JP2006287207A5 - - Google Patents
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- Publication number
- JP2006287207A5 JP2006287207A5 JP2006048946A JP2006048946A JP2006287207A5 JP 2006287207 A5 JP2006287207 A5 JP 2006287207A5 JP 2006048946 A JP2006048946 A JP 2006048946A JP 2006048946 A JP2006048946 A JP 2006048946A JP 2006287207 A5 JP2006287207 A5 JP 2006287207A5
- Authority
- JP
- Japan
- Prior art keywords
- aqueous dispersion
- chemical mechanical
- mechanical polishing
- liquid
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims 28
- 239000006185 dispersion Substances 0.000 claims 23
- 239000000126 substance Substances 0.000 claims 22
- 239000007788 liquid Substances 0.000 claims 16
- 238000002156 mixing Methods 0.000 claims 10
- 239000006061 abrasive grain Substances 0.000 claims 9
- 150000007524 organic acids Chemical class 0.000 claims 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 8
- 239000007800 oxidant agent Substances 0.000 claims 7
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims 6
- 239000012964 benzotriazole Substances 0.000 claims 6
- 229920000193 polymethacrylate Polymers 0.000 claims 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims 3
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims 3
- 229910052802 copper Inorganic materials 0.000 claims 3
- 239000010949 copper Substances 0.000 claims 3
- GJAWHXHKYYXBSV-UHFFFAOYSA-N quinolinic acid Chemical compound OC(=O)C1=CC=CN=C1C(O)=O GJAWHXHKYYXBSV-UHFFFAOYSA-N 0.000 claims 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical group OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 230000004888 barrier function Effects 0.000 claims 2
- 239000010954 inorganic particle Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- LOAUVZALPPNFOQ-UHFFFAOYSA-N quinaldic acid Chemical compound C1=CC=CC2=NC(C(=O)O)=CC=C21 LOAUVZALPPNFOQ-UHFFFAOYSA-N 0.000 claims 2
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims 1
- 229920002125 Sokalan® Polymers 0.000 claims 1
- 239000002253 acid Substances 0.000 claims 1
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims 1
- 150000003863 ammonium salts Chemical class 0.000 claims 1
- 239000011246 composite particle Substances 0.000 claims 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 1
- 239000011976 maleic acid Substances 0.000 claims 1
- 239000001630 malic acid Substances 0.000 claims 1
- 235000011090 malic acid Nutrition 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000011146 organic particle Substances 0.000 claims 1
- 239000004584 polyacrylic acid Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006048946A JP5110244B2 (ja) | 2005-03-09 | 2006-02-24 | 化学機械研磨用水系分散体および化学機械研磨方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005064754 | 2005-03-09 | ||
| JP2005064754 | 2005-03-09 | ||
| JP2006048946A JP5110244B2 (ja) | 2005-03-09 | 2006-02-24 | 化学機械研磨用水系分散体および化学機械研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006287207A JP2006287207A (ja) | 2006-10-19 |
| JP2006287207A5 true JP2006287207A5 (enExample) | 2006-12-14 |
| JP5110244B2 JP5110244B2 (ja) | 2012-12-26 |
Family
ID=37408713
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006048946A Expired - Fee Related JP5110244B2 (ja) | 2005-03-09 | 2006-02-24 | 化学機械研磨用水系分散体および化学機械研磨方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5110244B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8791019B2 (en) | 2005-12-27 | 2014-07-29 | Hitachi Chemical Company, Ltd. | Metal polishing slurry and method of polishing a film to be polished |
| JP2008205433A (ja) * | 2007-01-25 | 2008-09-04 | Jsr Corp | 電気光学表示装置用基板に設けられたバリアメタル層を研磨するための化学機械研磨用水系分散体および該化学機械研磨用水系分散体を調製するためのキット、ならびに化学機械研磨方法 |
| JP5327427B2 (ja) | 2007-06-19 | 2013-10-30 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体調製用セット、化学機械研磨用水系分散体の調製方法、化学機械研磨用水系分散体および化学機械研磨方法 |
| JPWO2009028256A1 (ja) * | 2007-08-31 | 2010-11-25 | Jsr株式会社 | 化学機械研磨用水系分散体調製用セットおよび化学機械研磨用水系分散体の調製方法 |
| JP2009065001A (ja) * | 2007-09-07 | 2009-03-26 | Jsr Corp | 化学機械研磨用水系分散体、該分散体を調製するためのキット、および化学機械研磨用水系分散体の調製方法 |
| JP2010161201A (ja) * | 2009-01-08 | 2010-07-22 | Jsr Corp | 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法、化学機械研磨用水系分散体の製造方法 |
| WO2013067696A1 (en) * | 2011-11-09 | 2013-05-16 | Rhodia (China) Co., Ltd. | Additive mixture and composition and method for polishing glass substrates |
| SG10201604674VA (en) * | 2012-02-01 | 2016-07-28 | Hitachi Chemical Co Ltd | Polishing liquid for metal and polishing method |
| JP7731543B2 (ja) * | 2023-02-28 | 2025-09-01 | 熊本県 | 研磨加工物の製造方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3179064B2 (ja) * | 1999-01-18 | 2001-06-25 | 株式会社東京精密 | スラリーの供給装置 |
| JP2003133266A (ja) * | 2001-10-22 | 2003-05-09 | Sumitomo Bakelite Co Ltd | 研磨用組成物 |
| JP2003151927A (ja) * | 2001-11-12 | 2003-05-23 | Sumitomo Bakelite Co Ltd | 研磨用組成物 |
| ATE403936T1 (de) * | 2002-04-30 | 2008-08-15 | Hitachi Chemical Co Ltd | Polierfluid und polierverfahren |
| TWI282360B (en) * | 2002-06-03 | 2007-06-11 | Hitachi Chemical Co Ltd | Polishing composition and polishing method thereof |
| JP4070622B2 (ja) * | 2003-01-29 | 2008-04-02 | 富士フイルム株式会社 | 金属用研磨液及び研磨方法 |
| JP4649871B2 (ja) * | 2003-05-12 | 2011-03-16 | Ｊｓｒ株式会社 | 化学機械研磨剤キットを用いた化学機械研磨方法 |
| JP2005045229A (ja) * | 2003-07-04 | 2005-02-17 | Jsr Corp | 化学機械研磨用水系分散体および化学機械研磨方法 |
-
2006
- 2006-02-24 JP JP2006048946A patent/JP5110244B2/ja not_active Expired - Fee Related
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