JP2009092545A - 角速度および加速度検出用複合センサ - Google Patents
角速度および加速度検出用複合センサ Download PDFInfo
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- JP2009092545A JP2009092545A JP2007264287A JP2007264287A JP2009092545A JP 2009092545 A JP2009092545 A JP 2009092545A JP 2007264287 A JP2007264287 A JP 2007264287A JP 2007264287 A JP2007264287 A JP 2007264287A JP 2009092545 A JP2009092545 A JP 2009092545A
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- angular velocity
- acceleration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5607—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using vibrating tuning forks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/10—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 by using measurements of speed or acceleration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P1/00—Details of instruments
- G01P1/02—Housings
- G01P1/023—Housings for acceleration measuring devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/18—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P3/00—Measuring linear or angular speed; Measuring differences of linear or angular speeds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L2224/0556—Disposition
- H01L2224/0557—Disposition the external layer being disposed on a via connection of the semiconductor or solid-state body
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
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- H01L2224/05573—Single external layer
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
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- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32135—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/32145—Disposition the layer connector connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being stacked
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Abstract
【解決手段】本発明の角速度および加速度検出用複合センサは、角速度信号処理IC54における非機能部57と加速度信号処理IC60における非機能部61とを接合するように構成しているため、角速度信号処理ICまたは角速度信号処理ICのうち、いずれか一方の機能部を、ケースにおけるケース接続電極に直接に電気的に接続することができ、これにより、回路基板が不要となるため、小型化された角速度および加速度検出用複合センサを提供することができる。
【選択図】図5
Description
50 加速度検出素子
51 ケース
52 多層回路基板
52a ケース電源電極
52b ケースGND電極
52c ケース角速度出力電極
52d ケース加速度出力電極
53a,53b ケース接続電極
54 角速度信号処理IC
55,63 機能部
57,61 非機能部
56,64 IC電極
58 電極バンプ
60 加速度信号処理IC
65 ワイヤ
Claims (3)
- 角速度を検出する角速度検出素子と、加速度を検出する加速度検出素子と、前記角速度検出素子の出力信号を処理するとともに一面に機能部を設け、かつ他面に非機能部を設けた角速度信号処理ICと、前記加速度検出素子の出力信号を処理するとともに一面に機能部を設け、かつ他面に非機能部を設けた加速度信号処理ICと、前記角速度検出素子、加速度検出素子、角速度信号処理ICおよび加速度信号処理ICを収納するとともにケース電源電極、ケースGND電極、ケース角速度出力電極、ケース加速度出力電極、多層回路基板およびケース接続電極を一体に設けたケースとを備え、前記角速度信号処理ICにおける非機能部と加速度信号処理ICにおける非機能部とを接合するように構成した角速度および加速度検出用複合センサ。
- 角速度信号処理ICを加速度信号処理ICの下側に位置させるとともに、ケースの内底面に設けたケース接続電極と角速度信号処理ICの外底面に設けたIC電極とを電極バンプにより電気的に接続するように構成した請求項1記載の角速度および加速度検出用複合センサ。
- 加速度信号処理ICを角速度信号処理ICの上側に位置させるとともに、前記加速度信号処理ICの上面と略同一面上に位置してケースにケース接続電極を設け、かつこのケース接続電極と前記加速度信号処理ICの上面に設けたIC電極とをワイヤにより電気的に接続するように構成した請求項1記載の角速度および加速度検出用複合センサ。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007264287A JP2009092545A (ja) | 2007-10-10 | 2007-10-10 | 角速度および加速度検出用複合センサ |
EP08838083.7A EP2180291B1 (en) | 2007-10-10 | 2008-10-02 | Composite sensor for detecting angular velocity and acceleration |
