectors or printers
- G03B3/10—Power-operated focusing
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/60—Control of cameras or camera modules
- H04N23/67—Focus control based on electronic image sensor signals
- H04N23/672—Focus control based on electronic image sensor signals based on the phase difference signals
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- H—ELECTRICITY
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/703—SSIS architectures incorporating pixels for producing signals other than image signals
- H04N25/704—Pixels specially adapted for focusing, e.g. phase difference pixel sets
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- H—ELECTRICITY
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- H04N23/60—Control of cameras or camera modules
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Abstract
【解決手段】 撮影レンズ(TL)の異なる領域を通過する対の光束をそれぞれ光電変換して画像信号対を出力する複数の焦点検出用画素対を含む、撮像素子(107)と、前記撮影レンズの光軸に対する前記焦点検出用画素対の中心軸ずれ情報を記憶するフラッシュメモリ(133)と、前記中心軸ずれ情報と前記撮影レンズの射出瞳情報とに基づいて、前記焦点検出用画素対それぞれに入射する光量のアンバランスを補償するように、前記画像信号対の信号レベルを補正する補正部(170)と、前記補正部により補正された前記画像信号対を用いて、前記撮影レンズの焦点検出を行う焦点検出手段(171)と、を備える。
【選択図】 図17
Description
図1は本発明の第1の実施形態に係るカメラの構成を示すブロック図であり、一例として、撮像素子を有するカメラ本体と撮影レンズ100が一体構成されたデジタルスチルカメラを示している。
(1)各焦点検出用画素対に入射する光量のアンバランス
(2)瞳分離方向の線像分布変化による焦点検出用信号の形状くずれ
(3)基線長変化によるデフォーカス量検知誤差
図17は本第1の実施形態におけるの焦点検出用信号対を補正するための、図7のCPU121に設けられる演算部904の内部詳細を示すブロック図である。図17において図7の連結部903にて形成される焦点検出用信号は演算部904内部の補正部170にて(1)を含む補正を行い、その後相関演算部171に入力される。
C0=f(h) …(1)
CERR=f(h−hERR)・g(hERR) …(2)
C(xERR,yERR)=f(x−xERR,y−yERR)・g(xERR,yERR) …(3)
次に、本発明の第2の実施形態について説明する。
xERR=h(l,x) …(4)
yERR=i(l,y) …(5)
次に、本発明の第3の実施形態について説明する。
次に、本発明の第4の実施形態について説明する。
107 撮像素子
170 補正部
176 射出瞳情報
177 中心軸ずれ情報
Claims (10)
- 撮影レンズの異なる領域を通過する対の光束をそれぞれ光電変換して画像信号対を出力する複数の焦点検出用画素対を含む、撮像素子と、
前記撮影レンズの光軸に対する前記焦点検出用画素対の中心軸ずれ情報を記憶する記憶手段と、
前記中心軸ずれ情報と前記撮影レンズの射出瞳情報とに基づいて、前記焦点検出用画素対それぞれに入射する光量のアンバランスを補償するように、前記画像信号対の信号レベルを補正する補正手段と、
前記補正手段により補正された前記画像信号対を用いて、前記撮影レンズの焦点検出を行う焦点検出手段と
を備えることを特徴とする撮像装置。 - 前記射出瞳情報は、前記焦点検出用画素対それぞれの像高による射出瞳形状に関する情報を含み、前記補正手段は、前記焦点検出用画素対それぞれの該射出瞳形状に基づく射出瞳領域の比を前記中心軸ずれ情報に基づいて求め、当該求めた比に基づいて前記画像信号対を補正することを特徴とする請求項1に記載の撮像装置。
- 前記補正手段は、更に、前記撮影レンズの射出瞳までの射出瞳距離に基づいて、前記撮像素子の各位置における前記焦点検出用画素対の中心軸ずれ情報を補正し、該補正した後の中心軸ずれ情報に基づいて前記射出瞳領域の比を求めることを特徴とする請求項2に記載の撮像装置。
- 前記撮像素子は、画像の撮影に用いる撮像素子であって、該撮像素子の一部の画素を前記焦点検出用画素対として構成したことを特徴とする請求項1乃至3のいずれか1項に記載の撮像装置。
- 前記撮像素子は、画像の撮影に用いる撮像素子とは別に構成された、焦点検出用の撮像素子であることを特徴とする請求項1に記載の撮像装置。
- 前記中心軸ずれ情報は少なくとも撮像装置ごとに設定される情報であることを特徴とする請求項1に記載の撮像装置。
- 前記中心軸ずれ情報は前記撮影レンズの射出瞳の面の上におけるずれを表す情報であることを特徴とする請求項1に記載の撮像装置。
- 前記中心軸ずれ情報は前記撮影レンズの瞳距離変化に対応した情報であることを特徴とする請求項1に記載の撮像装置。
- 請求項1乃至8のいずれか1項に記載の撮像装置と、
前記撮像装置に着脱可能なレンズユニットとを有し、
前記撮像装置に前記中心軸ずれ情報を格納し、前記レンズユニットに前記射出瞳情報を格納し、前記レンズユニットから前記撮像装置へ前記射出瞳情報を送信することを特徴する撮像システム。 - 撮像装置における焦点検出方法であって、
撮像素子に含まれる複数の焦点検出用画素対により、撮影レンズの異なる領域を通過する対の光束をそれぞれ光電変換して画像信号対を出力する出力工程と、
前記撮影レンズの光軸に対する前記焦点検出用画素対の中心軸ずれ情報を取得する取得工程と、
前記中心軸ずれ情報と前記撮影レンズの射出瞳情報とに基づいて、前記焦点検出用画素対それぞれに入射する光量のアンバランスを補償するように、前記画像信号対の信号レベルを補正する補正工程と、
前記補正工程で補正された前記画像信号対を用いて、前記撮影レンズの焦点検出を行う焦点検出工程と
を備えることを特徴とする焦点検出方法。
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JP2008215918A JP5161702B2 (ja) | 2008-08-25 | 2008-08-25 | 撮像装置、撮像システム、及び焦点検出方法 |
US12/539,260 US8405760B2 (en) | 2008-08-25 | 2009-08-11 | Image sensing apparatus, image sensing system and focus detection method |
EP18159802.0A EP3396449A1 (en) | 2008-08-25 | 2009-08-24 | Image sensing apparatus and control method |
EP22157059.1A EP4047416A3 (en) | 2008-08-25 | 2009-08-24 | Image sensing apparatus, a lens unit, and control method |
EP09168519.8A EP2169459B1 (en) | 2008-08-25 | 2009-08-24 | Image sensing apparatus, image sensing system and focus detection method |
EP14178618.6A EP2811340B1 (en) | 2008-08-25 | 2009-08-24 | Image sensing apparatus, image sensing system and focus detection method |
CN2009101693497A CN101662588B (zh) | 2008-08-25 | 2009-08-25 | 摄像设备、摄像系统和焦点检测方法 |
US13/780,505 US8767118B2 (en) | 2008-08-25 | 2013-02-28 | Image sensing apparatus, image sensing system and focus detection method |
