JP2002012854A5 - - Google Patents
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- Publication number
- JP2002012854A5 JP2002012854A5 JP2000199462A JP2000199462A JP2002012854A5 JP 2002012854 A5 JP2002012854 A5 JP 2002012854A5 JP 2000199462 A JP2000199462 A JP 2000199462A JP 2000199462 A JP2000199462 A JP 2000199462A JP 2002012854 A5 JP2002012854 A5 JP 2002012854A5
- Authority
- JP
- Japan
- Prior art keywords
- chemical mechanical
- aqueous dispersion
- mechanical polishing
- polishing aqueous
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 49
- 239000000126 substance Substances 0.000 claims description 35
- 239000006185 dispersion Substances 0.000 claims description 30
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 13
- 239000010949 copper Substances 0.000 claims description 13
- 150000001875 compounds Chemical class 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 9
- 125000000623 heterocyclic group Chemical group 0.000 claims description 5
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 5
- 239000003945 anionic surfactant Substances 0.000 claims description 4
- 239000007800 oxidant agent Substances 0.000 claims description 4
- 239000004094 surface-active agent Substances 0.000 claims description 4
- PLUHAVSIMCXBEX-UHFFFAOYSA-N azane;dodecyl benzenesulfonate Chemical compound N.CCCCCCCCCCCCOS(=O)(=O)C1=CC=CC=C1 PLUHAVSIMCXBEX-UHFFFAOYSA-N 0.000 claims description 2
- HSJXWMZKBLUOLQ-UHFFFAOYSA-M potassium;2-dodecylbenzenesulfonate Chemical group [K+].CCCCCCCCCCCCC1=CC=CC=C1S([O-])(=O)=O HSJXWMZKBLUOLQ-UHFFFAOYSA-M 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 7
- 239000002245 particle Substances 0.000 claims 4
- 239000008119 colloidal silica Substances 0.000 claims 3
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 claims 3
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims 2
- SIKJAQJRHWYJAI-UHFFFAOYSA-N Indole Chemical compound C1=CC=C2NC=CC2=C1 SIKJAQJRHWYJAI-UHFFFAOYSA-N 0.000 claims 2
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims 2
- DZBUGLKDJFMEHC-UHFFFAOYSA-N acridine Chemical compound C1=CC=CC2=CC3=CC=CC=C3N=C21 DZBUGLKDJFMEHC-UHFFFAOYSA-N 0.000 claims 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims 2
- 125000005842 heteroatom Chemical group 0.000 claims 2
- AWJUIBRHMBBTKR-UHFFFAOYSA-N isoquinoline Chemical compound C1=NC=CC2=CC=CC=C21 AWJUIBRHMBBTKR-UHFFFAOYSA-N 0.000 claims 2
- 239000000377 silicon dioxide Substances 0.000 claims 2
- VHMICKWLTGFITH-UHFFFAOYSA-N 2H-isoindole Chemical compound C1=CC=CC2=CNC=C21 VHMICKWLTGFITH-UHFFFAOYSA-N 0.000 claims 1
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims 1
- WCZVZNOTHYJIEI-UHFFFAOYSA-N cinnoline Chemical compound N1=NC=CC2=CC=CC=C21 WCZVZNOTHYJIEI-UHFFFAOYSA-N 0.000 claims 1
- 239000011246 composite particle Substances 0.000 claims 1
- 239000012535 impurity Substances 0.000 claims 1
- PZOUSPYUWWUPPK-UHFFFAOYSA-N indole Natural products CC1=CC=CC2=C1C=CN2 PZOUSPYUWWUPPK-UHFFFAOYSA-N 0.000 claims 1
- RKJUIXBNRJVNHR-UHFFFAOYSA-N indolenine Natural products C1=CC=C2CC=NC2=C1 RKJUIXBNRJVNHR-UHFFFAOYSA-N 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 125000001624 naphthyl group Chemical group 0.000 claims 1
- 229910052757 nitrogen Inorganic materials 0.000 claims 1
