JP5110244B2 - 化学機械研磨用水系分散体および化学機械研磨方法 - Google Patents

化学機械研磨用水系分散体および化学機械研磨方法 Download PDF

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JP5110244B2
JP5110244B2 JP2006048946A JP2006048946A JP5110244B2 JP 5110244 B2 JP5110244 B2 JP 5110244B2 JP 2006048946 A JP2006048946 A JP 2006048946A JP 2006048946 A JP2006048946 A JP 2006048946A JP 5110244 B2 JP5110244 B2 JP 5110244B2
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aqueous dispersion
polishing
chemical mechanical
mechanical polishing
mass
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JP2006287207A (ja
JP2006287207A5 (enExample
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和一 内倉
雅幸 服部
信夫 川橋
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JSR Corp
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JSR Corp
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP2006048946A 2005-03-09 2006-02-24 化学機械研磨用水系分散体および化学機械研磨方法 Expired - Fee Related JP5110244B2 (ja)

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JP2005064754 2005-03-09
JP2005064754 2005-03-09
JP2006048946A JP5110244B2 (ja) 2005-03-09 2006-02-24 化学機械研磨用水系分散体および化学機械研磨方法

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JP2006287207A JP2006287207A (ja) 2006-10-19
JP2006287207A5 JP2006287207A5 (enExample) 2006-12-14
JP5110244B2 true JP5110244B2 (ja) 2012-12-26

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8791019B2 (en) 2005-12-27 2014-07-29 Hitachi Chemical Company, Ltd. Metal polishing slurry and method of polishing a film to be polished
JP2008205433A (ja) * 2007-01-25 2008-09-04 Jsr Corp 電気光学表示装置用基板に設けられたバリアメタル層を研磨するための化学機械研磨用水系分散体および該化学機械研磨用水系分散体を調製するためのキット、ならびに化学機械研磨方法
JP5327427B2 (ja) 2007-06-19 2013-10-30 Ｊｓｒ株式会社 化学機械研磨用水系分散体調製用セット、化学機械研磨用水系分散体の調製方法、化学機械研磨用水系分散体および化学機械研磨方法
JPWO2009028256A1 (ja) * 2007-08-31 2010-11-25 Jsr株式会社 化学機械研磨用水系分散体調製用セットおよび化学機械研磨用水系分散体の調製方法
JP2009065001A (ja) * 2007-09-07 2009-03-26 Jsr Corp 化学機械研磨用水系分散体、該分散体を調製するためのキット、および化学機械研磨用水系分散体の調製方法
JP2010161201A (ja) * 2009-01-08 2010-07-22 Jsr Corp 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法、化学機械研磨用水系分散体の製造方法
WO2013067696A1 (en) * 2011-11-09 2013-05-16 Rhodia (China) Co., Ltd. Additive mixture and composition and method for polishing glass substrates
SG10201604674VA (en) * 2012-02-01 2016-07-28 Hitachi Chemical Co Ltd Polishing liquid for metal and polishing method
JP7731543B2 (ja) * 2023-02-28 2025-09-01 熊本県 研磨加工物の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3179064B2 (ja) * 1999-01-18 2001-06-25 株式会社東京精密 スラリーの供給装置
JP2003133266A (ja) * 2001-10-22 2003-05-09 Sumitomo Bakelite Co Ltd 研磨用組成物
JP2003151927A (ja) * 2001-11-12 2003-05-23 Sumitomo Bakelite Co Ltd 研磨用組成物
ATE403936T1 (de) * 2002-04-30 2008-08-15 Hitachi Chemical Co Ltd Polierfluid und polierverfahren
TWI282360B (en) * 2002-06-03 2007-06-11 Hitachi Chemical Co Ltd Polishing composition and polishing method thereof
JP4070622B2 (ja) * 2003-01-29 2008-04-02 富士フイルム株式会社 金属用研磨液及び研磨方法
JP4649871B2 (ja) * 2003-05-12 2011-03-16 Ｊｓｒ株式会社 化学機械研磨剤キットを用いた化学機械研磨方法
JP2005045229A (ja) * 2003-07-04 2005-02-17 Jsr Corp 化学機械研磨用水系分散体および化学機械研磨方法

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