JP2005502188A5 - - Google Patents

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Publication number
JP2005502188A5
JP2005502188A5 JP2002592420A JP2002592420A JP2005502188A5 JP 2005502188 A5 JP2005502188 A5 JP 2005502188A5 JP 2002592420 A JP2002592420 A JP 2002592420A JP 2002592420 A JP2002592420 A JP 2002592420A JP 2005502188 A5 JP2005502188 A5 JP 2005502188A5
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JP
Japan
Prior art keywords
polishing composition
copolymer
metal
polishing
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002592420A
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English (en)
Japanese (ja)
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JP2005502188A (ja
Filing date
Publication date
Priority claimed from US09/860,933 external-priority patent/US6632259B2/en
Application filed filed Critical
Publication of JP2005502188A publication Critical patent/JP2005502188A/ja
Publication of JP2005502188A5 publication Critical patent/JP2005502188A5/ja
Withdrawn legal-status Critical Current

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JP2002592420A 2001-05-18 2002-05-17 ケミカルメカニカル研磨組成物およびそれに関する方法 Withdrawn JP2005502188A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/860,933 US6632259B2 (en) 2001-05-18 2001-05-18 Chemical mechanical polishing compositions and methods relating thereto
PCT/US2002/015825 WO2002094957A2 (en) 2001-05-18 2002-05-17 Chemical mechanical polishing compositions and methods relating thereto

Publications (2)

Publication Number Publication Date
JP2005502188A JP2005502188A (ja) 2005-01-20
JP2005502188A5 true JP2005502188A5 (enExample) 2005-08-25

Family

ID=25334410

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002592420A Withdrawn JP2005502188A (ja) 2001-05-18 2002-05-17 ケミカルメカニカル研磨組成物およびそれに関する方法

Country Status (7)

Country Link
US (4) US6632259B2 (enExample)
EP (1) EP1399517A2 (enExample)
JP (1) JP2005502188A (enExample)
KR (1) KR20040002972A (enExample)
CN (1) CN1261511C (enExample)
TW (1) TWI241328B (enExample)
WO (1) WO2002094957A2 (enExample)

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US7311856B2 (en) * 2005-03-30 2007-12-25 Cabot Microelectronics Corporation Polymeric inhibitors for enhanced planarization
WO2006125462A1 (en) * 2005-05-25 2006-11-30 Freescale Semiconductor, Inc Cleaning solution for a semiconductor wafer
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WO2007038399A2 (en) * 2005-09-26 2007-04-05 Cabot Microelectronics Corporation Metal cations for initiating chemical mechanical polishing
US20070075042A1 (en) * 2005-10-05 2007-04-05 Siddiqui Junaid A Stabilizer-Fenton's reaction metal-vinyl pyridine polymer-surface-modified chemical mechanical planarization composition and associated method
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KR101260597B1 (ko) * 2005-12-27 2013-05-06 히타치가세이가부시끼가이샤 금속용 연마액 및 피연마막의 연마 방법
EP1813641B1 (en) * 2006-01-30 2016-12-14 Imec A method for improving mechanical properties of polymer particles and its applications
US8524111B2 (en) 2006-01-31 2013-09-03 Hitachi Chemical Company, Ltd. CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method
US7824568B2 (en) * 2006-08-17 2010-11-02 International Business Machines Corporation Solution for forming polishing slurry, polishing slurry and related methods
US20100273330A1 (en) * 2006-08-23 2010-10-28 Citibank N.A. As Collateral Agent Rinse formulation for use in the manufacture of an integrated circuit
US7892071B2 (en) * 2006-09-29 2011-02-22 Depuy Products, Inc. Orthopaedic component manufacturing method and equipment
CN101689494B (zh) * 2007-07-05 2013-09-25 日立化成株式会社 金属膜用研磨液及研磨方法
KR100949250B1 (ko) 2007-10-10 2010-03-25 제일모직주식회사 금속 ｃｍｐ 슬러리 조성물 및 이를 이용한 연마 방법
JP2009123880A (ja) 2007-11-14 2009-06-04 Showa Denko Kk 研磨組成物
US20090215266A1 (en) * 2008-02-22 2009-08-27 Thomas Terence M Polishing Copper-Containing patterned wafers
EP2273537A4 (en) 2008-04-15 2012-07-25 Hitachi Chemical Co Ltd POLISHING SOLUTION FOR METALLIC FILMS AND METHOD OF POLISHING USING THE SAME
US8540893B2 (en) 2008-08-04 2013-09-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing composition and methods relating thereto
CN102245724A (zh) * 2008-12-19 2011-11-16 安集微电子（上海）有限公司 一种化学机械抛光液
JP5940270B2 (ja) * 2010-12-09 2016-06-29 花王株式会社 研磨液組成物
US8440097B2 (en) 2011-03-03 2013-05-14 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable, water soluble cellulose free chemical mechanical polishing composition
US8435896B2 (en) 2011-03-03 2013-05-07 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Stable, concentratable chemical mechanical polishing composition and methods relating thereto
JP6425303B2 (ja) * 2014-10-27 2018-11-21 花王株式会社 研磨液組成物
US10253216B2 (en) 2016-07-01 2019-04-09 Versum Materials Us, Llc Additives for barrier chemical mechanical planarization
US10600655B2 (en) 2017-08-10 2020-03-24 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method for tungsten
EP4330338A4 (en) * 2021-04-26 2025-08-13 Chempower Corp PAD SURFACE REGENERATION AND METAL RECOVERY
CN115011258A (zh) * 2022-07-20 2022-09-06 黄河三角洲京博化工研究院有限公司 一种双组份型抛光液及其制备方法，以及硅片抛光方法
US20240391050A1 (en) * 2023-05-24 2024-11-28 Chempower Corporation Pads for chemical planarization

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US6632259B2 (en) * 2001-05-18 2003-10-14 Rodel Holdings, Inc. Chemical mechanical polishing compositions and methods relating thereto

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