US14/279,546 US9560258B2 (en) | 2008-08-25 | 2014-05-16 | Image sensing apparatus, image sensing system and focus detection method of detecting a focus position of a lens using image signal pair |
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US10896931B1 (en) | 2010-10-11 | 2021-01-19 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11163112B2 (en) | 2010-10-13 | 2021-11-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with electromagnetic modulators |
US11929372B2 (en) | 2010-10-13 | 2024-03-12 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US9941319B2 (en) * | 2010-10-13 | 2018-04-10 | Monolithic 3D Inc. | Semiconductor and optoelectronic methods and devices |
US11164898B2 (en) | 2010-10-13 | 2021-11-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US10833108B2 (en) | 2010-10-13 | 2020-11-10 | Monolithic 3D Inc. | 3D microdisplay device and structure |
US11869915B2 (en) | 2010-10-13 | 2024-01-09 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11605663B2 (en) | 2010-10-13 | 2023-03-14 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11327227B2 (en) | 2010-10-13 | 2022-05-10 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with electromagnetic modulators |
US11984438B2 (en) | 2010-10-13 | 2024-05-14 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US10679977B2 (en) | 2010-10-13 | 2020-06-09 | Monolithic 3D Inc. | 3D microdisplay device and structure |
US11694922B2 (en) | 2010-10-13 | 2023-07-04 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US10943934B2 (en) | 2010-10-13 | 2021-03-09 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US11133344B2 (en) | 2010-10-13 | 2021-09-28 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11063071B1 (en) | 2010-10-13 | 2021-07-13 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with waveguides |
US10998374B1 (en) | 2010-10-13 | 2021-05-04 | Monolithic 3D Inc. | Multilevel semiconductor device and structure |
US11855114B2 (en) | 2010-10-13 | 2023-12-26 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US11043523B1 (en) | 2010-10-13 | 2021-06-22 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US11855100B2 (en) | 2010-10-13 | 2023-12-26 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US12094892B2 (en) | 2010-10-13 | 2024-09-17 | Monolithic 3D Inc. | 3D micro display device and structure |
US10978501B1 (en) | 2010-10-13 | 2021-04-13 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with waveguides |
US11437368B2 (en) | 2010-10-13 | 2022-09-06 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with oxide bonding |
US11404466B2 (en) | 2010-10-13 | 2022-08-02 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors |
US12080743B2 (en) | 2010-10-13 | 2024-09-03 | Monolithic 3D Inc. | Multilevel semiconductor device and structure with image sensors and wafer bonding |
US12068187B2 (en) | 2010-11-18 | 2024-08-20 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding and DRAM memory cells |
US11121021B2 (en) | 2010-11-18 | 2021-09-14 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US12100611B2 (en) | 2010-11-18 | 2024-09-24 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11094576B1 (en) | 2010-11-18 | 2021-08-17 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11355381B2 (en) | 2010-11-18 | 2022-06-07 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11804396B2 (en) | 2010-11-18 | 2023-10-31 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11018042B1 (en) | 2010-11-18 | 2021-05-25 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11521888B2 (en) | 2010-11-18 | 2022-12-06 | Monolithic 3D Inc. | 3D semiconductor device and structure with high-k metal gate transistors |
US11482438B2 (en) | 2010-11-18 | 2022-10-25 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
US11508605B2 (en) | 2010-11-18 | 2022-11-22 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11610802B2 (en) | 2010-11-18 | 2023-03-21 | Monolithic 3D Inc. | Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes |
