JP2006165541A5 - - Google Patents
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- Publication number
- JP2006165541A5 JP2006165541A5 JP2005338383A JP2005338383A JP2006165541A5 JP 2006165541 A5 JP2006165541 A5 JP 2006165541A5 JP 2005338383 A JP2005338383 A JP 2005338383A JP 2005338383 A JP2005338383 A JP 2005338383A JP 2006165541 A5 JP2006165541 A5 JP 2006165541A5
- Authority
- JP
- Japan
- Prior art keywords
- weight
- acid
- amphiphilic polymer
- copolymer
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 phosphorus compound Chemical class 0.000 claims 6
- 239000002184 metal Substances 0.000 claims 5
- 229910052751 metal Inorganic materials 0.000 claims 5
- 229920000642 polymer Polymers 0.000 claims 5
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 claims 4
- 229920002125 Sokalan® Polymers 0.000 claims 4
- 230000002209 hydrophobic effect Effects 0.000 claims 4
- 239000004584 polyacrylic acid Substances 0.000 claims 4
- 229920002845 Poly(methacrylic acid) Polymers 0.000 claims 3
- 125000000129 anionic group Chemical group 0.000 claims 2
- 125000004432 carbon atom Chemical group C* 0.000 claims 2
- 229920002678 cellulose Polymers 0.000 claims 2
- 239000001913 cellulose Substances 0.000 claims 2
- 229920001577 copolymer Polymers 0.000 claims 2
- 239000003112 inhibitor Substances 0.000 claims 2
- 229920003145 methacrylic acid copolymer Polymers 0.000 claims 2
- 239000007800 oxidant agent Substances 0.000 claims 2
- 229910052698 phosphorus Inorganic materials 0.000 claims 2
- 239000011574 phosphorus Substances 0.000 claims 2
- 238000005498 polishing Methods 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000126 substance Substances 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims 1
- 239000003795 chemical substances by application Substances 0.000 claims 1
- 150000002500 ions Chemical class 0.000 claims 1
- 229940117841 methacrylic acid copolymer Drugs 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/996,689 | 2004-11-24 | ||
| US10/996,689 US7435356B2 (en) | 2004-11-24 | 2004-11-24 | Abrasive-free chemical mechanical polishing compositions and methods relating thereto |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006165541A JP2006165541A (ja) | 2006-06-22 |
| JP2006165541A5 true JP2006165541A5 (enExample) | 2009-01-08 |
| JP5091400B2 JP5091400B2 (ja) | 2012-12-05 |
Family
ID=36461468
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005338383A Expired - Lifetime JP5091400B2 (ja) | 2004-11-24 | 2005-11-24 | 無砥粒ケミカルメカニカルポリッシング組成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7435356B2 (enExample) |
| JP (1) | JP5091400B2 (enExample) |
| KR (1) | KR101101169B1 (enExample) |
| CN (1) | CN100362068C (enExample) |
| SG (1) | SG122919A1 (enExample) |
| TW (1) | TWI359860B (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100597449B1 (ko) * | 1998-12-28 | 2006-07-06 | 히다치 가세고교 가부시끼가이샤 | 금속용 연마액 재료, 금속용 연마액, 그 제조방법 및그것을 사용한 연마방법 |
| KR20100051839A (ko) * | 2007-08-02 | 2010-05-18 | 어드밴스드 테크놀러지 머티리얼즈, 인코포레이티드 | 마이크로전자 장치로부터 잔사를 제거하기 위한 플루오라이드 비-함유 조성물 |
| US20090215266A1 (en) * | 2008-02-22 | 2009-08-27 | Thomas Terence M | Polishing Copper-Containing patterned wafers |
| US8540893B2 (en) * | 2008-08-04 | 2013-09-24 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing composition and methods relating thereto |
| CN101333419B (zh) * | 2008-08-05 | 2011-06-29 | 清华大学 | 一种集成电路铜布线的无磨粒化学机械抛光液 |
| US20110073800A1 (en) * | 2009-09-25 | 2011-03-31 | Hongyu Wang | Abrasive-free chemical mechanical polishing compositions |
| US20120319033A1 (en) * | 2010-02-15 | 2012-12-20 | Mitsubishi Gas Chemical Company, Inc. | Etching solution for multilayer thin film having copper layer and molybdenum layer contained therein |
| KR101439995B1 (ko) | 2010-04-30 | 2014-09-12 | 가부시키가이샤 사무코 | 실리콘 웨이퍼의 연마 방법 |
| KR20120067198A (ko) * | 2010-12-15 | 2012-06-25 | 제일모직주식회사 | 에칭 페이스트, 그 제조방법 및 이를 이용한 패턴 형성방법 |