PCT/JP2008/002765 WO2009047887A1 (ja) | 2007-10-10 | 2008-10-02 | 角速度および加速度検出用複合センサ |
CN2008801110868A CN101821586B (zh) | 2007-10-10 | 2008-10-02 | 角速度及加速度检测用复合传感器 |
US12/679,412 US9069000B2 (en) | 2007-10-10 | 2008-10-02 | Composite sensor for detecting angular velocity and acceleration |
US14/716,111 US9453851B2 (en) | 2007-10-10 | 2015-05-19 | Composite sensor for detecting angular velocity and acceleration |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007264287A JP2009092545A (ja) | 2007-10-10 | 2007-10-10 | 角速度および加速度検出用複合センサ |
Publications (1)
Publication Number | Publication Date |
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JP2009092545A true JP2009092545A (ja) | 2009-04-30 |
Family
ID=40549040
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007264287A Pending JP2009092545A (ja) | 2007-10-10 | 2007-10-10 | 角速度および加速度検出用複合センサ |
Country Status (5)
Country | Link |
---|---|
US (2) | US9069000B2 (ja) |
EP (1) | EP2180291B1 (ja) |
JP (1) | JP2009092545A (ja) |
CN (1) | CN101821586B (ja) |
WO (1) | WO2009047887A1 (ja) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102103982B1 (ko) * | 2014-02-17 | 2020-04-23 | 삼성전자주식회사 | 자기공명영상용 RF(radio frequency) 코일 어셈블리 및 자기공명영상 시스템 |
JP6311469B2 (ja) * | 2014-06-12 | 2018-04-18 | 株式会社デンソー | 物理量センサ |
JP6372361B2 (ja) * | 2015-01-16 | 2018-08-15 | 株式会社デンソー | 複合センサ |
JP6372450B2 (ja) * | 2015-08-21 | 2018-08-15 | 株式会社デンソー | 複合センサ |
JP6561702B2 (ja) * | 2015-09-09 | 2019-08-21 | セイコーエプソン株式会社 | 物理量検出システム、電子機器及び移動体 |
DE102015220286A1 (de) * | 2015-10-19 | 2017-04-20 | Robert Bosch Gmbh | Elektronisches Bremsdruckregelsystem |
JP2019128304A (ja) * | 2018-01-26 | 2019-08-01 | セイコーエプソン株式会社 | 物理量センサー、慣性計測ユニット、電子機器、携帯型電子機器、および移動体 |
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2007
- 2007-10-10 JP JP2007264287A patent/JP2009092545A/ja active Pending
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2008
- 2008-10-02 US US12/679,412 patent/US9069000B2/en active Active
- 2008-10-02 EP EP08838083.7A patent/EP2180291B1/en not_active Not-in-force
- 2008-10-02 CN CN2008801110868A patent/CN101821586B/zh not_active Expired - Fee Related
- 2008-10-02 WO PCT/JP2008/002765 patent/WO2009047887A1/ja active Application Filing
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2015
- 2015-05-19 US US14/716,111 patent/US9453851B2/en active Active
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JPH113969A (ja) * | 1997-06-13 | 1999-01-06 | Matsushita Electric Ind Co Ltd | チップ部品が積層された基板部品 |
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JP2006049569A (ja) * | 2004-08-04 | 2006-02-16 | Sharp Corp | スタック型半導体装置パッケージおよびその製造方法 |
JP2007248328A (ja) * | 2006-03-17 | 2007-09-27 | Matsushita Electric Ind Co Ltd | 複合センサ |
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EP2180291A1 (en) | 2010-04-28 |
US9069000B2 (en) | 2015-06-30 |
US20150253348A1 (en) | 2015-09-10 |
EP2180291B1 (en) | 2017-12-06 |
CN101821586B (zh) | 2011-10-05 |
CN101821586A (zh) | 2010-09-01 |
US20100194577A1 (en) | 2010-08-05 |
US9453851B2 (en) | 2016-09-27 |
WO2009047887A1 (ja) | 2009-04-16 |
EP2180291A4 (en) | 2010-10-13 |
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