US11862503B2 (en) | 2010-11-18 | 2024-01-02 | Monolithic 3D Inc. | Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11031275B2 (en) | 2010-11-18 | 2021-06-08 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11443971B2 (en) | 2010-11-18 | 2022-09-13 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11211279B2 (en) | 2010-11-18 | 2021-12-28 | Monolithic 3D Inc. | Method for processing a 3D integrated circuit and structure |
US12033884B2 (en) | 2010-11-18 | 2024-07-09 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11164770B1 (en) | 2010-11-18 | 2021-11-02 | Monolithic 3D Inc. | Method for producing a 3D semiconductor memory device and structure |
US11615977B2 (en) | 2010-11-18 | 2023-03-28 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11355380B2 (en) | 2010-11-18 | 2022-06-07 | Monolithic 3D Inc. | Methods for producing 3D semiconductor memory device and structure utilizing alignment marks |
US11923230B1 (en) | 2010-11-18 | 2024-03-05 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11735462B2 (en) | 2010-11-18 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with single-crystal layers |
US11482439B2 (en) | 2010-11-18 | 2022-10-25 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors |
US11784082B2 (en) | 2010-11-18 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11854857B1 (en) | 2010-11-18 | 2023-12-26 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor device and structure with memory cells and multiple metal layers |
US11107721B2 (en) | 2010-11-18 | 2021-08-31 | Monolithic 3D Inc. | 3D semiconductor device and structure with NAND logic |
US11569117B2 (en) | 2010-11-18 | 2023-01-31 | Monolithic 3D Inc. | 3D semiconductor device and structure with single-crystal layers |
US11495484B2 (en) | 2010-11-18 | 2022-11-08 | Monolithic 3D Inc. | 3D semiconductor devices and structures with at least two single-crystal layers |
US11901210B2 (en) | 2010-11-18 | 2024-02-13 | Monolithic 3D Inc. | 3D semiconductor device and structure with memory |
US11004719B1 (en) | 2010-11-18 | 2021-05-11 | Monolithic 3D Inc. | Methods for producing a 3D semiconductor memory device and structure |
JP5663331B2 (ja) * | 2011-01-31 | 2015-02-04 | オリンパス株式会社 | 制御装置、内視鏡装置、絞り制御方法及びプログラム |
JP2012234152A (ja) * | 2011-04-19 | 2012-11-29 | Canon Inc | 撮像装置及びその制御方法 |
JP5791349B2 (ja) * | 2011-04-21 | 2015-10-07 | キヤノン株式会社 | 撮像装置及びその制御方法 |
JP5956782B2 (ja) * | 2011-05-26 | 2016-07-27 | キヤノン株式会社 | 撮像素子及び撮像装置 |
KR101747304B1 (ko) * | 2011-05-30 | 2017-06-14 | 삼성전자주식회사 | 디지털 촬영 장치, 오토포커싱 방법, 및 이를 실행하기 위한 컴퓨터 판독가능 저장매체 |
US10388568B2 (en) | 2011-06-28 | 2019-08-20 | Monolithic 3D Inc. | 3D semiconductor device and system |
US8810713B2 (en) * | 2011-07-13 | 2014-08-19 | Olympus Imaging Corp. | Image pickup apparatus and image pickup device for performing auto-focusing |
KR101853817B1 (ko) | 2011-07-20 | 2018-05-02 | 삼성전자주식회사 | 촬상 소자 |
JP6000520B2 (ja) * | 2011-07-25 | 2016-09-28 | キヤノン株式会社 | 撮像装置およびその制御方法およびプログラム |
JP5525109B2 (ja) * | 2011-08-23 | 2014-06-18 | 富士フイルム株式会社 | 撮像装置 |
JP5667304B2 (ja) * | 2011-09-13 | 2015-02-12 | 富士フイルム株式会社 | 立体撮像装置 |
GB201119206D0 (en) | 2011-11-07 | 2011-12-21 | Canon Kk | Method and device for providing compensation offsets for a set of reconstructed samples of an image |
CN104221369B (zh) * | 2012-03-28 | 2016-02-10 | 富士胶片株式会社 | 摄像元件以及使用该摄像元件的摄像装置和摄像方法 |
JP6016412B2 (ja) * | 2012-03-30 | 2016-10-26 | キヤノン株式会社 | 撮像装置および信号処理方法 |
US9191566B2 (en) * | 2012-03-30 | 2015-11-17 | Samsung Electronics Co., Ltd. | Image pickup apparatus, method for image pickup and computer-readable recording medium |
US11476181B1 (en) | 2012-04-09 | 2022-10-18 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11881443B2 (en) | 2012-04-09 | 2024-01-23 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11616004B1 (en) | 2012-04-09 | 2023-03-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11088050B2 (en) | 2012-04-09 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers |
US11410912B2 (en) | 2012-04-09 | 2022-08-09 | Monolithic 3D Inc. | 3D semiconductor device with vias and isolation layers |