- 125000004433 nitrogen atom Chemical group N* 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- LFSXCDWNBUNEEM-UHFFFAOYSA-N phthalazine Chemical compound C1=NN=CC2=CC=CC=C21 LFSXCDWNBUNEEM-UHFFFAOYSA-N 0.000 claims 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 claims 1
- LOAUVZALPPNFOQ-UHFFFAOYSA-N quinaldic acid Chemical compound C1=CC=CC2=NC(C(=O)O)=CC=C21 LOAUVZALPPNFOQ-UHFFFAOYSA-N 0.000 claims 1
- JWVCLYRUEFBMGU-UHFFFAOYSA-N quinazoline Chemical compound N1=CN=CC2=CC=CC=C21 JWVCLYRUEFBMGU-UHFFFAOYSA-N 0.000 claims 1
- 239000006061 abrasive grain Substances 0.000 description 2
- 230000003628 erosive effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- -1 alkyl naphthalene sulfonate Chemical compound 0.000 description 1
- 229940077388 benzenesulfonate Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 150000008054 sulfonate salts Chemical class 0.000 description 1
- 150000003871 sulfonates Chemical class 0.000 description 1
- 239000004711 α-olefin Substances 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000199462A JP3837277B2 (ja) | 2000-06-30 | 2000-06-30 | 銅の研磨に用いる化学機械研磨用水系分散体及び化学機械研磨方法 |
| DE60127206T DE60127206T2 (de) | 2000-06-30 | 2001-06-28 | Wässrige Dispersion zum chemisch-mechanischen Polieren von Kupfersubstraten |
| EP01115585A EP1167482B1 (en) | 2000-06-30 | 2001-06-28 | Aqueous dispersion for chemical mechanical polishing used for polishing of copper |
| TW090115802A TW538113B (en) | 2000-06-30 | 2001-06-28 | Aqueous dispersion for chemical mechanical polishing used for polishing of copper |
| KR1020010037921A KR100747954B1 (ko) | 2000-06-30 | 2001-06-29 | 구리 연마에 사용되는 화학 기계 연마용 수계 분산체 |
| US09/893,961 US6653267B2 (en) | 2000-06-30 | 2001-06-29 | Aqueous dispersion for chemical mechanical polishing used for polishing of copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000199462A JP3837277B2 (ja) | 2000-06-30 | 2000-06-30 | 銅の研磨に用いる化学機械研磨用水系分散体及び化学機械研磨方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002012854A JP2002012854A (ja) | 2002-01-15 |
| JP2002012854A5 true JP2002012854A5 (enExample) | 2004-12-24 |
| JP3837277B2 JP3837277B2 (ja) | 2006-10-25 |
Family
ID=18697476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000199462A Expired - Lifetime JP3837277B2 (ja) | 2000-06-30 | 2000-06-30 | 銅の研磨に用いる化学機械研磨用水系分散体及び化学機械研磨方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6653267B2 (enExample) |
| EP (1) | EP1167482B1 (enExample) |
| JP (1) | JP3837277B2 (enExample) |
| KR (1) | KR100747954B1 (enExample) |
| DE (1) | DE60127206T2 (enExample) |
| TW (1) | TW538113B (enExample) |
Families Citing this family (34)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000183003A (ja) * | 1998-10-07 | 2000-06-30 | Toshiba Corp | 銅系金属用研磨組成物および半導体装置の製造方法 |
| JP2002164307A (ja) * | 2000-11-24 | 2002-06-07 | Fujimi Inc | 研磨用組成物およびそれを用いた研磨方法 |
| JP4187497B2 (ja) * | 2002-01-25 | 2008-11-26 | Ｊｓｒ株式会社 | 半導体基板の化学機械研磨方法 |
| JP4688397B2 (ja) * | 2002-03-27 | 2011-05-25 | 泰弘 谷 | キャリア粒子の取扱い方法および研磨剤 |
| TWI282360B (en) | 2002-06-03 | 2007-06-11 | Hitachi Chemical Co Ltd | Polishing composition and polishing method thereof |
| KR100480797B1 (ko) * | 2002-07-26 | 2005-04-07 | 엘지.필립스 엘시디 주식회사 | 구리 몰리브덴막의 식각속도를 개선한 식각용액 및 그식각방법 |
| US20040162011A1 (en) * | 2002-08-02 | 2004-08-19 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and production process of semiconductor device |
| US20040175942A1 (en) * | 2003-01-03 | 2004-09-09 | Chang Song Y. | Composition and method used for chemical mechanical planarization of metals |