| US9644274B2 (en) | 2011-07-04 | 2017-05-09 | Mitsubishi Gas Chemical Company, Inc. | Etching solution for copper or a compound comprised mainly of copper |
| US9365770B2 (en) | 2011-07-26 | 2016-06-14 | Mitsubishi Gas Chemical Company, Inc. | Etching solution for copper/molybdenum-based multilayer thin film |
| DE112013004295B4 (de) * | 2012-08-31 | 2024-12-05 | Fujimi Incorporated | Polierzusammensetzung, deren Verwendung und Verfahren zur Herstellung eines Substrats |
| CN103525314B (zh) * | 2013-10-30 | 2014-12-10 | 湖北三翔超硬材料有限公司 | 高效金刚石润滑冷却抛光液及制备方法和应用 |
| CN104131289B (zh) * | 2014-07-01 | 2015-09-23 | 安徽拓普森电池有限责任公司 | 一种具有杀菌效果的抛光液及其制备方法 |
| JP6837958B2 (ja) | 2017-12-28 | 2021-03-03 | 花王株式会社 | 酸化珪素膜用研磨液組成物 |
| JP7520457B2 (ja) * | 2020-07-30 | 2024-07-23 | 株式会社ディスコ | 研磨液 |
| CN113969173B (zh) * | 2021-09-23 | 2022-05-13 | 易安爱富(武汉)科技有限公司 | 一种ITO/Ag/ITO复合金属层薄膜的蚀刻液 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3458023B2 (ja) * | 1995-08-01 | 2003-10-20 | メック株式会社 | 銅および銅合金のマイクロエッチング剤 |
| JP3371775B2 (ja) * | 1997-10-31 | 2003-01-27 | 株式会社日立製作所 | 研磨方法 |
| US6432828B2 (en) * | 1998-03-18 | 2002-08-13 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| KR100581649B1 (ko) | 1998-06-10 | 2006-05-23 | 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 | 금속 ｃｍｐ에서 광택화를 위한 조성물 및 방법 |
| JP4095731B2 (ja) * | 1998-11-09 | 2008-06-04 | 株式会社ルネサステクノロジ | 半導体装置の製造方法及び半導体装置 |
| US20010054706A1 (en) | 1999-07-19 | 2001-12-27 | Joseph A. Levert | Compositions and processes for spin etch planarization |
| TW501197B (en) | 1999-08-17 | 2002-09-01 | Hitachi Chemical Co Ltd | Polishing compound for chemical mechanical polishing and method for polishing substrate |
| KR20020027571A (ko) | 1999-08-24 | 2002-04-13 | 갤반 마틴 | 절연체와 금속의 ｃｍｐ용 조성물 및 이에 관련된 방법 |
| US7232529B1 (en) | 1999-08-26 | 2007-06-19 | Hitachi Chemical Company, Ltd. | Polishing compound for chemimechanical polishing and polishing method |
| CN1125862C (zh) * | 1999-09-20 | 2003-10-29 | 长兴化学工业股份有限公司 | 半导体加工用化学机械研磨组合物 |
| JP2002050595A (ja) * | 2000-08-04 | 2002-02-15 | Hitachi Ltd | 研磨方法、配線形成方法及び半導体装置の製造方法 |
| US6605537B2 (en) * | 2000-10-27 | 2003-08-12 | Rodel Holdings, Inc. | Polishing of metal substrates |
| US6936541B2 (en) * | 2000-09-20 | 2005-08-30 | Rohn And Haas Electronic Materials Cmp Holdings, Inc. | Method for planarizing metal interconnects |
| JP3768402B2 (ja) * | 2000-11-24 | 2006-04-19 | Ｎｅｃエレクトロニクス株式会社 | 化学的機械的研磨用スラリー |
| JP4009986B2 (ja) * | 2000-11-29 | 2007-11-21 | 株式会社フジミインコーポレーテッド | 研磨用組成物、およびそれを用いてメモリーハードディスクを研磨する研磨方法 |
| US6632259B2 (en) * | 2001-05-18 | 2003-10-14 | Rodel Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
| JP2003282496A (ja) * | 2002-03-20 | 2003-10-03 | Asahi Kasei Corp | 研磨材組成物 |
| JP4560294B2 (ja) * | 2002-03-25 | 2010-10-13 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | タンタルバリア除去溶液 |
| US20030219982A1 (en) * | 2002-05-23 | 2003-11-27 | Hitachi Chemical Co., Ltd | CMP (chemical mechanical polishing) polishing liquid for metal and polishing method |
| US6936543B2 (en) * | 2002-06-07 | 2005-08-30 | Cabot Microelectronics Corporation | CMP method utilizing amphiphilic nonionic surfactants |
| US20040092102A1 (en) * | 2002-11-12 | 2004-05-13 | Sachem, Inc. | Chemical mechanical polishing composition and method |
| KR100504608B1 (ko) * | 2002-12-30 | 2005-08-01 | 제일모직주식회사 | 구리배선 연마용 슬러리 조성물 |
| US7384871B2 (en) * | 2004-07-01 | 2008-06-10 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing compositions and methods relating thereto |
-
2004
- 2004-11-24 US US10/996,689 patent/US7435356B2/en active Active
-
2005
- 2005-10-31 KR KR1020050102799A patent/KR101101169B1/ko not_active Expired - Lifetime
- 2005-11-11 TW TW094139567A patent/TWI359860B/zh active
- 2005-11-23 SG SG200507413A patent/SG122919A1/en unknown
- 2005-11-24 JP JP2005338383A patent/JP5091400B2/ja not_active Expired - Lifetime
- 2005-11-24 CN CNB2005101287071A patent/CN100362068C/zh not_active Expired - Lifetime
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