US11594473B2 (en) | 2012-04-09 | 2023-02-28 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11694944B1 (en) | 2012-04-09 | 2023-07-04 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US11735501B1 (en) | 2012-04-09 | 2023-08-22 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and a connective path |
US10600888B2 (en) | 2012-04-09 | 2020-03-24 | Monolithic 3D Inc. | 3D semiconductor device |
US11164811B2 (en) | 2012-04-09 | 2021-11-02 | Monolithic 3D Inc. | 3D semiconductor device with isolation layers and oxide-to-oxide bonding |
JP5947602B2 (ja) * | 2012-04-11 | 2016-07-06 | キヤノン株式会社 | 撮像装置 |
JPWO2013161944A1 (ja) * | 2012-04-25 | 2015-12-24 | 株式会社ニコン | 焦点検出装置、焦点調節装置およびカメラ |
US9288377B2 (en) | 2012-05-02 | 2016-03-15 | Semiconductor Components Industries, Llc | System and method for combining focus bracket images |
WO2013168493A1 (ja) * | 2012-05-10 | 2013-11-14 | 富士フイルム株式会社 | 信号処理装置、撮像装置、信号補正方法 |
KR20130134293A (ko) * | 2012-05-30 | 2013-12-10 | 삼성전자주식회사 | 이미지 센서, 이의 동작 방법, 및 이를 포함하는 시스템 |
JP6033038B2 (ja) * | 2012-10-26 | 2016-11-30 | キヤノン株式会社 | 焦点検出装置、撮像装置、撮像システム、および、焦点検出方法 |
JP6150497B2 (ja) * | 2012-11-12 | 2017-06-21 | キヤノン株式会社 | 検出装置、及び、プログラム |
US11916045B2 (en) | 2012-12-22 | 2024-02-27 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11309292B2 (en) | 2012-12-22 | 2022-04-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11018116B2 (en) | 2012-12-22 | 2021-05-25 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11784169B2 (en) | 2012-12-22 | 2023-10-10 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11961827B1 (en) | 2012-12-22 | 2024-04-16 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11063024B1 (en) | 2012-12-22 | 2021-07-13 | Monlithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US11217565B2 (en) | 2012-12-22 | 2022-01-04 | Monolithic 3D Inc. | Method to form a 3D semiconductor device and structure |
US12051674B2 (en) | 2012-12-22 | 2024-07-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11967583B2 (en) | 2012-12-22 | 2024-04-23 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US10600657B2 (en) | 2012-12-29 | 2020-03-24 | Monolithic 3D Inc | 3D semiconductor device and structure |
US10115663B2 (en) | 2012-12-29 | 2018-10-30 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11004694B1 (en) | 2012-12-29 | 2021-05-11 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10651054B2 (en) | 2012-12-29 | 2020-05-12 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11430667B2 (en) | 2012-12-29 | 2022-08-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11430668B2 (en) | 2012-12-29 | 2022-08-30 | Monolithic 3D Inc. | 3D semiconductor device and structure with bonding |
US11087995B1 (en) | 2012-12-29 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10903089B1 (en) | 2012-12-29 | 2021-01-26 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10892169B2 (en) | 2012-12-29 | 2021-01-12 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11177140B2 (en) | 2012-12-29 | 2021-11-16 | Monolithic 3D Inc. | 3D semiconductor device and structure |
JP5622975B1 (ja) * | 2013-01-10 | 2014-11-12 | オリンパスイメージング株式会社 | 撮像装置及び画像補正方法並びに画像処理装置及び画像処理方法 |
CN104995904B (zh) * | 2013-02-21 | 2018-04-27 | 富士胶片株式会社 | 摄像装置 |
US12094965B2 (en) | 2013-03-11 | 2024-09-17 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US10325651B2 (en) | 2013-03-11 | 2019-06-18 | Monolithic 3D Inc. | 3D semiconductor device with stacked memory |
US8902663B1 (en) | 2013-03-11 | 2014-12-02 | Monolithic 3D Inc. | Method of maintaining a memory state |
US11935949B1 (en) | 2013-03-11 | 2024-03-19 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US11869965B2 (en) | 2013-03-11 | 2024-01-09 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers and memory cells |
US11398569B2 (en) | 2013-03-12 | 2022-07-26 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10840239B2 (en) | 2014-08-26 | 2020-11-17 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US12100646B2 (en) | 2013-03-12 | 2024-09-24 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US11088130B2 (en) | 2014-01-28 | 2021-08-10 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11923374B2 (en) | 2013-03-12 | 2024-03-05 | Monolithic 3D Inc. | 3D semiconductor device and structure with metal layers |