| JP2004247605A (ja) | 2003-02-14 | 2004-09-02 | Toshiba Corp | Ｃｍｐ用スラリーおよび半導体装置の製造方法 |
| DE10313517B4 (de) * | 2003-03-25 | 2006-03-30 | Atotech Deutschland Gmbh | Lösung zum Ätzen von Kupfer, Verfahren zum Vorbehandeln einer Schicht aus Kupfer sowie Anwendung des Verfahrens |
| EP1477538B1 (en) * | 2003-05-12 | 2007-07-25 | JSR Corporation | Chemical mechanical polishing agent kit and chemical mechanical polishing method using the same |
| JP4649871B2 (ja) * | 2003-05-12 | 2011-03-16 | Ｊｓｒ株式会社 | 化学機械研磨剤キットを用いた化学機械研磨方法 |
| US20050022456A1 (en) * | 2003-07-30 | 2005-02-03 | Babu S. V. | Polishing slurry and method for chemical-mechanical polishing of copper |
| US7186653B2 (en) | 2003-07-30 | 2007-03-06 | Climax Engineered Materials, Llc | Polishing slurries and methods for chemical mechanical polishing |
| EP1648974A4 (en) * | 2003-07-30 | 2008-04-23 | Climax Engineered Mat Llc | AQUEOUS SUSPENSIONS AND METHODS FOR THE CHEMICAL MECHANICAL PLANARIZATION OF COPPER |
| JP4759219B2 (ja) * | 2003-11-25 | 2011-08-31 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US7485162B2 (en) | 2003-09-30 | 2009-02-03 | Fujimi Incorporated | Polishing composition |
| JP2005116987A (ja) * | 2003-10-10 | 2005-04-28 | Fujimi Inc | 研磨用組成物 |
| EP1670047B1 (en) * | 2003-09-30 | 2010-04-07 | Fujimi Incorporated | Polishing composition and polishing method |
| JP3892846B2 (ja) * | 2003-11-27 | 2007-03-14 | 株式会社東芝 | Ｃｍｐ用スラリー、研磨方法、および半導体装置の製造方法 |
| US7287314B2 (en) * | 2004-02-27 | 2007-10-30 | Hitachi Global Storage Technologies Netherlands B.V. | One step copper damascene CMP process and slurry |
| JP2005268665A (ja) * | 2004-03-19 | 2005-09-29 | Fujimi Inc | 研磨用組成物 |
| JP2006114729A (ja) * | 2004-10-15 | 2006-04-27 | Jsr Corp | 余剰の金属層の除去方法 |
| US20060096179A1 (en) * | 2004-11-05 | 2006-05-11 | Cabot Microelectronics Corporation | CMP composition containing surface-modified abrasive particles |
| KR100601740B1 (ko) * | 2005-04-11 | 2006-07-18 | 테크노세미켐 주식회사 | 투명도전막 식각용액 |
| JP2008547202A (ja) * | 2005-06-13 | 2008-12-25 | アドバンスド テクノロジー マテリアルズ，インコーポレイテッド | 金属ケイ化物の形成後の金属または金属合金の選択的な除去のための組成物および方法 |
| US20060283095A1 (en) * | 2005-06-15 | 2006-12-21 | Planar Solutions, Llc | Fumed silica to colloidal silica conversion process |
| JP5345397B2 (ja) | 2005-09-26 | 2013-11-20 | プラナー ソリューションズ エルエルシー | 化学機械研磨応用で使用するための超純度コロイド状シリカ |
| US20070144075A1 (en) * | 2005-12-09 | 2007-06-28 | Industrial Technology Research Institute | Chemical mechanical polishing particles and slurry and method of producing the same |
| US20080153731A1 (en) * | 2006-12-21 | 2008-06-26 | Mark Buehler | Clean chemistry composition, method of manufacturing same, and system making use of same |
| CN101974297A (zh) * | 2010-11-12 | 2011-02-16 | 大连三达奥克化学股份有限公司 | 核/壳型复合纳米磨料铜化学机械抛光液 |
| CN102766406B (zh) * | 2012-06-25 | 2014-12-10 | 深圳市力合材料有限公司 | 一种去除半导体硅片表面缺陷的抛光组合物及其制备方法 |
| KR102734246B1 (ko) * | 2017-11-22 | 2024-11-25 | 바스프 에스이 | 화학 기계적 연마 조성물 |
| KR102698381B1 (ko) * | 2018-11-23 | 2024-08-23 | 솔브레인 주식회사 | 연마용 조성물 및 이를 이용하는 연마 방법 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5850827A (ja) * | 1981-09-08 | 1983-03-25 | Fujitsu Ltd | フェーズ・ロック・ループ回路 |
| JPH04291723A (ja) | 1991-03-20 | 1992-10-15 | Asahi Denka Kogyo Kk | シリコンウェハー用研摩剤 |
| JPH04291722A (ja) | 1991-03-20 | 1992-10-15 | Asahi Denka Kogyo Kk | シリコンウェハー表面のヘイズ防止方法 |
| JPH04291724A (ja) | 1991-03-20 | 1992-10-15 | Asahi Denka Kogyo Kk | シリコンウェハーの研摩方法 |
