JP2009545159A5 - - Google Patents

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Publication number
JP2009545159A5
JP2009545159A5 JP2009521753A JP2009521753A JP2009545159A5 JP 2009545159 A5 JP2009545159 A5 JP 2009545159A5 JP 2009521753 A JP2009521753 A JP 2009521753A JP 2009521753 A JP2009521753 A JP 2009521753A JP 2009545159 A5 JP2009545159 A5 JP 2009545159A5
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JP
Japan
Prior art keywords
chemical mechanical
mechanical polishing
polishing composition
composition according
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009521753A
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English (en)
Japanese (ja)
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JP2009545159A (ja
Filing date
Publication date
Priority claimed from US11/491,612 external-priority patent/US20080020680A1/en
Application filed filed Critical
Publication of JP2009545159A publication Critical patent/JP2009545159A/ja
Publication of JP2009545159A5 publication Critical patent/JP2009545159A5/ja
Pending legal-status Critical Current

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JP2009521753A 2006-07-24 2007-07-12 除去速度の高い誘電体膜のためのｃｍｐ組成物 Pending JP2009545159A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/491,612 US20080020680A1 (en) 2006-07-24 2006-07-24 Rate-enhanced CMP compositions for dielectric films
PCT/US2007/015872 WO2008013678A1 (en) 2006-07-24 2007-07-12 Rate-enhanced cmp compositions for dielectric films

Publications (2)

Publication Number Publication Date
JP2009545159A JP2009545159A (ja) 2009-12-17
JP2009545159A5 true JP2009545159A5 (enExample) 2010-08-26

Family

ID=38972027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009521753A Pending JP2009545159A (ja) 2006-07-24 2007-07-12 除去速度の高い誘電体膜のためのｃｍｐ組成物

Country Status (10)

Country Link
US (1) US20080020680A1 (enExample)
EP (1) EP2052049A4 (enExample)
JP (1) JP2009545159A (enExample)
KR (1) KR101325333B1 (enExample)
CN (2) CN101490203A (enExample)
IL (1) IL196220A (enExample)
MY (1) MY155014A (enExample)
SG (1) SG174001A1 (enExample)
TW (1) TWI462999B (enExample)
WO (1) WO2008013678A1 (enExample)

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JP2012510161A (ja) * 2008-11-26 2012-04-26 アプライド マテリアルズ インコーポレイテッド 化学機械研磨のための終点制御を伴う化学薬品および研磨剤粒子の二系統混合
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JP5518523B2 (ja) * 2010-02-25 2014-06-11 富士フイルム株式会社 化学的機械的研磨液及び研磨方法
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US9275899B2 (en) 2014-06-27 2016-03-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and method for polishing tungsten
US10570313B2 (en) 2015-02-12 2020-02-25 Versum Materials Us, Llc Dishing reducing in tungsten chemical mechanical polishing
JP6730859B2 (ja) * 2015-07-15 2020-07-29 株式会社フジミインコーポレーテッド 研磨用組成物および磁気ディスク基板製造方法
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US10683439B2 (en) * 2018-03-15 2020-06-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing composition and method of polishing a substrate having enhanced defect inhibition
JP7222750B2 (ja) * 2019-02-14 2023-02-15 ニッタ・デュポン株式会社 研磨用組成物
JP2020203980A (ja) * 2019-06-17 2020-12-24 日本キャボット・マイクロエレクトロニクス株式会社 化学機械研磨組成物、リンス組成物、化学機械研磨方法及びリンス方法
US12291655B2 (en) * 2021-04-27 2025-05-06 DuPont Electronic Materials Holding, Inc. Polishing composition and method of polishing a substrate having enhanced defect reduction

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