US10224279B2 (en) | 2013-03-15 | 2019-03-05 | Monolithic 3D Inc. | Semiconductor device and structure |
US9021414B1 (en) | 2013-04-15 | 2015-04-28 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11341309B1 (en) | 2013-04-15 | 2022-05-24 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11574109B1 (en) | 2013-04-15 | 2023-02-07 | Monolithic 3D Inc | Automation methods for 3D integrated circuits and devices |
US11270055B1 (en) | 2013-04-15 | 2022-03-08 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11030371B2 (en) | 2013-04-15 | 2021-06-08 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11487928B2 (en) | 2013-04-15 | 2022-11-01 | Monolithic 3D Inc. | Automation for monolithic 3D devices |
US11720736B2 (en) | 2013-04-15 | 2023-08-08 | Monolithic 3D Inc. | Automation methods for 3D integrated circuits and devices |
JP6362060B2 (ja) * | 2013-07-01 | 2018-07-25 | キヤノン株式会社 | 撮像装置及びその制御方法ならびにプログラム |
JP5701942B2 (ja) * | 2013-07-10 | 2015-04-15 | オリンパス株式会社 | 撮像装置、カメラシステム及び画像処理方法 |
JP6372983B2 (ja) * | 2013-09-02 | 2018-08-15 | キヤノン株式会社 | 焦点検出装置およびその制御方法、撮像装置 |
JP6533360B2 (ja) * | 2013-10-30 | 2019-06-19 | キヤノン株式会社 | 位置検出装置及びそれを有するレンズ装置及び撮影装置 |
JP2015129846A (ja) * | 2014-01-07 | 2015-07-16 | キヤノン株式会社 | 撮像装置およびその制御方法 |
US11031394B1 (en) | 2014-01-28 | 2021-06-08 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US11107808B1 (en) | 2014-01-28 | 2021-08-31 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10297586B2 (en) | 2015-03-09 | 2019-05-21 | Monolithic 3D Inc. | Methods for processing a 3D semiconductor device |
US12094829B2 (en) | 2014-01-28 | 2024-09-17 | Monolithic 3D Inc. | 3D semiconductor device and structure |
JP6381266B2 (ja) * | 2014-04-15 | 2018-08-29 | キヤノン株式会社 | 撮像装置、制御装置、制御方法、プログラム、および、記憶媒体 |
JP2015212772A (ja) * | 2014-05-02 | 2015-11-26 | キヤノン株式会社 | 測距装置、撮像装置、測距方法、および測距パラメータ算出方法 |
US10830927B2 (en) * | 2014-05-06 | 2020-11-10 | Cognex Corporation | System and method for reduction of drift in a vision system variable lens |
JP6486041B2 (ja) * | 2014-09-11 | 2019-03-20 | キヤノン株式会社 | 撮像装置およびその制御方法 |
JP6506560B2 (ja) * | 2015-01-20 | 2019-04-24 | キヤノン株式会社 | フォーカス制御装置及びその方法、プログラム、記憶媒体 |
US11056468B1 (en) | 2015-04-19 | 2021-07-06 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10825779B2 (en) | 2015-04-19 | 2020-11-03 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US10381328B2 (en) | 2015-04-19 | 2019-08-13 | Monolithic 3D Inc. | Semiconductor device and structure |
US11011507B1 (en) | 2015-04-19 | 2021-05-18 | Monolithic 3D Inc. | 3D semiconductor device and structure |
JP6504969B2 (ja) * | 2015-08-19 | 2019-04-24 | キヤノン株式会社 | 撮像システム、撮像装置、レンズ装置、撮像システムの制御方法 |
US11956952B2 (en) | 2015-08-23 | 2024-04-09 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US11937422B2 (en) | 2015-11-07 | 2024-03-19 | Monolithic 3D Inc. | Semiconductor memory device and structure |
US11114427B2 (en) | 2015-11-07 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor processor and memory device and structure |
US11978731B2 (en) | 2015-09-21 | 2024-05-07 | Monolithic 3D Inc. | Method to produce a multi-level semiconductor memory device and structure |
CN115942752A (zh) | 2015-09-21 | 2023-04-07 | 莫诺利特斯3D有限公司 | 3d半导体器件和结构 |
US12100658B2 (en) | 2015-09-21 | 2024-09-24 | Monolithic 3D Inc. | Method to produce a 3D multilayer semiconductor device and structure |
US9420164B1 (en) | 2015-09-24 | 2016-08-16 | Qualcomm Incorporated | Phase detection autofocus noise reduction |
US9804357B2 (en) | 2015-09-25 | 2017-10-31 | Qualcomm Incorporated | Phase detection autofocus using masked and unmasked photodiodes |
US10522225B1 (en) | 2015-10-02 | 2019-12-31 | Monolithic 3D Inc. | Semiconductor device with non-volatile memory |
US11296115B1 (en) | 2015-10-24 | 2022-04-05 | Monolithic 3D Inc. | 3D semiconductor device and structure |
