JP2009032387A - 半導体記憶装置及び半導体装置 - Google Patents

半導体記憶装置及び半導体装置 Download PDF

Info

Publication number
JP2009032387A
JP2009032387A JP2008166733A JP2008166733A JP2009032387A JP 2009032387 A JP2009032387 A JP 2009032387A JP 2008166733 A JP2008166733 A JP 2008166733A JP 2008166733 A JP2008166733 A JP 2008166733A JP 2009032387 A JP2009032387 A JP 2009032387A
Authority
JP
Japan
Prior art keywords
transistor
inverter circuit
line
terminal
terminal connected
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2008166733A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009032387A5 (enExample
Inventor
Masafumi Fujita
雅史 藤田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2008166733A priority Critical patent/JP2009032387A/ja
Publication of JP2009032387A publication Critical patent/JP2009032387A/ja
Publication of JP2009032387A5 publication Critical patent/JP2009032387A5/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C15/00Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores
    • G11C15/04Digital stores in which information comprising one or more characteristic parts is written into the store and in which information is read-out by searching for one or more of these characteristic parts, i.e. associative or content-addressed stores using semiconductor elements
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F12/00Accessing, addressing or allocating within memory systems or architectures
    • G06F12/02Addressing or allocation; Relocation
    • G06F12/08Addressing or allocation; Relocation in hierarchically structured memory systems, e.g. virtual memory systems
    • G06F12/0802Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches
    • G06F12/0891Addressing of a memory level in which the access to the desired data or data block requires associative addressing means, e.g. caches using clearing, invalidating or resetting means
    • GPHYSICS
    • G11INFORMATION STORAGE
    • G11CSTATIC STORES
    • G11C7/00Arrangements for writing information into, or reading information out from, a digital store
    • G11C7/20Memory cell initialisation circuits, e.g. when powering up or down, memory clear, latent image memory
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B10/00Static random access memory [SRAM] devices
    • H10B10/12Static random access memory [SRAM] devices comprising a MOSFET load element
    • H10B10/125Static random access memory [SRAM] devices comprising a MOSFET load element the MOSFET being a thin film transistor [TFT]
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Memories (AREA)
  • Thin Film Transistor (AREA)
  • Static Random-Access Memory (AREA)
  • Read Only Memory (AREA)
JP2008166733A 2007-06-29 2008-06-26 半導体記憶装置及び半導体装置 Withdrawn JP2009032387A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008166733A JP2009032387A (ja) 2007-06-29 2008-06-26 半導体記憶装置及び半導体装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007172938 2007-06-29
JP2008166733A JP2009032387A (ja) 2007-06-29 2008-06-26 半導体記憶装置及び半導体装置

Publications (2)

Publication Number Publication Date
JP2009032387A true JP2009032387A (ja) 2009-02-12
JP2009032387A5 JP2009032387A5 (enExample) 2011-07-21

Family

ID=39798264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008166733A Withdrawn JP2009032387A (ja) 2007-06-29 2008-06-26 半導体記憶装置及び半導体装置

Country Status (3)

Country Link
US (2) US7929332B2 (enExample)
EP (1) EP2020658B1 (enExample)
JP (1) JP2009032387A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013211001A (ja) * 2012-03-01 2013-10-10 Semiconductor Energy Lab Co Ltd 半導体装置
US9043561B2 (en) 2012-05-02 2015-05-26 Semiconductor Energy Laboratory Co., Ltd. Storage device
JP2015222612A (ja) * 2005-07-29 2015-12-10 株式会社半導体エネルギー研究所 半導体装置

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7929332B2 (en) * 2007-06-29 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and semiconductor device
FR2951549B1 (fr) 2009-10-15 2013-08-23 Olivier Schussler Procede d'obtention de bioprotheses medicales implantables
WO2011162147A1 (en) * 2010-06-23 2011-12-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5827520B2 (ja) 2010-09-13 2015-12-02 株式会社半導体エネルギー研究所 半導体記憶装置
US8792260B2 (en) 2010-09-27 2014-07-29 Semiconductor Energy Laboratory Co., Ltd. Rectifier circuit and semiconductor device using the same
EP2522307B1 (en) 2011-05-08 2020-09-30 ITSO Medical AB Device for delivery of medical devices to a cardiac valve
KR101922397B1 (ko) 2011-05-20 2018-11-28 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
CN103597545B (zh) 2011-06-09 2016-10-19 株式会社半导体能源研究所 高速缓冲存储器及其驱动方法
JP6012263B2 (ja) 2011-06-09 2016-10-25 株式会社半導体エネルギー研究所 半導体記憶装置
US9135182B2 (en) * 2012-06-01 2015-09-15 Semiconductor Energy Laboratory Co., Ltd. Central processing unit and driving method thereof
JP6463341B2 (ja) * 2013-04-30 2019-01-30 コーニング インコーポレイテッド 空乏層を備えたガラスおよびその上に構築された多結晶シリコンtft
JP6289974B2 (ja) * 2014-03-31 2018-03-07 ルネサスエレクトロニクス株式会社 半導体装置
JP6434870B2 (ja) * 2015-07-28 2018-12-05 ルネサスエレクトロニクス株式会社 電子装置
CN112802510A (zh) * 2021-01-27 2021-05-14 中国科学院微电子研究所 一种非对称sram存储单元和sram存储器
CN112992221B (zh) * 2021-02-24 2023-03-24 中国科学院微电子研究所 一种基于背栅结构的sram存储单元、sram存储器以及上电方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289290A (ja) * 1988-09-27 1990-03-29 Nec Corp スタティック型集積回路メモリ
JPH06168591A (ja) * 1992-11-27 1994-06-14 Mitsubishi Electric Corp 半導体記憶装置
JP2004127499A (ja) * 2002-09-30 2004-04-22 Agere Systems Inc スタティック・ランダム・アクセス・メモリの初期状態を決定する方法
JP2005267694A (ja) * 2004-03-16 2005-09-29 Matsushita Electric Ind Co Ltd 半導体記憶装置
JP2005293814A (ja) * 2004-03-31 2005-10-20 Hynix Semiconductor Inc 6トランジスタデュアルポートsramセル
JP2007059044A (ja) * 2005-07-29 2007-03-08 Semiconductor Energy Lab Co Ltd 半導体装置