| US5607718A (en) | 1993-03-26 | 1997-03-04 | Kabushiki Kaisha Toshiba | Polishing method and polishing apparatus |
| US5575837A (en) | 1993-04-28 | 1996-11-19 | Fujimi Incorporated | Polishing composition |
| US5405412A (en) * | 1994-04-13 | 1995-04-11 | The Procter & Gamble Company | Bleaching compounds comprising N-acyl caprolactam and alkanoyloxybenzene sulfonate bleach activators |
| JP3397501B2 (ja) | 1994-07-12 | 2003-04-14 | 株式会社東芝 | 研磨剤および研磨方法 |
| JP3192968B2 (ja) | 1995-06-08 | 2001-07-30 | 株式会社東芝 | 銅系金属用研磨液および半導体装置の製造方法 |
| US6046110A (en) * | 1995-06-08 | 2000-04-04 | Kabushiki Kaisha Toshiba | Copper-based metal polishing solution and method for manufacturing a semiconductor device |
| US5690539A (en) | 1995-08-07 | 1997-11-25 | Cal-West Equipment Company Inc. | Method of abarding using surface abrasion compositions |
| JPH0982668A (ja) | 1995-09-20 | 1997-03-28 | Sony Corp | 研磨用スラリー及びこの研磨用スラリーを用いる研磨方法 |
| JP3015763B2 (ja) | 1996-08-30 | 2000-03-06 | 三洋電機株式会社 | 半導体装置の製造方法 |
| US5738800A (en) | 1996-09-27 | 1998-04-14 | Rodel, Inc. | Composition and method for polishing a composite of silica and silicon nitride |
| KR19980032145A (ko) | 1996-10-04 | 1998-07-25 | 포만제프리엘 | 알루미늄 구리 합금의 화학기계적 연마시 구리 도금을 방지하는 방법 |
| US6309560B1 (en) | 1996-12-09 | 2001-10-30 | Cabot Microelectronics Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| US5954997A (en) * | 1996-12-09 | 1999-09-21 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper substrates |
| US5756398A (en) | 1997-03-17 | 1998-05-26 | Rodel, Inc. | Composition and method for polishing a composite comprising titanium |
| JPH1140526A (ja) | 1997-07-22 | 1999-02-12 | Hitachi Ltd | 配線形成方法及び半導体装置の製造方法 |
| JP3371775B2 (ja) | 1997-10-31 | 2003-01-27 | 株式会社日立製作所 | 研磨方法 |
| TW455626B (en) * | 1998-07-23 | 2001-09-21 | Eternal Chemical Co Ltd | Chemical mechanical abrasive composition for use in semiconductor processing |
| US6036758A (en) * | 1998-08-10 | 2000-03-14 | Pmd (U.K.) Limited | Surface treatment of copper |
| US6083840A (en) * | 1998-11-25 | 2000-07-04 | Arch Specialty Chemicals, Inc. | Slurry compositions and method for the chemical-mechanical polishing of copper and copper alloys |
| KR100472882B1 (ko) * | 1999-01-18 | 2005-03-07 | 가부시끼가이샤 도시바 | 수계 분산체, 이를 이용한 화학 기계 연마용 수계 분산체조성물, 웨이퍼 표면의 연마 방법 및 반도체 장치의 제조방법 |
| KR100447551B1 (ko) * | 1999-01-18 | 2004-09-08 | 가부시끼가이샤 도시바 | 복합 입자 및 그의 제조 방법, 수계 분산체, 화학 기계연마용 수계 분산체 조성물 및 반도체 장치의 제조 방법 |
| JP3523107B2 (ja) * | 1999-03-17 | 2004-04-26 | 株式会社東芝 | Ｃｍｐ用スラリおよびｃｍｐ法 |
| US6348076B1 (en) * | 1999-10-08 | 2002-02-19 | International Business Machines Corporation | Slurry for mechanical polishing (CMP) of metals and use thereof |
| TW572980B (en) * | 2000-01-12 | 2004-01-21 | Jsr Corp | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing process |
-
2000
- 2000-06-30 JP JP2000199462A patent/JP3837277B2/ja not_active Expired - Lifetime
-
2001
- 2001-06-28 TW TW090115802A patent/TW538113B/zh not_active IP Right Cessation
- 2001-06-28 DE DE60127206T patent/DE60127206T2/de not_active Expired - Lifetime
- 2001-06-28 EP EP01115585A patent/EP1167482B1/en not_active Expired - Lifetime
- 2001-06-29 KR KR1020010037921A patent/KR100747954B1/ko not_active Expired - Lifetime
- 2001-06-29 US US09/893,961 patent/US6653267B2/en not_active Expired - Lifetime
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