US12016181B2 (en) | 2015-10-24 | 2024-06-18 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US10847540B2 (en) | 2015-10-24 | 2020-11-24 | Monolithic 3D Inc. | 3D semiconductor memory device and structure |
US11991884B1 (en) | 2015-10-24 | 2024-05-21 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US10418369B2 (en) | 2015-10-24 | 2019-09-17 | Monolithic 3D Inc. | Multi-level semiconductor memory device and structure |
US12120880B1 (en) | 2015-10-24 | 2024-10-15 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US12035531B2 (en) | 2015-10-24 | 2024-07-09 | Monolithic 3D Inc. | 3D semiconductor device and structure with logic and memory |
US11114464B2 (en) | 2015-10-24 | 2021-09-07 | Monolithic 3D Inc. | 3D semiconductor device and structure |
KR102523643B1 (ko) | 2015-10-26 | 2023-04-20 | 삼성전자주식회사 | 이미지 신호 프로세서의 작동 방법과 상기 이미지 신호 프로세서를 포함하는 이미지 처리 시스템의 작동 방법 |
US9848118B2 (en) | 2016-03-11 | 2017-12-19 | Intel Corporation | Phase detection autofocus using opposing filter masks |
US9736355B1 (en) * | 2016-05-03 | 2017-08-15 | Mitutoyo Corporation | Phase difference calibration in a variable focal length lens system |
US10491799B2 (en) * | 2016-06-17 | 2019-11-26 | Canon Kabushiki Kaisha | Focus detection apparatus, focus control apparatus, image capturing apparatus, focus detection method, and storage medium |
US10015389B2 (en) * | 2016-09-22 | 2018-07-03 | Omnivision Technologies, Inc. | Image sensor with asymmetric-microlens phase-detection auto-focus (PDAF) detectors, associated PDAF imaging system, and associated method |
US11251149B2 (en) | 2016-10-10 | 2022-02-15 | Monolithic 3D Inc. | 3D memory device and structure |
US11329059B1 (en) | 2016-10-10 | 2022-05-10 | Monolithic 3D Inc. | 3D memory devices and structures with thinned single crystal substrates |
US11711928B2 (en) | 2016-10-10 | 2023-07-25 | Monolithic 3D Inc. | 3D memory devices and structures with control circuits |
US11930648B1 (en) | 2016-10-10 | 2024-03-12 | Monolithic 3D Inc. | 3D memory devices and structures with metal layers |
US11869591B2 (en) | 2016-10-10 | 2024-01-09 | Monolithic 3D Inc. | 3D memory devices and structures with control circuits |
US11812620B2 (en) | 2016-10-10 | 2023-11-07 | Monolithic 3D Inc. | 3D DRAM memory devices and structures with control circuits |
JP2018077190A (ja) * | 2016-11-11 | 2018-05-17 | 株式会社東芝 | 撮像装置及び自動制御システム |
CN108886592A (zh) * | 2017-11-29 | 2018-11-23 | 深圳市大疆创新科技有限公司 | 图像传感器、芯片、图像处理设备及相关方法 |
CN109788277B (zh) * | 2019-01-08 | 2020-08-04 | 浙江大华技术股份有限公司 | 防抖机芯的光轴偏差的补偿方法、装置和存储介质 |
US11296106B2 (en) | 2019-04-08 | 2022-04-05 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US10892016B1 (en) | 2019-04-08 | 2021-01-12 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11763864B2 (en) | 2019-04-08 | 2023-09-19 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures with bit-line pillars |
US11018156B2 (en) | 2019-04-08 | 2021-05-25 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
US11158652B1 (en) | 2019-04-08 | 2021-10-26 | Monolithic 3D Inc. | 3D memory semiconductor devices and structures |
WO2020213595A1 (ja) * | 2019-04-18 | 2020-10-22 | ソニー株式会社 | 交換レンズ、情報処理装置、情報処理方法、及び、プログラム |
JP7292123B2 (ja) * | 2019-06-20 | 2023-06-16 | キヤノン株式会社 | 撮像装置及びその制御方法、プログラム、記憶媒体 |
US11314150B2 (en) * | 2020-01-08 | 2022-04-26 | Qualcomm Incorporated | Phase detection autofocus (PDAF) optical system |
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KR102148127B1 (ko) * | 2020-02-14 | 2020-08-26 | 재단법인 다차원 스마트 아이티 융합시스템 연구단 | 상보적인 픽슬렛 구조가 적용된 카메라 시스템 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02181108A (ja) * | 1989-05-02 | 1990-07-13 | Olympus Optical Co Ltd | 焦点検出装置の調整方法 |
JPH03214133A (ja) * | 1990-01-18 | 1991-09-19 | Nikon Corp | 焦点検出装置 |
JP2007121896A (ja) * | 2005-10-31 | 2007-05-17 | Nikon Corp | 焦点検出装置および光学システム |
JP2007189312A (ja) * | 2006-01-11 | 2007-07-26 | Nikon Corp | 撮像装置、撮像方法およびカメラ |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0756530B2 (ja) * | 1986-03-31 | 1995-06-14 | 株式会社ニコン | 撮影レンズ鏡筒およびカメラ |