Family Cites Families (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4821233A (en) * 1985-09-19 1989-04-11 Xilinx, Incorporated 5-transistor memory cell with known state on power-up
JPH0810553B2 (ja) * 1986-06-13 1996-01-31 松下電器産業株式会社 記憶回路
US5018102A (en) * 1988-12-20 1991-05-21 Texas Instruments, Incorporated Memory having selected state on power-up
US5325325A (en) * 1990-03-30 1994-06-28 Sharp Kabushiki Kaisha Semiconductor memory device capable of initializing storage data
US5212663A (en) * 1991-02-21 1993-05-18 Cypress Semiconductor Corporation Method to implement a large resettable static RAM without the large surge current
JP2738782B2 (ja) * 1991-06-17 1998-04-08 三菱電機株式会社 半導体集積回路
JP2983373B2 (ja) * 1992-02-25 1999-11-29 シャープ株式会社 スタティック型メモリセル
US5749090A (en) * 1994-08-22 1998-05-05 Motorola, Inc. Cache tag RAM having separate valid bit array with multiple step invalidation and method therefor
JP4198201B2 (ja) * 1995-06-02 2008-12-17 株式会社ルネサステクノロジ 半導体装置
JPH09120682A (ja) * 1995-10-24 1997-05-06 Mitsubishi Electric Corp 半導体メモリ装置
US6128215A (en) * 1997-08-19 2000-10-03 Altera Corporation Static random access memory circuits
US6061267A (en) * 1998-09-28 2000-05-09 Texas Instruments Incorporated Memory circuits, systems, and methods with cells using back bias to control the threshold voltage of one or more corresponding cell transistors
US6190952B1 (en) * 1999-03-03 2001-02-20 Advanced Micro Devices, Inc. Multiple semiconductor-on-insulator threshold voltage circuit
JP4202563B2 (ja) * 1999-11-18 2008-12-24 株式会社東芝 半導体装置
US6556487B1 (en) * 2000-09-20 2003-04-29 Cypress Semiconductor Corp. Non-volatile static memory cell
US7319667B1 (en) * 2000-11-15 2008-01-15 Cisco Technology, Inc. Communication system with priority data compression
JP2003059273A (ja) * 2001-08-09 2003-02-28 Hitachi Ltd 半導体記憶装置
AU2003223386A1 (en) * 2002-03-27 2003-10-13 The Regents Of The University Of California Low-power high-performance memory cell and related methods
JP3634320B2 (ja) * 2002-03-29 2005-03-30 株式会社東芝 半導体装置及び半導体装置の製造方法
CN100337333C (zh) * 2002-04-10 2007-09-12 松下电器产业株式会社 非易失性触发器
JP3520283B2 (ja) * 2002-04-16 2004-04-19 沖電気工業株式会社 半導体記憶装置
US6787835B2 (en) * 2002-06-11 2004-09-07 Hitachi, Ltd. Semiconductor memories
US6862207B2 (en) * 2002-10-15 2005-03-01 Intel Corporation Static random access memory
JP4290457B2 (ja) * 2003-03-31 2009-07-08 株式会社ルネサステクノロジ 半導体記憶装置
JP4050663B2 (ja) * 2003-06-23 2008-02-20 株式会社東芝 半導体装置およびその製造方法
US7069388B1 (en) * 2003-07-10 2006-06-27 Analog Devices, Inc. Cache memory data replacement strategy
JP4037806B2 (ja) 2003-07-22 2008-01-23 松下電器産業株式会社 キャッシュメモリ装置
JP4646636B2 (ja) * 2004-02-20 2011-03-09 ルネサスエレクトロニクス株式会社 半導体装置
US7009871B1 (en) * 2004-08-18 2006-03-07 Kabushiki Kaisha Toshiba Stable memory cell
US7327598B2 (en) * 2004-11-10 2008-02-05 Texas Instruments Incorporated High performance, low leakage SRAM device and a method of placing a portion of memory cells of an SRAM device in an active mode
CN101151599B (zh) 2005-03-31 2011-08-03 株式会社半导体能源研究所 算术处理装置和使用算术处理装置的电子设备
EP1750276B1 (en) * 2005-07-29 2017-03-08 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
JP5100035B2 (ja) * 2005-08-02 2012-12-19 ルネサスエレクトロニクス株式会社 半導体記憶装置
FR2891652A1 (fr) * 2005-10-03 2007-04-06 St Microelectronics Sa Cellule de memoire vive sram asymetrique a six transistors.
JP4965844B2 (ja) * 2005-10-20 2012-07-04 株式会社東芝 半導体メモリ装置
JP4917307B2 (ja) 2005-12-20 2012-04-18 プライムアースEvエナジー株式会社 電池パック
JP4855786B2 (ja) * 2006-01-25 2012-01-18 株式会社東芝 半導体装置
US7362606B2 (en) * 2006-03-29 2008-04-22 International Business Machines Corporation Asymmetrical memory cells and memories using the cells
CN101432869B (zh) * 2006-04-27 2011-09-14 株式会社半导体能源研究所 半导体器件及其方法、以及具有半导体器件的电子装置
US7468902B2 (en) * 2006-09-27 2008-12-23 Taiwan Semiconductor Manufacturing Co., Ltd. SRAM device with a low operation voltage
US7420836B1 (en) * 2007-02-13 2008-09-02 International Business Machines Corporation Single-ended memory cell with improved read stability and memory using the cell
US7929332B2 (en) * 2007-06-29 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor memory device and semiconductor device
US7710765B2 (en) * 2007-09-27 2010-05-04 Micron Technology, Inc. Back gated SRAM cell
JP5262454B2 (ja) * 2008-09-01 2013-08-14 富士通セミコンダクター株式会社 半導体メモリ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0289290A (ja) * 1988-09-27 1990-03-29 Nec Corp スタティック型集積回路メモリ
JPH06168591A (ja) * 1992-11-27 1994-06-14 Mitsubishi Electric Corp 半導体記憶装置
JP2004127499A (ja) * 2002-09-30 2004-04-22 Agere Systems Inc スタティック・ランダム・アクセス・メモリの初期状態を決定する方法
JP2005267694A (ja) * 2004-03-16 2005-09-29 Matsushita Electric Ind Co Ltd 半導体記憶装置
JP2005293814A (ja) * 2004-03-31 2005-10-20 Hynix Semiconductor Inc 6トランジスタデュアルポートsramセル
JP2007059044A (ja) * 2005-07-29 2007-03-08 Semiconductor Energy Lab Co Ltd 半導体装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
JPN6012065661; 内田建,古賀淳二: '0.7nmの極薄膜SOIトランジスタ技術' 東芝レビュー 61巻2号, 20060201, 第11-14頁, 株式会社東芝技術企画室 *
JPN6012065662; 若林整: '20-nm級MOSトランジスタ技術' BREAK THROUGH No.185, 20011210, 第8-11頁, サイペック株式会社 リアライズ事業部門 *

