JP2006019746A - ケミカルメカニカルポリッシング組成物及びそれに関連する方法 - Google Patents
ケミカルメカニカルポリッシング組成物及びそれに関連する方法 Download PDFInfo
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- JP2006019746A JP2006019746A JP2005193258A JP2005193258A JP2006019746A JP 2006019746 A JP2006019746 A JP 2006019746A JP 2005193258 A JP2005193258 A JP 2005193258A JP 2005193258 A JP2005193258 A JP 2005193258A JP 2006019746 A JP2006019746 A JP 2006019746A
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- Prior art keywords
- acid
- acrylic acid
- copolymer
- methacrylic acid
- gum
- Prior art date
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- 239000000203 mixture Substances 0.000 title claims abstract description 50
- 238000005498 polishing Methods 0.000 title claims description 38
- 238000000034 method Methods 0.000 title claims description 9
- 239000000126 substance Substances 0.000 title description 2
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- 239000002184 metal Substances 0.000 claims abstract description 51
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 27
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 26
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 claims abstract description 24
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- 229920000591 gum Polymers 0.000 claims description 6
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- IAJILQKETJEXLJ-UHFFFAOYSA-N Galacturonsaeure Natural products O=CC(O)C(O)C(O)C(O)C(O)=O IAJILQKETJEXLJ-UHFFFAOYSA-N 0.000 claims description 4
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- 244000215068 Acacia senegal Species 0.000 claims description 2
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- 241000934878 Sterculia Species 0.000 claims description 2
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- 239000002245 particle Substances 0.000 description 10
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- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
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- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 4
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- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 description 4
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/32115—Planarisation
- H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
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- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
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- Organic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
【解決手段】酸化剤、非鉄金属のインヒビター、非鉄金属の錯化剤、改質セルロース、アクリル酸とメタクリル酸とのコポリマー0.01〜5重量%及び残余としての水を含み、アクリル酸とメタクリル酸とのコポリマーが、1:30〜30:1の範囲のモノマー比(アクリル酸:メタクリル酸)を有し、1K〜1000Kの範囲の分子量を有するものである組成物。
【選択図】なし
Description
Claims (8)
- 金属を含有する半導体ウェーハのCMPに有用な水性組成物であって、酸化剤、非鉄金属のインヒビター、非鉄金属の錯化剤、改質セルロース、アクリル酸とメタクリル酸とのコポリマー0.01〜5重量%及び残余としての水を含み、アクリル酸とメタクリル酸との前記コポリマーが、1:30〜30:1の範囲のモノマー比(アクリル酸:メタクリル酸)を有し、1K〜1000Kの範囲の分子量を有するものである組成物。
- アクリル酸とメタクリル酸との前記コポリマーが1:9〜9:1の範囲のモノマー比(アクリル酸:メタクリル酸)を有する、請求項1記載の組成物。
- アクリル酸とメタクリル酸との前記コポリマーが約2:3のモノマー比(アクリル酸:メタクリル酸)を有する、請求項2記載の組成物。
- 前記コポリマーが20K〜200Kの範囲の分子量を有する、請求項1記載の組成物。
- 前記改質セルロースが、カルボキシメチルセルロース、アガーガム、アラビアガム、ガッチガム、カラヤガム、グアーガム、ペクチン、ローカストビーンガム、トラガカントガム、タマリンドガム、カラゲナンガム及びキサンタンガム、化工デンプン、アルギン酸、マンヌロン酸、グルクロン酸ならびにそれらの改変物、コポリマー及び混合物からなる群からの、カルボン酸官能基で修飾された水溶性セルロースである、請求項1記載の組成物。
- 前記改質セルロースがカルボキシメチルセルロースである、請求項5記載の組成物。
- 無砥粒である、請求項1記載の組成物。
- 半導体ウェーハ上の非鉄金属を研磨する方法であって、非鉄金属を含有するウェーハを、酸化剤、非鉄金属のインヒビター、非鉄金属の錯化剤、改質セルロース、アクリル酸とメタクリル酸とのコポリマー0.01〜5重量%及び残余としての水を含み、アクリル酸とメタクリル酸との前記コポリマーが、1:9〜9:1の範囲のモノマー比(アクリル酸:メタクリル酸)を有し、1K〜1000Kの範囲の分子量を有するものである研磨組成物と接触させること、及び前記ウェーハを研磨パッドで研磨することを含む方法。
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US10/882,567 US7384871B2 (en) | 2004-07-01 | 2004-07-01 | Chemical mechanical polishing compositions and methods relating thereto |
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- 2004-07-01 US US10/882,567 patent/US7384871B2/en active Active
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JP2010512657A (ja) * | 2006-12-22 | 2010-04-22 | テクノ セミケム シーオー., エルティーディー. | ゼオライトを含有する銅化学機械的研磨組成物 |
WO2009128430A1 (ja) | 2008-04-15 | 2009-10-22 | 日立化成工業株式会社 | 金属膜用研磨液及びこれを用いた研磨方法 |
JP5176078B2 (ja) * | 2008-04-15 | 2013-04-03 | 日立化成株式会社 | 金属膜用研磨液及びこれを用いた研磨方法 |
US8734204B2 (en) | 2008-04-15 | 2014-05-27 | Hitachi Chemical Company, Ltd. | Polishing solution for metal films and polishing method using the same |
JP2014049633A (ja) * | 2012-08-31 | 2014-03-17 | Fujimi Inc | 研磨用組成物及び基板の製造方法 |
JP2019537244A (ja) * | 2016-09-29 | 2019-12-19 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | タングステンのためのケミカルメカニカルポリッシング法 |
JP2019537246A (ja) * | 2016-09-29 | 2019-12-19 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | タングステンのための化学機械研磨法 |
JP2019537245A (ja) * | 2016-09-29 | 2019-12-19 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | タングステンのためのケミカルメカニカルポリッシング法 |
Also Published As
Publication number | Publication date |
---|---|
TW200613521A (en) | 2006-05-01 |
US7384871B2 (en) | 2008-06-10 |
TWI394820B (zh) | 2013-05-01 |
US20060000150A1 (en) | 2006-01-05 |
CN1715310A (zh) | 2006-01-04 |
CN100355819C (zh) | 2007-12-19 |
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