JPS6479714A (en) | 1987-09-21 | 1989-03-24 | Fuji Photo Film Co Ltd | Automatic focusing device |
JPH0789174B2 (ja) | 1987-09-21 | 1995-09-27 | 富士写真フイルム株式会社 | 自動焦点調節装置 |
US4908643A (en) * | 1987-09-21 | 1990-03-13 | Fuji Photo Film Co., Ltd. | Automatic focussing adjusting device |
JP3592147B2 (ja) | 1998-08-20 | 2004-11-24 | キヤノン株式会社 | 固体撮像装置 |
JP5002086B2 (ja) * | 1999-10-28 | 2012-08-15 | キヤノン株式会社 | 焦点検出装置と撮像装置 |
US6813442B2 (en) * | 2000-06-08 | 2004-11-02 | Canon Kabushiki Kaisha | Autofocus system and camera system |
JP2002131623A (ja) | 2000-10-24 | 2002-05-09 | Canon Inc | 撮像装置及び撮像システム |
JP4500434B2 (ja) * | 2000-11-28 | 2010-07-14 | キヤノン株式会社 | 撮像装置及び撮像システム、並びに撮像方法 |
JP2004191629A (ja) * | 2002-12-11 | 2004-07-08 | Canon Inc | 焦点検出装置 |
JP2005148091A (ja) | 2003-11-11 | 2005-06-09 | Canon Inc | 光学機器 |
US7745772B2 (en) * | 2005-05-30 | 2010-06-29 | Nikon Corporation | Image forming state detection device |
JP4014612B2 (ja) | 2005-11-09 | 2007-11-28 | シャープ株式会社 | 周辺光量補正装置、周辺光量補正方法、電子情報機器、制御プログラムおよび可読記録媒体 |
JP4910366B2 (ja) | 2005-11-09 | 2012-04-04 | 株式会社ニコン | 焦点検出装置、光学システムおよび焦点検出方法 |
US7751700B2 (en) * | 2006-03-01 | 2010-07-06 | Nikon Corporation | Focus adjustment device, imaging device and focus adjustment method |
US7792420B2 (en) * | 2006-03-01 | 2010-09-07 | Nikon Corporation | Focus adjustment device, imaging device and focus adjustment method |
JP4857877B2 (ja) * | 2006-04-11 | 2012-01-18 | 株式会社ニコン | 撮像装置およびカメラ |
JP4946313B2 (ja) * | 2006-09-27 | 2012-06-06 | 株式会社ニコン | 撮像装置 |
JP5458475B2 (ja) * | 2007-04-18 | 2014-04-02 | 株式会社ニコン | 焦点検出装置および撮像装置 |
US8680451B2 (en) * | 2007-10-02 | 2014-03-25 | Nikon Corporation | Light receiving device, focus detection device and imaging device |
US7978255B2 (en) * | 2007-10-11 | 2011-07-12 | Nikon Corporation | Solid-state image sensor and image-capturing device |
JP2009115893A (ja) * | 2007-11-02 | 2009-05-28 | Canon Inc | 撮像装置 |
US8077233B2 (en) * | 2008-02-22 | 2011-12-13 | Panasonic Corporation | Imaging apparatus |
JP5169499B2 (ja) * | 2008-06-02 | 2013-03-27 | 株式会社ニコン | 撮像素子および撮像装置 |
JP5317562B2 (ja) * | 2008-07-17 | 2013-10-16 | キヤノン株式会社 | 位相差検出装置、撮像装置、位相差検出方法、位相差検出プログラム |
CN102227665B (zh) * | 2008-11-27 | 2015-02-25 | 佳能株式会社 | 固态摄像元件和摄像设备 |
US8558940B2 (en) * | 2008-11-27 | 2013-10-15 | Nikon Corporation | Image sensor and image-capturing device |
JP5476716B2 (ja) * | 2009-01-08 | 2014-04-23 | ソニー株式会社 | 撮像素子および撮像装置 |
JP5212396B2 (ja) * | 2010-02-10 | 2013-06-19 | 株式会社ニコン | 焦点検出装置 |
JP5967950B2 (ja) * | 2011-04-20 | 2016-08-10 | キヤノン株式会社 | 撮像素子及び撮像装置 |
JP5956782B2 (ja) * | 2011-05-26 | 2016-07-27 | キヤノン株式会社 | 撮像素子及び撮像装置 |
US20140375852A1 (en) * | 2013-06-20 | 2014-12-25 | Canon Kabushiki Kaisha | Solid-state imaging apparatus, method of manufacturing the same, camera, imaging device, and imaging apparatus |
-
2008
- 2008-08-25 JP JP2008215918A patent/JP5161702B2/ja not_active Expired - Fee Related
-
2009
- 2009-08-11 US US12/539,260 patent/US8405760B2/en not_active Expired - Fee Related
- 2009-08-24 EP EP09168519.8A patent/EP2169459B1/en not_active Not-in-force
- 2009-08-24 EP EP18159802.0A patent/EP3396449A1/en not_active Withdrawn
- 2009-08-24 EP EP14178618.6A patent/EP2811340B1/en not_active Not-in-force
- 2009-08-24 EP EP22157059.1A patent/EP4047416A3/en active Pending
- 2009-08-25 CN CN2009101693497A patent/CN101662588B/zh not_active Expired - Fee Related
-
2013
- 2013-02-28 US US13/780,505 patent/US8767118B2/en not_active Expired - Fee Related
-
2014
- 2014-05-16 US US14/279,546 patent/US9560258B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02181108A (ja) * | 1989-05-02 | 1990-07-13 | Olympus Optical Co Ltd | 焦点検出装置の調整方法 |
JPH03214133A (ja) * | 1990-01-18 | 1991-09-19 | Nikon Corp | 焦点検出装置 |
JP2007121896A (ja) * | 2005-10-31 | 2007-05-17 | Nikon Corp | 焦点検出装置および光学システム |
JP2007189312A (ja) * | 2006-01-11 | 2007-07-26 | Nikon Corp | 撮像装置、撮像方法およびカメラ |
Cited By (36)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011126103A1 (en) * | 2010-04-08 | 2011-10-13 | Sony Corporation | Image pickup apparatus, solid-state image pickup device, and image pickup method |