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015222612A (ja) * 2005-07-29 2015-12-10 株式会社半導体エネルギー研究所 半導体装置
JP2013211001A (ja) * 2012-03-01 2013-10-10 Semiconductor Energy Lab Co Ltd 半導体装置
US9043561B2 (en) 2012-05-02 2015-05-26 Semiconductor Energy Laboratory Co., Ltd. Storage device

Also Published As

Publication number Publication date
US8259487B2 (en) 2012-09-04
EP2020658A3 (en) 2009-08-19
US7929332B2 (en) 2011-04-19
EP2020658B1 (en) 2014-06-18
US20110188296A1 (en) 2011-08-04
EP2020658A2 (en) 2009-02-04
US20090003051A1 (en) 2009-01-01

Similar Documents

Publication Publication Date Title
US7929332B2 (en) Semiconductor memory device and semiconductor device
JP6170102B2 (ja) 半導体装置
US7596024B2 (en) Nonvolatile memory
JP3768504B2 (ja) 不揮発性フリップフロップ
KR100977339B1 (ko) 반도체 장치
TWI325613B (en) Memory cell and fabricating method thereof
US7436731B2 (en) Semiconductor device and method for driving the same
JP4954626B2 (ja) 半導体装置
JP2007059044A (ja) 半導体装置
JP5305620B2 (ja) 不揮発性メモリ
JP2005303111A (ja) 半導体記憶装置
JP5648460B2 (ja) 記憶装置、集積回路装置、及び電子機器
TW202533661A (zh) 多平面靜態隨機存取記憶體
TW200901389A (en) Tungsten digitlines
JP2003272376A (ja) 強誘電体メモリ
JPH0766301A (ja) 半導体素子とその半導体素子を用いたメモリセル及び半導体記憶装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110531

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110531

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20121205

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20121218

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130121

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20130409

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20130624