JP2006019746A5 - - Google Patents
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- Publication number
- JP2006019746A5 JP2006019746A5 JP2005193258A JP2005193258A JP2006019746A5 JP 2006019746 A5 JP2006019746 A5 JP 2006019746A5 JP 2005193258 A JP2005193258 A JP 2005193258A JP 2005193258 A JP2005193258 A JP 2005193258A JP 2006019746 A5 JP2006019746 A5 JP 2006019746A5
- Authority
- JP
- Japan
- Prior art keywords
- gum
- acrylic acid
- acid
- methacrylic acid
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/882,567 US7384871B2 (en) | 2004-07-01 | 2004-07-01 | Chemical mechanical polishing compositions and methods relating thereto |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006019746A JP2006019746A (ja) | 2006-01-19 |
| JP2006019746A5 true JP2006019746A5 (enExample) | 2008-08-14 |
Family
ID=35512461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005193258A Pending JP2006019746A (ja) | 2004-07-01 | 2005-07-01 | ケミカルメカニカルポリッシング組成物及びそれに関連する方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7384871B2 (enExample) |
| JP (1) | JP2006019746A (enExample) |
| CN (1) | CN100355819C (enExample) |
| TW (1) | TWI394820B (enExample) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7435356B2 (en) * | 2004-11-24 | 2008-10-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Abrasive-free chemical mechanical polishing compositions and methods relating thereto |
| EP1879704A2 (en) * | 2005-04-15 | 2008-01-23 | Advanced Technology Materials, Inc. | Formulations for cleaning ion-implanted photoresist layers from microelectronic devices |
| JP2007088302A (ja) * | 2005-09-22 | 2007-04-05 | Fujifilm Corp | 金属用研磨液及び化学的機械的研磨方法 |
| KR100786949B1 (ko) | 2005-12-08 | 2007-12-17 | 주식회사 엘지화학 | 연마 선택도 조절 보조제 및 이를 함유한 ｃｍｐ 슬러리 |
| TW200801178A (en) * | 2006-03-22 | 2008-01-01 | Fujifilm Corp | Cleaning solution for substrate for use in semiconductor device and cleaning method using the same |
| US20100015807A1 (en) * | 2006-12-22 | 2010-01-21 | Techno Semichem Co., Ltd. | Chemical Mechanical Polishing Composition for Copper Comprising Zeolite |
| KR100949250B1 (ko) | 2007-10-10 | 2010-03-25 | 제일모직주식회사 | 금속 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법 |
| US20090215266A1 (en) * | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| US8734204B2 (en) * | 2008-04-15 | 2014-05-27 | Hitachi Chemical Company, Ltd. | Polishing solution for metal films and polishing method using the same |
| US8540893B2 (en) * | 2008-08-04 | 2013-09-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
| KR101674564B1 (ko) * | 2009-01-05 | 2016-11-09 | 에프엔에스테크 주식회사 | 다층 화학-기계적 평탄화 패드 |
| US8536106B2 (en) * | 2010-04-14 | 2013-09-17 | Ecolab Usa Inc. | Ferric hydroxycarboxylate as a builder |
| US8435896B2 (en) | 2011-03-03 | 2013-05-07 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable chemical mechanical polishing composition and methods relating thereto |
| US8440097B2 (en) | 2011-03-03 | 2013-05-14 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition |
| JP6029895B2 (ja) * | 2012-08-31 | 2016-11-24 | 株式会社フジミインコーポレーテッド | 研磨用組成物及び基板の製造方法 |
| US9299585B2 (en) | 2014-07-28 | 2016-03-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Method for chemical mechanical polishing substrates containing ruthenium and copper |
| KR20190057084A (ko) * | 2016-09-29 | 2019-05-27 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 텅스텐을 위한 화학 기계적 연마 방법 |