US9172865B2 (en) | 2010-04-08 | 2015-10-27 | Sony Corporation | Image pickup apparatus, solid-state image pickup device, and image pickup method |
US10021327B2 (en) | 2010-04-08 | 2018-07-10 | Sony Corporation | Image pickup apparatus, solid-state image pickup device, and image pickup method |
US9565382B2 (en) | 2010-04-08 | 2017-02-07 | Sony Corporation | Image pickup apparatus, solid-state image pickup device, and image pickup method |
JP2011221253A (ja) * | 2010-04-08 | 2011-11-04 | Sony Corp | 撮像装置、固体撮像素子、撮像方法およびプログラム |
US9451158B2 (en) | 2010-04-08 | 2016-09-20 | Sony Corporation | Image pickup apparatus, solid-state image pickup device, and image pickup method |
US8953085B2 (en) | 2010-04-08 | 2015-02-10 | Sony Corporation | Image pickup apparatus, solid-state image pickup device, and image pickup method |
KR101846586B1 (ko) * | 2010-04-08 | 2018-04-06 | 소니 주식회사 | 촬상 장치, 고체 촬상 소자, 및 촬상 방법 |
JP2012004729A (ja) * | 2010-06-15 | 2012-01-05 | Fujifilm Corp | 撮像装置及び画像処理方法 |
JP2012088436A (ja) * | 2010-10-18 | 2012-05-10 | Nikon Corp | 焦点検出装置 |
US9215389B2 (en) | 2011-05-16 | 2015-12-15 | Samsung Electronics Co., Ltd. | Image pickup device, digital photographing apparatus using the image pickup device, auto-focusing method, and computer-readable medium for performing the auto-focusing method |
JP2013021615A (ja) * | 2011-07-13 | 2013-01-31 | Olympus Imaging Corp | 撮像装置 |
JP2013186201A (ja) * | 2012-03-06 | 2013-09-19 | Canon Inc | 撮像装置 |
JP2014029393A (ja) * | 2012-07-31 | 2014-02-13 | Canon Inc | 距離検出装置 |
JP2014086471A (ja) * | 2012-10-19 | 2014-05-12 | Canon Inc | 撮像素子及び撮像装置 |
WO2014196160A1 (en) | 2013-06-04 | 2014-12-11 | Sony Corporation | Solid-state imaging device, electronic apparatus, lens control method, and imaging module |
JP2015069180A (ja) * | 2013-09-30 | 2015-04-13 | オリンパス株式会社 | カメラシステム及び焦点検出画素の補正方法 |
WO2015046246A1 (ja) * | 2013-09-30 | 2015-04-02 | オリンパス株式会社 | カメラシステム及び焦点検出画素の補正方法 |
US9509899B2 (en) | 2013-09-30 | 2016-11-29 | Olympus Corporation | Camera system and method for correcting focus detection pixel |
WO2016035566A1 (ja) * | 2014-09-01 | 2016-03-10 | ソニー株式会社 | 固体撮像素子及びその信号処理方法、並びに電子機器 |
US9918031B2 (en) | 2014-09-01 | 2018-03-13 | Sony Corporation | Solid-state imaging device and electronic apparatus having a pixel unit with one microlens and a correction circuit |
US11770639B2 (en) | 2014-09-01 | 2023-09-26 | Sony Group Corporation | Solid-state imaging device, signal processing method therefor, and electronic apparatus for enabling sensitivity correction |
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US11606495B2 (en) | 2015-07-31 | 2023-03-14 | Sony Corporation | Control device, control method, and electronic device |
US10681265B2 (en) | 2015-07-31 | 2020-06-09 | Sony Corporation | Control device, control method and electronic device |
JP2017054052A (ja) * | 2015-09-11 | 2017-03-16 | キヤノン株式会社 | 制御装置、撮像装置、制御方法、プログラム、および、記憶媒体 |
JP2018107460A (ja) * | 2018-02-02 | 2018-07-05 | キヤノン株式会社 | 撮像素子及び撮像装置 |
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US12078867B2 (en) | 2018-07-20 | 2024-09-03 | Nikon Corporation | Focus detection device, image sensor, and interchangeable lens |
US11934037B2 (en) | 2020-04-27 | 2024-03-19 | Zhejiang Sunny Optics Co., Ltd. | Camera lens group |
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CN101662588A (zh) | 2010-03-03 |
EP2811340B1 (en) | 2018-10-24 |
EP2169459B1 (en) | 2014-10-08 |
EP3396449A1 (en) | 2018-10-31 |
EP4047416A2 (en) | 2022-08-24 |
CN101662588B (zh) | 2012-07-04 |
US8405760B2 (en) | 2013-03-26 |
US20100045849A1 (en) | 2010-02-25 |
US9560258B2 (en) | 2017-01-31 |
US20140247385A1 (en) | 2014-09-04 |
US20130169858A1 (en) | 2013-07-04 |
EP2169459A3 (en) | 2011-04-06 |
EP2811340A1 (en) | 2014-12-10 |
EP2169459A2 (en) | 2010-03-31 |
JP5161702B2 (ja) | 2013-03-13 |
US8767118B2 (en) | 2014-07-01 |
EP4047416A3 (en) | 2022-12-28 |
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