| WO2018058396A1 (en) * | 2016-09-29 | 2018-04-05 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method for tungsten |
| KR20190057330A (ko) * | 2016-09-29 | 2019-05-28 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 텅스텐의 화학 기계적 연마 방법 |
| KR102679492B1 (ko) * | 2018-11-15 | 2024-07-01 | 솔브레인 주식회사 | 연마 첨가제 조성물, 연마 슬러리 조성물 및 반도체 소자의 절연막의 연마 방법 |
| US20230027528A1 (en) * | 2020-12-10 | 2023-01-26 | Hitachi High-Tech Corporation | Semiconductor manufacturing method and semiconductor manufacturing apparatus |
| CN114561187B (zh) * | 2022-03-07 | 2022-10-21 | 山东麦丰新材料科技股份有限公司 | 一种环保型乳化精磨液及其制备方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3371775B2 (ja) * | 1997-10-31 | 2003-01-27 | 株式会社日立製作所 | 研磨方法 |
| US6432828B2 (en) * | 1998-03-18 | 2002-08-13 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| JP2002517593A (ja) | 1998-06-10 | 2002-06-18 | ロデール ホールディングス インコーポレイテッド | 金属ｃｍｐにおける研磨用組成物および研磨方法 |
| JP4095731B2 (ja) * | 1998-11-09 | 2008-06-04 | 株式会社ルネサステクノロジ | 半導体装置の製造方法及び半導体装置 |
| JP4538109B2 (ja) * | 1999-02-18 | 2010-09-08 | 株式会社トッパンＴｄｋレーベル | 化学機械研磨組成物 |
| TW501197B (en) | 1999-08-17 | 2002-09-01 | Hitachi Chemical Co Ltd | Polishing compound for chemical mechanical polishing and method for polishing substrate |
| JP4832690B2 (ja) | 1999-08-24 | 2011-12-07 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 絶縁体及び金属のｃｍｐ用組成物及びそれに関する方法 |
| US7232529B1 (en) | 1999-08-26 | 2007-06-19 | Hitachi Chemical Company, Ltd. | Polishing compound for chemimechanical polishing and polishing method |
| JP2002050595A (ja) * | 2000-08-04 | 2002-02-15 | Hitachi Ltd | 研磨方法、配線形成方法及び半導体装置の製造方法 |
| US6605537B2 (en) * | 2000-10-27 | 2003-08-12 | Rodel Holdings, Inc. | Polishing of metal substrates |
| US6936541B2 (en) * | 2000-09-20 | 2005-08-30 | Rohn And Haas Electronic Materials Cmp Holdings, Inc. | Method for planarizing metal interconnects |
| JP4951808B2 (ja) * | 2000-10-26 | 2012-06-13 | 日立化成工業株式会社 | 金属用研磨液及び研磨方法 |
| JP3768402B2 (ja) * | 2000-11-24 | 2006-04-19 | Ｎｅｃエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
| KR20040002907A (ko) * | 2001-04-12 | 2004-01-07 | 로델 홀딩스 인코포레이티드 | 계면활성제를 갖는 연마 조성물 |
| US6632259B2 (en) * | 2001-05-18 | 2003-10-14 | Rodel Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| JP2003068683A (ja) * | 2001-08-22 | 2003-03-07 | Hitachi Chem Co Ltd | 金属用研磨液及び研磨方法 |
| EP1490897B1 (en) * | 2002-03-25 | 2007-01-31 | Rohm and Haas Electronic Materials CMP Holdings, Inc. | Tantalum barrier removal solution |
| US20030219982A1 (en) * | 2002-05-23 | 2003-11-27 | Hitachi Chemical Co., Ltd | CMP (chemical mechanical polishing) polishing liquid for metal and polishing method |
| US7736405B2 (en) * | 2003-05-12 | 2010-06-15 | Advanced Technology Materials, Inc. | Chemical mechanical polishing compositions for copper and associated materials and method of using same |
| US20050104048A1 (en) * | 2003-11-13 | 2005-05-19 | Thomas Terence M. | Compositions and methods for polishing copper |
| US20050136671A1 (en) * | 2003-12-22 | 2005-06-23 | Goldberg Wendy B. | Compositions and methods for low downforce pressure polishing of copper |
-
2004
- 2004-07-01 US US10/882,567 patent/US7384871B2/en not_active Expired - Lifetime
-
2005
- 2005-06-24 CN CNB2005100823705A patent/CN100355819C/zh not_active Expired - Fee Related
- 2005-06-24 TW TW094121113A patent/TWI394820B/zh not_active IP Right Cessation
- 2005-07-01 JP JP2005193258A patent/JP2006019746A/ja active Pending